\n\tOxford Instruments, England, announces that it has signed an agreement with one of the largest semiconductor companies in Europe to supply multiple failure analysis systems. The PlasmaPro 80 ICP 65 systems, which provide front and back end removal processes, are to be installed at its manufacturing sites globally over a period of two years. <\/p>\n
\n\tApplications are for isotropic\/anisotropic back-etching, including processes for polyimide and passivation, IMD\/ILD materials, and low-k Oxide. Other processes include poly-Si etching, removal of thin active silicon layers, selectivity control for the removal of SiO2\/SiNx spacers, and silicon-backside removal\/thinning. All are incorporated into one compact tool, in addition to comprehensive global service and support.<\/p>\n
\n\tThe first system orders have already been placed for two PlasmaPro 80 ICP 65 systems, for sites in Europe and Asia. These systems, for single dies or chips, and wafers up to 200mm, offer high-density plasma sources and ultralow plasma damage.<\/p>\n
\n\tThe company needed high-specification equipment for FA to replace their existing long-running installed base, consisting mainly of Oxford Instruments systems. After a stringent selection process, they decided once again to choose Oxford Instruments.<\/p>\n
\n\t“This agreement with such a prominent semiconductor company for multiple FA tools is significant for Oxford Instruments, as it demonstrates this important customer’s continued confidence in our leading edge processes and systems,” says Dr. David Haynes, Sales and Marketing Director at Oxford Instruments Plasma Technology. “Our flexible FA tools enable a wide range of processes, from passivation removal to anisotropic oxide removal, from small die or packaged device, through to 300 mm wafers. Both before and during installation, our team of highly experienced FA application engineers will work with our customer to ensure the processes they require are running on their Oxford Instruments machines, to allow maximum usage.”<\/p>\n