{"id":4363,"date":"2015-01-03T20:15:40","date_gmt":"2015-01-03T20:15:40","guid":{"rendered":"https:\/\/staging.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/23431720\/NEWS\/"},"modified":"2023-02-07T04:53:20","modified_gmt":"2023-02-07T04:53:20","slug":"ultra-tec-adds-improved-optics-to-asap-1-ips-for-accurate-tool-positioning","status":"publish","type":"post","link":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/23396573\/NEWS\/","title":{"rendered":"Ultra Tec adds improved optics to ASAP-1 IPS for accurate tool positioning"},"content":{"rendered":"<p>\n\tUltra Tec Mfg. Inc., Santa Ana, Calif., announces that an improved machine-vision camera is now shipping with its ASAP-1 IPS units. ASAP-1 IPS is a digital sample prep system for the decapsulation, thinning, and polishing of packaged wafer-level devices. A new Electronic Video Magnifier and additional magnifying lens options make possible further milling and polishing improvements. &nbsp;The image shows the new (left) vs. old sample monitoring screen.<\/p>\n<p>\n\tAccording to Tim Hazeldine, VP of Sales &amp; Marketing, &nbsp;&#8220;Realtime monitoring is one of the unique benefits of the ASAP-1 IPS system and the improved optics and magnification options further compound this key user advantage. The improved optics allow for more accurate tool positioning and assist the user to identify the quality of surfaces produced. &nbsp;Backside preparation of small dies and multi-stack die removal are just two applications that benefit from these realtime imaging improvements.&#8221;<\/p>\n<p>\n\tIPS Touch Screen OS has been designed from the ground up to control all aspects of the sample prep process. Advanced programming drives its deep submicron axes of motion.&nbsp; The OS contains conveniently laid out screens for the various key setup functions, such as timer, tool type, pressure monitoring, etc.<\/p>\n<p>\n\tThe touchoff tool control provides Z-position at pre-defined locations and pressures. This enables package and die tilt to be corrected quickly and accurately. &#8220;Tool height variations are automatically calibrated.<\/p>\n<p>\n\t<a href=\"http:\/\/www.ultratecusa.com\/\">www.ultratecusa.com<\/a><\/p>\n<p>\n\t&nbsp;<\/p>\n","protected":false},"excerpt":{"rendered":"<p>Ultra Tec Mfg. Inc., Santa Ana, Calif., announces that an improved machine-vision camera is now shipping with its ASAP-1 IPS units.<\/p>\n","protected":false},"author":63082,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[434,450,435,436,1],"tags":[],"class_list":["post-4363","post","type-post","status-publish","format-standard","hentry","category-electronics","category-general","category-news","category-news-articles","category-uncategorized"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.9 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>Ultra Tec adds improved optics to ASAP-1 IPS for accurate tool positioning - Electronic Device Failure Analysis Society<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/23396573\/NEWS\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Ultra Tec adds improved optics to ASAP-1 IPS for accurate tool positioning - Electronic Device Failure Analysis Society\" \/>\n<meta property=\"og:description\" content=\"Ultra Tec Mfg. 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