{"id":4366,"date":"2015-01-17T21:34:43","date_gmt":"2015-01-17T21:34:43","guid":{"rendered":"https:\/\/staging.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/23431590\/NEWS\/"},"modified":"2023-02-07T04:53:21","modified_gmt":"2023-02-07T04:53:21","slug":"esi-laser-drilling-tool-designed-for-semiconductor-substrate-fabrication","status":"publish","type":"post","link":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/23431590\/NEWS\/","title":{"rendered":"ESI laser drilling tool designed for semiconductor substrate fabrication"},"content":{"rendered":"<p>\n\tElectro Scientific Industries Inc., Portland, Ore., introduces the CornerStone ICP Series 1 UV laser drilling system designed initially for integrated circuit packaging applications. Compared with typical laser drill tools, this new platform offers lower overall cost of ownership and improved accuracy with a reduced footprint, enabling production of vias for current and next-generation products.<\/p>\n<p>\n\tLaser systems are widely employed for drilling vias in organic substrate material used for ICPs, and are typically used for vias less than 100 ?m in diameter. The CornerStone ICP Series 1 system meets today&#8217;s production demands and enables packaging manufacturers to meet design requirements for even smaller vias and higher accuracy required in the future.<\/p>\n<p>\n\t&#8220;With this introduction, we are addressing existing design requirements while providing significantly lower cost of ownership in an industry-leading small footprint,&#8221; said Dr. Michael Darwin, Vice President and General Manager, ESI. &#8220;We are excited about the CoO advantage we can offer our customers and look forward to providing a complete and cost-effective solution to the via drilling market.&#8221;<\/p>\n<p>\n\tIn addition to the UV laser source, the CornerStone ICP Series 1 system incorporates ESI&#8217;s patented Third Dynamics technology (announced in March of 2013) in a multi-beam format. This technology provides per-beam drill rates that significantly outperform the typical high volume manufacturing (HVM) laser drill systems in operation today. The resulting productivity leads the industry and in turn significantly lowers customers&#8217; cost of ownership.<\/p>\n<p>\n\tAs next-generation substrates push the requirements for line\/space and signal routing, the target pad and via diameters will decrease. This will also require a corresponding improvement in via placement accuracy. In its standard configuration, the CornerStone ICP Series 1 offers industry-leading via placement accuracy, and can be extended for even smaller and denser via requirements in the future.<\/p>\n<p>\n\t<a href=\"http:\/\/www.esi.com\/\">www.esi.com<\/a><\/p>\n<p>\n\t&nbsp;<\/p>\n","protected":false},"excerpt":{"rendered":"<p>Electro Scientific Industries Inc., Portland, Ore., introduces the CornerStone ICP Series 1 UV laser drilling system designed initially for integrated circuit packaging applications.<\/p>\n","protected":false},"author":63082,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[434,450,435,436,1],"tags":[],"class_list":["post-4366","post","type-post","status-publish","format-standard","hentry","category-electronics","category-general","category-news","category-news-articles","category-uncategorized"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.9 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>ESI laser drilling tool designed for semiconductor substrate fabrication - Electronic Device Failure Analysis Society<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/23431590\/NEWS\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"ESI laser drilling tool designed for semiconductor substrate fabrication - Electronic Device Failure Analysis Society\" \/>\n<meta property=\"og:description\" content=\"Electro Scientific Industries Inc., Portland, Ore., introduces the CornerStone ICP Series 1 UV laser drilling system designed initially for integrated circuit packaging applications.\" \/>\n<meta property=\"og:url\" content=\"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/23431590\/NEWS\/\" \/>\n<meta property=\"og:site_name\" content=\"Electronic Device Failure Analysis Society\" \/>\n<meta property=\"article:published_time\" content=\"2015-01-17T21:34:43+00:00\" \/>\n<meta property=\"article:modified_time\" content=\"2023-02-07T04:53:21+00:00\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" content=\"Written by\" \/>\n\t<meta name=\"twitter:data1\" content=\"\" \/>\n\t<meta name=\"twitter:label2\" content=\"Est. reading time\" \/>\n\t<meta name=\"twitter:data2\" content=\"1 minute\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\\\/\\\/schema.org\",\"@graph\":[{\"@type\":\"Article\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/results\\\/-\\\/journal_content\\\/56\\\/10192\\\/23431590\\\/NEWS\\\/#article\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/results\\\/-\\\/journal_content\\\/56\\\/10192\\\/23431590\\\/NEWS\\\/\"},\"author\":{\"name\":\"\",\"@id\":\"\"},\"headline\":\"ESI laser drilling tool designed for semiconductor substrate fabrication\",\"datePublished\":\"2015-01-17T21:34:43+00:00\",\"dateModified\":\"2023-02-07T04:53:21+00:00\",\"mainEntityOfPage\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/results\\\/-\\\/journal_content\\\/56\\\/10192\\\/23431590\\\/NEWS\\\/\"},\"wordCount\":300,\"publisher\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#organization\"},\"articleSection\":[\"Electronics\",\"general\",\"news\",\"News Articles\"],\"inLanguage\":\"en-US\"},{\"@type\":\"WebPage\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/results\\\/-\\\/journal_content\\\/56\\\/10192\\\/23431590\\\/NEWS\\\/\",\"url\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/results\\\/-\\\/journal_content\\\/56\\\/10192\\\/23431590\\\/NEWS\\\/\",\"name\":\"ESI laser drilling tool designed for semiconductor substrate fabrication - 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Electronic Device Failure Analysis Society","robots":{"index":"index","follow":"follow","max-snippet":"max-snippet:-1","max-image-preview":"max-image-preview:large","max-video-preview":"max-video-preview:-1"},"canonical":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/23431590\/NEWS\/","og_locale":"en_US","og_type":"article","og_title":"ESI laser drilling tool designed for semiconductor substrate fabrication - Electronic Device Failure Analysis Society","og_description":"Electro Scientific Industries Inc., Portland, Ore., introduces the CornerStone ICP Series 1 UV laser drilling system designed initially for integrated circuit packaging applications.","og_url":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/23431590\/NEWS\/","og_site_name":"Electronic Device Failure Analysis Society","article_published_time":"2015-01-17T21:34:43+00:00","article_modified_time":"2023-02-07T04:53:21+00:00","twitter_card":"summary_large_image","twitter_misc":{"Written by":"","Est. reading time":"1 minute"},"schema":{"@context":"https:\/\/schema.org","@graph":[{"@type":"Article","@id":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/23431590\/NEWS\/#article","isPartOf":{"@id":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/23431590\/NEWS\/"},"author":{"name":"","@id":""},"headline":"ESI laser drilling tool designed for semiconductor substrate fabrication","datePublished":"2015-01-17T21:34:43+00:00","dateModified":"2023-02-07T04:53:21+00:00","mainEntityOfPage":{"@id":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/23431590\/NEWS\/"},"wordCount":300,"publisher":{"@id":"https:\/\/www.asminternational.org\/edfas\/#organization"},"articleSection":["Electronics","general","news","News Articles"],"inLanguage":"en-US"},{"@type":"WebPage","@id":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/23431590\/NEWS\/","url":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/23431590\/NEWS\/","name":"ESI laser drilling tool designed for semiconductor substrate fabrication - Electronic Device Failure Analysis Society","isPartOf":{"@id":"https:\/\/www.asminternational.org\/edfas\/#website"},"datePublished":"2015-01-17T21:34:43+00:00","dateModified":"2023-02-07T04:53:21+00:00","breadcrumb":{"@id":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/23431590\/NEWS\/#breadcrumb"},"inLanguage":"en-US","potentialAction":[{"@type":"ReadAction","target":["https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/23431590\/NEWS\/"]}]},{"@type":"BreadcrumbList","@id":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/23431590\/NEWS\/#breadcrumb","itemListElement":[{"@type":"ListItem","position":1,"name":"Home","item":"https:\/\/www.asminternational.org\/edfas\/"},{"@type":"ListItem","position":2,"name":"ESI laser drilling tool designed for semiconductor substrate fabrication"}]},{"@type":"WebSite","@id":"https:\/\/www.asminternational.org\/edfas\/#website","url":"https:\/\/www.asminternational.org\/edfas\/","name":"Electronic Device Failure Analysis Society","description":"Electronic Device Failure Analysis Society","publisher":{"@id":"https:\/\/www.asminternational.org\/edfas\/#organization"},"potentialAction":[{"@type":"SearchAction","target":{"@type":"EntryPoint","urlTemplate":"https:\/\/www.asminternational.org\/edfas\/?s={search_term_string}"},"query-input":{"@type":"PropertyValueSpecification","valueRequired":true,"valueName":"search_term_string"}}],"inLanguage":"en-US"},{"@type":"Organization","@id":"https:\/\/www.asminternational.org\/edfas\/#organization","name":"Electronic Device Failure Analysis Society","url":"https:\/\/www.asminternational.org\/edfas\/","logo":{"@type":"ImageObject","inLanguage":"en-US","@id":"https:\/\/www.asminternational.org\/edfas\/#\/schema\/logo\/image\/","url":"https:\/\/cdn-prd-main.asm-media.cloud\/uploads\/sites\/41\/2022\/10\/layout_set_logo.png","contentUrl":"https:\/\/cdn-prd-main.asm-media.cloud\/uploads\/sites\/41\/2022\/10\/layout_set_logo.png","width":360,"height":95,"caption":"Electronic Device Failure Analysis Society"},"image":{"@id":"https:\/\/www.asminternational.org\/edfas\/#\/schema\/logo\/image\/"}},{"@type":"Person","@id":"","url":"https:\/\/www.asminternational.org\/edfas\/author\/"}]}},"acf":[],"_links":{"self":[{"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/posts\/4366","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/users\/63082"}],"replies":[{"embeddable":true,"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/comments?post=4366"}],"version-history":[{"count":0,"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/posts\/4366\/revisions"}],"wp:attachment":[{"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/media?parent=4366"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/categories?post=4366"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/tags?post=4366"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}