\n\tGlobal Foundries, Santa Clara, Calif., introduces an optimized semiconductor manufacturing platform aimed specifically at meeting the stringent and evolving needs of the automotive industry. The platform is built on the company’s 55-nanometer low-power process and is AEC-Q100 Group D qualified. The solution includes a comprehensive set of technology and design enablement capabilities tailored to improve the efficiency, performance, and power consumption of automotive ICs.<\/p>\n
\n\tThe automotive platform is a comprehensive solution consisting of the necessary design tool support, IP, technology, and services to leverage Global Foundries 55nm low power process. It allows customers to quickly migrate their automotive microcontrollers, ASSPs, and ASICs to a more advanced technology, leveraging the significant area, performance, and power benefits of the process. The platform supports the implementation of non-volatile memory (NVM) in MCUs and SoC designs, as well as best-in-class SST-based embedded flash technology of automotive grade with an endurance of 100K erase\/program cycles or higher, and data retention of more than 20 years.<\/p>\n
\n\tThe platform’s complete design enablement support through certified models and design rules, PDKs and EDA tools support streamline the automotive IC design process. Its automotive-specific flow includes defect detection, defect reduction and outlier controls to provide significant improvement in quality and reliability. Robust design-for-manufacturing (DFM) support for automotive builds in quality and yield at the design stage.<\/p>\n
\n\tThe automotive platform supports the use of ARM core technology with a variety of standard cell and compilers, as well as IP blocks for GPIO, interface, and oscillator functions.<\/p>\n
\n\tThe platform is backed by an automotive services package to meet automotive grade quality and reliability requirements. The services offering includes 15 years record retention, a continuous improvement program with the aim to achieve “Zero Defects”, and comprehensive failure analysis and 8D problem resolution.<\/p>\n