{"id":4468,"date":"2014-05-19T03:07:46","date_gmt":"2014-05-19T03:07:46","guid":{"rendered":"https:\/\/staging.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/18967926\/NEWS\/"},"modified":"2023-02-07T04:53:28","modified_gmt":"2023-02-07T04:53:28","slug":"coater-developer-system-designed-for-fan-out-wafer-level-packaging","status":"publish","type":"post","link":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/18967926\/NEWS\/","title":{"rendered":"Coater\/Developer system designed for fan-out wafer-level packaging"},"content":{"rendered":"<p>\n\tSuss MicroTec, Germany, recently introduced a coater\/developer tool especially developed to process wafers for fan-out wafer-level packaging applications. Based on industry proven ACS300-technology, it is a modular cluster system designed to meet the need for clean, reliable, and high-throughput photolithography applications.<\/p>\n<p>\n\tWith this coater\/developer system, artificially created wafers, which can be larger than 300 mm, can be processed. On embedding chips on an artificial wafer, a certain space has to be ensured between the individual dice, for instance to allow for Fan-Out redistribution layers (RDL). This enables the formation of nearly as many micro-bumps per microchip as wanted, regardless of the size of the single chip. It is an enhancement of the standard packaging solutions for highly integrated microchips.<\/p>\n<p>\n\t&#8220;We have developed new solutions and processes for cost efficient and high throughput applications for Fan-Out Wafer-Level Packaging,&#8221; says Frank P. Averdung, President and CEO of SUSS MicroTec. &#8220;Our tailor-made solutions allow customers to move beyond standard processes and applications to drive the technological development in the semiconductor industry further.&#8221;<span style=\"font-family: Helvetica, Arial, sans-serif; font-size: 0.9375em; line-height: 1.333333333em;\">&nbsp; &nbsp; &nbsp; &nbsp; &nbsp; &nbsp; &nbsp; &nbsp; &nbsp; &nbsp; &nbsp; &nbsp; &nbsp; &nbsp; &nbsp;<\/span><\/p>\n<p>\n\t<a href=\"http:\/\/www.suss.com\/\">www.suss.com<\/a><\/p>\n<p>\n\t&nbsp;<\/p>\n","protected":false},"excerpt":{"rendered":"<p>Suss MicroTec, Germany, recently introduced a coater\/developer tool especially developed to process wafers for fan-out wafer-level packaging applications.<\/p>\n","protected":false},"author":63082,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[434,450,435,436,1],"tags":[],"class_list":["post-4468","post","type-post","status-publish","format-standard","hentry","category-electronics","category-general","category-news","category-news-articles","category-uncategorized"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.9 - 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