{"id":4484,"date":"2014-03-24T13:42:16","date_gmt":"2014-03-24T13:42:16","guid":{"rendered":"https:\/\/staging.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/17942644\/NEWS\/"},"modified":"2023-02-07T04:53:30","modified_gmt":"2023-02-07T04:53:30","slug":"directed-self-assembly-developed-to-advance-semiconductor-manufacturing","status":"publish","type":"post","link":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/17942644\/NEWS\/","title":{"rendered":"Directed self-assembly developed to advance semiconductor manufacturing"},"content":{"rendered":"<p>\n\tSemiconductor Research Corporation (SRC), Research Triangle Park, N.C., announces that researchers it sponsors at the Massachusetts Institute of Technology have introduced new directed self-assembly (DSA) techniques that promise to help semiconductor manufacturers develop more advanced and less expensive components. The MIT research focuses on the issue of next-generation lithography in the semiconductor manufacturing process.<\/p>\n<p>\n\tPhotolithography at a 193 nanometer (nm) wavelength is currently used for semiconductor device manufacturing, but that is reaching its limit with feature sizes around 25 nm. Electron-beam lithography can produce smaller features and is used for mask making, one of the critical steps in semiconductor manufacturing. However, the throughput of electron-beam lithography is currently insufficient for sub-20 nm resolution patterning over large areas.<\/p>\n<p>\n\tThe MIT study demonstrates that complex patterns of lines, bends and junctions with feature sizes below 20 nm can be made by block copolymer self-assembly guided by a greatly simplified template. This study explained how to design the template to achieve a desired pattern. Electron-beam lithography was used to produce the template serially, while the block copolymer filled in the rest of the pattern in a parallel process. This hybrid process can be five or more times faster than writing the entire pattern by electron beam lithography.<\/p>\n<p>\n\tThe MIT study developed a simple way to design a template to achieve a specific block copolymer pattern over a large area. Although electron-beam lithography defines the template, other methods such as photolithography with trimming could be used to produce the templates.<\/p>\n<p>\n\t<a href=\"http:\/\/www.src.org\">www.src.org<\/a><\/p>\n<p>\n\t&nbsp;<\/p>\n","protected":false},"excerpt":{"rendered":"<p>Semiconductor Research Corporation (SRC), Research Triangle Park, N.C., announces that researchers it sponsors at the Massachusetts Institute of Technology have introduced new directed self-assembly (DSA) techniques that promise to help semiconductor manufacturers develop more advanced and less expensive components.<\/p>\n","protected":false},"author":63082,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[434,450,435,436,1],"tags":[],"class_list":["post-4484","post","type-post","status-publish","format-standard","hentry","category-electronics","category-general","category-news","category-news-articles","category-uncategorized"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.9 - 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