{"id":4507,"date":"2014-01-21T20:53:34","date_gmt":"2014-01-21T20:53:34","guid":{"rendered":"https:\/\/staging.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/16979142\/NEWS\/"},"modified":"2023-02-07T04:53:32","modified_gmt":"2023-02-07T04:53:32","slug":"cadence-incisive-13-2-verification-platform-enables-faster-performance","status":"publish","type":"post","link":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/16979142\/NEWS\/","title":{"rendered":"Cadence Incisive 13.2 verification platform enables faster performance"},"content":{"rendered":"<p>\n\t<span style=\"font-size:14px;\">Cadence Design Systems Inc., San Jose, Calif., introduces a faster version of the Incisive functional verification platform.&nbsp; Addressing both intellectual property (IP) block-to-chip and system-on-chip (SoC) verification challenges, the Incisive 13.2 platform offers orders of magnitude faster performance with two new engines and additional automation features to speed SoC verification closure.<\/span><\/p>\n<p>\n\t<span style=\"font-size:14px;\"><span style=\"font-family: Helvetica, Arial, sans-serif; line-height: 1.333333333em;\">For IP block-to-chip verification, enhancements include:&nbsp;<\/span><\/span><\/p>\n<ul>\n<li>\n<p>\n\t\t\t<span style=\"font-size:14px;\">&nbsp;&nbsp;<b>&#8212;<\/b>New Trident engine in the Incisive Formal Verifier and the Incisive Enterprise Verifier, which improves formal analysis performance up to 20X;<\/span><\/p>\n<\/li>\n<li>\n<p>\n\t\t\t<span style=\"font-size:14px;\">&nbsp;<\/span>&nbsp;&#8211;New constraint engine in the Incisive Enterprise Simulator that speeds UVM and SystemVerilog testbench simulation, and simulation acceleration with the Palladium platform by up to 10X;<\/p>\n<\/li>\n<\/ul>\n<p>\n\t<span style=\"font-size:14px;\">&nbsp; &#8212;<span style=\"font-family: Helvetica, Arial, sans-serif; line-height: 1.333333333em;\">New SystemVerilog support in Incisive Debug Analyzer plus unique UVM debug capabilities and optimized probing in the SimVision debug environment inside Incisive Enterprise Simulator that reduces database size up to 10X;&nbsp;<\/span><span style=\"font-family: Helvetica, Arial, sans-serif; line-height: 1.333333333em;\">&nbsp;<\/span><\/span><\/p>\n<p>\n\t<span style=\"font-size:14px;\"><span style=\"font-family: Helvetica, Arial, sans-serif; line-height: 1.333333333em;\">&#8211;New IEEE 1647 e unit testing without simulation, reducing debug time for testbench code by 30%<\/span><\/span><\/p>\n<p>\n\t<span style=\"font-size:14px;\"><span style=\"font-family: Helvetica, Arial, sans-serif; line-height: 1.333333333em;\">For SoC verification, enhancements include:<\/span><\/span><\/p>\n<p>\n\t&nbsp;&#8211;Comprehensive x-propagation support in the Incisive Enterprise Simulator and the Incisive Enterprise Verifier to speed SoC reset and low-power simulations up to 5X;<\/p>\n<p>\n\t&nbsp; &#8211;New support for SystemVerilog IEEE 1800-2012 real number modeling in the Incisive Digital Mixed Signal option for faster mixed-signal simulation over 100X.<\/p>\n<p>\n\t<a href=\"http:\/\/www.cadence.com\/cadence\/newsroom\/press_releases\/Pages\/pr.aspx?xml=011314_Incisive_13_2&amp;CMP=home\">http:\/\/www.cadence.com\/cadence\/newsroom\/press_releases\/Pages\/pr.aspx?xml=011314_Incisive_13_2&amp;CMP=home<\/a><\/p>\n","protected":false},"excerpt":{"rendered":"<p>Cadence Design Systems, Inc., San Jose, Calif., introduces a faster version of the Incisive functional verification platform.<\/p>\n","protected":false},"author":63082,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[434,450,441,437,438,435,436,1],"tags":[],"class_list":["post-4507","post","type-post","status-publish","format-standard","hentry","category-electronics","category-general","category-materials-properties-and-performance","category-materials-testing-and-evaluation","category-nanotechnology","category-news","category-news-articles","category-uncategorized"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.9 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>Cadence Incisive 13.2 verification platform enables faster performance - Electronic Device Failure Analysis Society<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/16979142\/NEWS\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Cadence Incisive 13.2 verification platform enables faster performance - Electronic Device Failure Analysis Society\" \/>\n<meta property=\"og:description\" content=\"Cadence Design Systems, Inc., San Jose, Calif., introduces a faster version of the Incisive functional verification platform.\" \/>\n<meta property=\"og:url\" content=\"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/16979142\/NEWS\/\" \/>\n<meta property=\"og:site_name\" content=\"Electronic Device Failure Analysis Society\" \/>\n<meta property=\"article:published_time\" content=\"2014-01-21T20:53:34+00:00\" \/>\n<meta property=\"article:modified_time\" content=\"2023-02-07T04:53:32+00:00\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" content=\"Written by\" \/>\n\t<meta name=\"twitter:data1\" content=\"\" \/>\n\t<meta name=\"twitter:label2\" content=\"Est. reading time\" \/>\n\t<meta name=\"twitter:data2\" content=\"1 minute\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\\\/\\\/schema.org\",\"@graph\":[{\"@type\":\"Article\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/results\\\/-\\\/journal_content\\\/56\\\/10192\\\/16979142\\\/NEWS\\\/#article\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/results\\\/-\\\/journal_content\\\/56\\\/10192\\\/16979142\\\/NEWS\\\/\"},\"author\":{\"name\":\"\",\"@id\":\"\"},\"headline\":\"Cadence Incisive 13.2 verification platform enables faster performance\",\"datePublished\":\"2014-01-21T20:53:34+00:00\",\"dateModified\":\"2023-02-07T04:53:32+00:00\",\"mainEntityOfPage\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/results\\\/-\\\/journal_content\\\/56\\\/10192\\\/16979142\\\/NEWS\\\/\"},\"wordCount\":232,\"publisher\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#organization\"},\"articleSection\":[\"Electronics\",\"general\",\"Materials Properties and Performance\",\"Materials Testing and Evaluation\",\"Nanotechnology\",\"news\",\"News Articles\"],\"inLanguage\":\"en-US\"},{\"@type\":\"WebPage\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/results\\\/-\\\/journal_content\\\/56\\\/10192\\\/16979142\\\/NEWS\\\/\",\"url\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/results\\\/-\\\/journal_content\\\/56\\\/10192\\\/16979142\\\/NEWS\\\/\",\"name\":\"Cadence Incisive 13.2 verification platform enables faster performance - 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Electronic Device Failure Analysis Society","robots":{"index":"index","follow":"follow","max-snippet":"max-snippet:-1","max-image-preview":"max-image-preview:large","max-video-preview":"max-video-preview:-1"},"canonical":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/16979142\/NEWS\/","og_locale":"en_US","og_type":"article","og_title":"Cadence Incisive 13.2 verification platform enables faster performance - Electronic Device Failure Analysis Society","og_description":"Cadence Design Systems, Inc., San Jose, Calif., introduces a faster version of the Incisive functional verification platform.","og_url":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/16979142\/NEWS\/","og_site_name":"Electronic Device Failure Analysis Society","article_published_time":"2014-01-21T20:53:34+00:00","article_modified_time":"2023-02-07T04:53:32+00:00","twitter_card":"summary_large_image","twitter_misc":{"Written by":"","Est. reading time":"1 minute"},"schema":{"@context":"https:\/\/schema.org","@graph":[{"@type":"Article","@id":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/16979142\/NEWS\/#article","isPartOf":{"@id":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/16979142\/NEWS\/"},"author":{"name":"","@id":""},"headline":"Cadence Incisive 13.2 verification platform enables faster performance","datePublished":"2014-01-21T20:53:34+00:00","dateModified":"2023-02-07T04:53:32+00:00","mainEntityOfPage":{"@id":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/16979142\/NEWS\/"},"wordCount":232,"publisher":{"@id":"https:\/\/www.asminternational.org\/edfas\/#organization"},"articleSection":["Electronics","general","Materials Properties and Performance","Materials Testing and Evaluation","Nanotechnology","news","News Articles"],"inLanguage":"en-US"},{"@type":"WebPage","@id":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/16979142\/NEWS\/","url":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/16979142\/NEWS\/","name":"Cadence Incisive 13.2 verification platform enables faster performance - Electronic Device Failure Analysis Society","isPartOf":{"@id":"https:\/\/www.asminternational.org\/edfas\/#website"},"datePublished":"2014-01-21T20:53:34+00:00","dateModified":"2023-02-07T04:53:32+00:00","breadcrumb":{"@id":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/16979142\/NEWS\/#breadcrumb"},"inLanguage":"en-US","potentialAction":[{"@type":"ReadAction","target":["https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/16979142\/NEWS\/"]}]},{"@type":"BreadcrumbList","@id":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/16979142\/NEWS\/#breadcrumb","itemListElement":[{"@type":"ListItem","position":1,"name":"Home","item":"https:\/\/www.asminternational.org\/edfas\/"},{"@type":"ListItem","position":2,"name":"Cadence Incisive 13.2 verification platform enables faster performance"}]},{"@type":"WebSite","@id":"https:\/\/www.asminternational.org\/edfas\/#website","url":"https:\/\/www.asminternational.org\/edfas\/","name":"Electronic Device Failure Analysis Society","description":"Electronic Device Failure Analysis Society","publisher":{"@id":"https:\/\/www.asminternational.org\/edfas\/#organization"},"potentialAction":[{"@type":"SearchAction","target":{"@type":"EntryPoint","urlTemplate":"https:\/\/www.asminternational.org\/edfas\/?s={search_term_string}"},"query-input":{"@type":"PropertyValueSpecification","valueRequired":true,"valueName":"search_term_string"}}],"inLanguage":"en-US"},{"@type":"Organization","@id":"https:\/\/www.asminternational.org\/edfas\/#organization","name":"Electronic Device Failure Analysis Society","url":"https:\/\/www.asminternational.org\/edfas\/","logo":{"@type":"ImageObject","inLanguage":"en-US","@id":"https:\/\/www.asminternational.org\/edfas\/#\/schema\/logo\/image\/","url":"https:\/\/cdn-prd-main.asm-media.cloud\/uploads\/sites\/41\/2022\/10\/layout_set_logo.png","contentUrl":"https:\/\/cdn-prd-main.asm-media.cloud\/uploads\/sites\/41\/2022\/10\/layout_set_logo.png","width":360,"height":95,"caption":"Electronic Device Failure Analysis Society"},"image":{"@id":"https:\/\/www.asminternational.org\/edfas\/#\/schema\/logo\/image\/"}},{"@type":"Person","@id":"","url":"https:\/\/www.asminternational.org\/edfas\/author\/"}]}},"acf":[],"_links":{"self":[{"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/posts\/4507","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/users\/63082"}],"replies":[{"embeddable":true,"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/comments?post=4507"}],"version-history":[{"count":0,"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/posts\/4507\/revisions"}],"wp:attachment":[{"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/media?parent=4507"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/categories?post=4507"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/tags?post=4507"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}