{"id":4794,"date":"2021-10-22T15:32:16","date_gmt":"2021-10-22T15:32:16","guid":{"rendered":"https:\/\/staging.asminternational.org\/edfas\/tescan-installs-first-new-unitom-hr-dynamic-micro-ct-system-at-catholic-university-of-leuven\/"},"modified":"2023-02-23T21:21:14","modified_gmt":"2023-02-23T21:21:14","slug":"tescan-installs-first-new-unitom-hr-dynamic-micro-ct-system-at-catholic-university-of-leuven","status":"publish","type":"post","link":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/46004459\/NEWS\/","title":{"rendered":"Tescan installs first new UniTOM HR Dynamic Micro-CT System at Catholic University of Leuven"},"content":{"rendered":"<p>Tescan Orsay Holdings a.s., Czech Republic, announced the first installation of its new UniTOM HR dynamic micro-CT system at the KU Leuven XCT Core Facility, Belgium. Launched in August 2021, UniTOM HR is the first dynamic micro-CT system to offer sub-micron resolution 3D nondestructive imaging and high temporal resolution for uninterrupted 4D dynamic CT experiments.<\/p>\n<p>KU Leuven provides education, research, and services to industry in the fields of materials engineering and biomedical sciences. They will use the new dynamic CT systems from Tescan to study how materials change over time in response to applied loads, looking at such changes in material microstructures as sudden cracks in composite materials, like in masonry stones. When compressed, such as in a building, they can see how the cracks develop over time and what leads to the failure of the masonry structure. They can change the design of the composite material in order to stop the crack from developing in the first place\u2015leading to new and improved building materials that are more damage tolerant and tougher.<\/p>\n<p>They will also use the UniTOM HR systems during flow processes, the shrinkage and swelling of samples and inflation of biomedical tissues, and in many other research areas where sub-micron resolution is needed to reveal small changes.<\/p>\n<p>UniTOM HR is ideal for both industrial and academic researchers that need micron and sub-micron CT imaging to visualize a sample\u2019s internal structure and also want to gain a deeper understanding of a sample\u2019s behavior under certain environmental conditions.<\/p>\n<p>&nbsp;<\/p>\n<p>Image &#8211; <em>Lab-based dynamic-CT is new and a huge step forward in the world of computed tomography<\/em><\/p>\n<p>&nbsp;<\/p>\n<p>For more information:<\/p>\n<p>KU Leuven XCT core facility<br \/>\n<a href=\"https:\/\/kuleuven.xct.be\/\" target=\"_blank\" rel=\"noopener\">https:\/\/kuleuven.xct.be\/<\/a><\/p>\n<p>Tescan ORSAY HOLDING<br \/>\n<a href=\"https:\/\/www.tecscan.ca\/\" target=\"_blank\" rel=\"noopener\">https:\/\/www.tecscan.ca\/<\/a><\/p>\n<p>&nbsp;<\/p>\n","protected":false},"excerpt":{"rendered":"<p>Tescan Orsay Holdings a.s., Czech Republic, announced the first installation of its new UniTOM HR dynamic micro-CT system at the KU Leuven XCT Core Facility, Belgium.<\/p>\n","protected":false},"author":63103,"featured_media":0,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[437,435,436,1],"tags":[],"class_list":["post-4794","post","type-post","status-publish","format-standard","hentry","category-materials-testing-and-evaluation","category-news","category-news-articles","category-uncategorized"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.9 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>Tescan installs first new UniTOM HR Dynamic Micro-CT System at Catholic University of Leuven - Electronic Device Failure Analysis Society<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/46004459\/NEWS\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Tescan installs first new UniTOM HR Dynamic Micro-CT System at Catholic University of Leuven - Electronic Device Failure Analysis Society\" \/>\n<meta property=\"og:description\" content=\"Tescan Orsay Holdings a.s., Czech Republic, announced the first installation of its new UniTOM HR dynamic micro-CT system at the KU Leuven XCT Core Facility, Belgium.\" \/>\n<meta property=\"og:url\" content=\"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/46004459\/NEWS\/\" \/>\n<meta property=\"og:site_name\" content=\"Electronic Device Failure Analysis Society\" \/>\n<meta property=\"article:published_time\" content=\"2021-10-22T15:32:16+00:00\" \/>\n<meta property=\"article:modified_time\" content=\"2023-02-23T21:21:14+00:00\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" content=\"Written by\" \/>\n\t<meta name=\"twitter:data1\" content=\"\" \/>\n\t<meta name=\"twitter:label2\" content=\"Est. reading time\" \/>\n\t<meta name=\"twitter:data2\" content=\"1 minute\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\\\/\\\/schema.org\",\"@graph\":[{\"@type\":\"Article\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/results\\\/-\\\/journal_content\\\/56\\\/10192\\\/46004459\\\/NEWS\\\/#article\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/results\\\/-\\\/journal_content\\\/56\\\/10192\\\/46004459\\\/NEWS\\\/\"},\"author\":{\"name\":\"\",\"@id\":\"\"},\"headline\":\"Tescan installs first new UniTOM HR Dynamic Micro-CT System at Catholic University of Leuven\",\"datePublished\":\"2021-10-22T15:32:16+00:00\",\"dateModified\":\"2023-02-23T21:21:14+00:00\",\"mainEntityOfPage\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/results\\\/-\\\/journal_content\\\/56\\\/10192\\\/46004459\\\/NEWS\\\/\"},\"wordCount\":304,\"commentCount\":0,\"publisher\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#organization\"},\"articleSection\":[\"Materials Testing and Evaluation\",\"news\",\"News Articles\"],\"inLanguage\":\"en-US\",\"potentialAction\":[{\"@type\":\"CommentAction\",\"name\":\"Comment\",\"target\":[\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/results\\\/-\\\/journal_content\\\/56\\\/10192\\\/46004459\\\/NEWS\\\/#respond\"]}]},{\"@type\":\"WebPage\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/results\\\/-\\\/journal_content\\\/56\\\/10192\\\/46004459\\\/NEWS\\\/\",\"url\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/results\\\/-\\\/journal_content\\\/56\\\/10192\\\/46004459\\\/NEWS\\\/\",\"name\":\"Tescan installs first new UniTOM HR Dynamic Micro-CT System at Catholic University of Leuven - Electronic Device Failure Analysis Society\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#website\"},\"datePublished\":\"2021-10-22T15:32:16+00:00\",\"dateModified\":\"2023-02-23T21:21:14+00:00\",\"breadcrumb\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/results\\\/-\\\/journal_content\\\/56\\\/10192\\\/46004459\\\/NEWS\\\/#breadcrumb\"},\"inLanguage\":\"en-US\",\"potentialAction\":[{\"@type\":\"ReadAction\",\"target\":[\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/results\\\/-\\\/journal_content\\\/56\\\/10192\\\/46004459\\\/NEWS\\\/\"]}]},{\"@type\":\"BreadcrumbList\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/results\\\/-\\\/journal_content\\\/56\\\/10192\\\/46004459\\\/NEWS\\\/#breadcrumb\",\"itemListElement\":[{\"@type\":\"ListItem\",\"position\":1,\"name\":\"Home\",\"item\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/\"},{\"@type\":\"ListItem\",\"position\":2,\"name\":\"Tescan installs first new UniTOM HR Dynamic Micro-CT System at Catholic University of Leuven\"}]},{\"@type\":\"WebSite\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#website\",\"url\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/\",\"name\":\"Electronic Device Failure Analysis Society\",\"description\":\"Electronic Device Failure Analysis Society\",\"publisher\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#organization\"},\"potentialAction\":[{\"@type\":\"SearchAction\",\"target\":{\"@type\":\"EntryPoint\",\"urlTemplate\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/?s={search_term_string}\"},\"query-input\":{\"@type\":\"PropertyValueSpecification\",\"valueRequired\":true,\"valueName\":\"search_term_string\"}}],\"inLanguage\":\"en-US\"},{\"@type\":\"Organization\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#organization\",\"name\":\"Electronic Device Failure Analysis Society\",\"url\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/\",\"logo\":{\"@type\":\"ImageObject\",\"inLanguage\":\"en-US\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#\\\/schema\\\/logo\\\/image\\\/\",\"url\":\"https:\\\/\\\/cdn-prd-main.asm-media.cloud\\\/uploads\\\/sites\\\/41\\\/2022\\\/10\\\/layout_set_logo.png\",\"contentUrl\":\"https:\\\/\\\/cdn-prd-main.asm-media.cloud\\\/uploads\\\/sites\\\/41\\\/2022\\\/10\\\/layout_set_logo.png\",\"width\":360,\"height\":95,\"caption\":\"Electronic Device Failure Analysis Society\"},\"image\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#\\\/schema\\\/logo\\\/image\\\/\"}},{\"@type\":\"Person\",\"@id\":\"\",\"url\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/author\\\/\"}]}<\/script>\n<!-- \/ Yoast SEO plugin. -->","yoast_head_json":{"title":"Tescan installs first new UniTOM HR Dynamic Micro-CT System at Catholic University of Leuven - Electronic Device Failure Analysis Society","robots":{"index":"index","follow":"follow","max-snippet":"max-snippet:-1","max-image-preview":"max-image-preview:large","max-video-preview":"max-video-preview:-1"},"canonical":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/46004459\/NEWS\/","og_locale":"en_US","og_type":"article","og_title":"Tescan installs first new UniTOM HR Dynamic Micro-CT System at Catholic University of Leuven - Electronic Device Failure Analysis Society","og_description":"Tescan Orsay Holdings a.s., Czech Republic, announced the first installation of its new UniTOM HR dynamic micro-CT system at the KU Leuven XCT Core Facility, Belgium.","og_url":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/46004459\/NEWS\/","og_site_name":"Electronic Device Failure Analysis Society","article_published_time":"2021-10-22T15:32:16+00:00","article_modified_time":"2023-02-23T21:21:14+00:00","twitter_card":"summary_large_image","twitter_misc":{"Written by":"","Est. reading time":"1 minute"},"schema":{"@context":"https:\/\/schema.org","@graph":[{"@type":"Article","@id":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/46004459\/NEWS\/#article","isPartOf":{"@id":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/46004459\/NEWS\/"},"author":{"name":"","@id":""},"headline":"Tescan installs first new UniTOM HR Dynamic Micro-CT System at Catholic University of Leuven","datePublished":"2021-10-22T15:32:16+00:00","dateModified":"2023-02-23T21:21:14+00:00","mainEntityOfPage":{"@id":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/46004459\/NEWS\/"},"wordCount":304,"commentCount":0,"publisher":{"@id":"https:\/\/www.asminternational.org\/edfas\/#organization"},"articleSection":["Materials Testing and Evaluation","news","News Articles"],"inLanguage":"en-US","potentialAction":[{"@type":"CommentAction","name":"Comment","target":["https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/46004459\/NEWS\/#respond"]}]},{"@type":"WebPage","@id":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/46004459\/NEWS\/","url":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/46004459\/NEWS\/","name":"Tescan installs first new UniTOM HR Dynamic Micro-CT System at Catholic University of Leuven - Electronic Device Failure Analysis Society","isPartOf":{"@id":"https:\/\/www.asminternational.org\/edfas\/#website"},"datePublished":"2021-10-22T15:32:16+00:00","dateModified":"2023-02-23T21:21:14+00:00","breadcrumb":{"@id":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/46004459\/NEWS\/#breadcrumb"},"inLanguage":"en-US","potentialAction":[{"@type":"ReadAction","target":["https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/46004459\/NEWS\/"]}]},{"@type":"BreadcrumbList","@id":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/46004459\/NEWS\/#breadcrumb","itemListElement":[{"@type":"ListItem","position":1,"name":"Home","item":"https:\/\/www.asminternational.org\/edfas\/"},{"@type":"ListItem","position":2,"name":"Tescan installs first new UniTOM HR Dynamic Micro-CT System at Catholic University of Leuven"}]},{"@type":"WebSite","@id":"https:\/\/www.asminternational.org\/edfas\/#website","url":"https:\/\/www.asminternational.org\/edfas\/","name":"Electronic Device Failure Analysis Society","description":"Electronic Device Failure Analysis Society","publisher":{"@id":"https:\/\/www.asminternational.org\/edfas\/#organization"},"potentialAction":[{"@type":"SearchAction","target":{"@type":"EntryPoint","urlTemplate":"https:\/\/www.asminternational.org\/edfas\/?s={search_term_string}"},"query-input":{"@type":"PropertyValueSpecification","valueRequired":true,"valueName":"search_term_string"}}],"inLanguage":"en-US"},{"@type":"Organization","@id":"https:\/\/www.asminternational.org\/edfas\/#organization","name":"Electronic Device Failure Analysis Society","url":"https:\/\/www.asminternational.org\/edfas\/","logo":{"@type":"ImageObject","inLanguage":"en-US","@id":"https:\/\/www.asminternational.org\/edfas\/#\/schema\/logo\/image\/","url":"https:\/\/cdn-prd-main.asm-media.cloud\/uploads\/sites\/41\/2022\/10\/layout_set_logo.png","contentUrl":"https:\/\/cdn-prd-main.asm-media.cloud\/uploads\/sites\/41\/2022\/10\/layout_set_logo.png","width":360,"height":95,"caption":"Electronic Device Failure Analysis Society"},"image":{"@id":"https:\/\/www.asminternational.org\/edfas\/#\/schema\/logo\/image\/"}},{"@type":"Person","@id":"","url":"https:\/\/www.asminternational.org\/edfas\/author\/"}]}},"acf":[],"_links":{"self":[{"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/posts\/4794","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/users\/63103"}],"replies":[{"embeddable":true,"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/comments?post=4794"}],"version-history":[{"count":0,"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/posts\/4794\/revisions"}],"wp:attachment":[{"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/media?parent=4794"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/categories?post=4794"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/tags?post=4794"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}