{"id":4822,"date":"2022-08-18T21:55:57","date_gmt":"2022-08-18T21:55:57","guid":{"rendered":"https:\/\/staging.asminternational.org\/edfas\/neo-semiconductor-launches-ground-breaking-x-dram-architecture-at-flash-memory-summit-2022\/"},"modified":"2023-02-23T21:21:21","modified_gmt":"2023-02-23T21:21:21","slug":"neo-semiconductor-launches-ground-breaking-x-dram-architecture-at-flash-memory-summit-2022","status":"publish","type":"post","link":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/49546896\/NEWS\/","title":{"rendered":"NEO Semiconductor launches ground-breaking X-DRAM architecture"},"content":{"rendered":"

NEO Semiconductor, San Jose, Calif., a leading developer of innovative architectures for 3D NAND flash and DRAM memory, launched its latest technology offering, X-DRAM, at Flash Memory Summit 2022. X-DRAM offers extraordinary improvements over conventional DRAM by lowering the power consumption and increasing the performance of the main memory used in IT systems and consumer products.<\/p>\n

\u201cNot only is X-DRAM expected to have a significant impact on the global DRAM market, but it will also serve environmental, social, and corporate governance (ESG) goals,\u201d says Andy Hsu, Founder and CEO of NEO Semiconductor and an accomplished technology inventor with more than 120 granted U.S. patents. \u201cX-DRAM can lower refresh power by more than 80% through a combination of 50% refresh frequency and 25% refresh time. It also lowers main memory latency and narrows the processor-to-memory performance gap. As a result, it dramatically reduces the power consumption of IT infrastructure and consumer products, leading to much lower greenhouse gas (GHG) emissions.\u201d<\/p>\n

Power consumption and latency performance have led to alarming environmental and economic concerns. Products incorporating X-DRAM will be able to address these concerns, providing compelling competitive advantages across business and consumer markets.<\/p>\n

The unique X-DRAM solution is compatible with current DRAM manufacturing technologies, processes, structures, and dies. X-DRAM has a wide range of use cases, from cloud servers to mobile devices to IoT objects. Semiconductor manufacturers can quickly incorporate X-DRAM architecture without increasing manufacturing costs.<\/p>\n

 <\/p>\n

For more information:<\/p>\n

NEO Semiconductor<\/p>\n

www.neosemic.com<\/a><\/p>\n

 <\/p>\n","protected":false},"excerpt":{"rendered":"

NEO Semiconductor, San Jose, Calif., a leading developer of innovative architectures for 3D NAND flash and DRAM memory, launched its latest technology offering, X-DRAM, at Flash Memory Summit 2022.<\/p>\n","protected":false},"author":63103,"featured_media":0,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[446,434,444,435,436,1],"tags":[],"class_list":["post-4822","post","type-post","status-publish","format-standard","hentry","category-consumer-products","category-electronics","category-industries-and-applications","category-news","category-news-articles","category-uncategorized"],"yoast_head":"\nNEO Semiconductor launches ground-breaking X-DRAM architecture - Electronic Device Failure Analysis Society<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/49546896\/NEWS\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"NEO Semiconductor launches ground-breaking X-DRAM architecture - Electronic Device Failure Analysis Society\" \/>\n<meta property=\"og:description\" content=\"NEO Semiconductor, San Jose, Calif., a leading developer of innovative architectures for 3D NAND flash and DRAM memory, launched its latest technology offering, X-DRAM, at Flash Memory Summit 2022.\" \/>\n<meta property=\"og:url\" content=\"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/49546896\/NEWS\/\" \/>\n<meta property=\"og:site_name\" content=\"Electronic Device Failure Analysis Society\" \/>\n<meta property=\"article:published_time\" content=\"2022-08-18T21:55:57+00:00\" \/>\n<meta property=\"article:modified_time\" content=\"2023-02-23T21:21:21+00:00\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" content=\"Written by\" \/>\n\t<meta name=\"twitter:data1\" content=\"\" \/>\n\t<meta name=\"twitter:label2\" content=\"Est. reading time\" \/>\n\t<meta name=\"twitter:data2\" content=\"1 minute\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\\\/\\\/schema.org\",\"@graph\":[{\"@type\":\"Article\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/results\\\/-\\\/journal_content\\\/56\\\/10192\\\/49546896\\\/NEWS\\\/#article\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/results\\\/-\\\/journal_content\\\/56\\\/10192\\\/49546896\\\/NEWS\\\/\"},\"author\":{\"name\":\"\",\"@id\":\"\"},\"headline\":\"NEO Semiconductor launches ground-breaking X-DRAM architecture\",\"datePublished\":\"2022-08-18T21:55:57+00:00\",\"dateModified\":\"2023-02-23T21:21:21+00:00\",\"mainEntityOfPage\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/results\\\/-\\\/journal_content\\\/56\\\/10192\\\/49546896\\\/NEWS\\\/\"},\"wordCount\":246,\"commentCount\":0,\"publisher\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#organization\"},\"articleSection\":[\"Consumer Products\",\"Electronics\",\"Industries and Applications\",\"news\",\"News Articles\"],\"inLanguage\":\"en-US\",\"potentialAction\":[{\"@type\":\"CommentAction\",\"name\":\"Comment\",\"target\":[\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/results\\\/-\\\/journal_content\\\/56\\\/10192\\\/49546896\\\/NEWS\\\/#respond\"]}]},{\"@type\":\"WebPage\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/results\\\/-\\\/journal_content\\\/56\\\/10192\\\/49546896\\\/NEWS\\\/\",\"url\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/results\\\/-\\\/journal_content\\\/56\\\/10192\\\/49546896\\\/NEWS\\\/\",\"name\":\"NEO Semiconductor launches ground-breaking X-DRAM architecture - Electronic Device Failure Analysis Society\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#website\"},\"datePublished\":\"2022-08-18T21:55:57+00:00\",\"dateModified\":\"2023-02-23T21:21:21+00:00\",\"breadcrumb\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/results\\\/-\\\/journal_content\\\/56\\\/10192\\\/49546896\\\/NEWS\\\/#breadcrumb\"},\"inLanguage\":\"en-US\",\"potentialAction\":[{\"@type\":\"ReadAction\",\"target\":[\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/results\\\/-\\\/journal_content\\\/56\\\/10192\\\/49546896\\\/NEWS\\\/\"]}]},{\"@type\":\"BreadcrumbList\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/results\\\/-\\\/journal_content\\\/56\\\/10192\\\/49546896\\\/NEWS\\\/#breadcrumb\",\"itemListElement\":[{\"@type\":\"ListItem\",\"position\":1,\"name\":\"Home\",\"item\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/\"},{\"@type\":\"ListItem\",\"position\":2,\"name\":\"NEO Semiconductor launches ground-breaking X-DRAM architecture\"}]},{\"@type\":\"WebSite\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#website\",\"url\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/\",\"name\":\"Electronic Device Failure Analysis Society\",\"description\":\"Electronic Device Failure Analysis Society\",\"publisher\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#organization\"},\"potentialAction\":[{\"@type\":\"SearchAction\",\"target\":{\"@type\":\"EntryPoint\",\"urlTemplate\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/?s={search_term_string}\"},\"query-input\":{\"@type\":\"PropertyValueSpecification\",\"valueRequired\":true,\"valueName\":\"search_term_string\"}}],\"inLanguage\":\"en-US\"},{\"@type\":\"Organization\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#organization\",\"name\":\"Electronic Device Failure Analysis Society\",\"url\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/\",\"logo\":{\"@type\":\"ImageObject\",\"inLanguage\":\"en-US\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#\\\/schema\\\/logo\\\/image\\\/\",\"url\":\"https:\\\/\\\/cdn-prd-main.asm-media.cloud\\\/uploads\\\/sites\\\/41\\\/2022\\\/10\\\/layout_set_logo.png\",\"contentUrl\":\"https:\\\/\\\/cdn-prd-main.asm-media.cloud\\\/uploads\\\/sites\\\/41\\\/2022\\\/10\\\/layout_set_logo.png\",\"width\":360,\"height\":95,\"caption\":\"Electronic Device Failure Analysis Society\"},\"image\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#\\\/schema\\\/logo\\\/image\\\/\"}},{\"@type\":\"Person\",\"@id\":\"\",\"url\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/author\\\/\"}]}<\/script>\n<!-- \/ Yoast SEO plugin. -->","yoast_head_json":{"title":"NEO Semiconductor launches ground-breaking X-DRAM architecture - Electronic Device Failure Analysis Society","robots":{"index":"index","follow":"follow","max-snippet":"max-snippet:-1","max-image-preview":"max-image-preview:large","max-video-preview":"max-video-preview:-1"},"canonical":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/49546896\/NEWS\/","og_locale":"en_US","og_type":"article","og_title":"NEO Semiconductor launches ground-breaking X-DRAM architecture - Electronic Device Failure Analysis Society","og_description":"NEO Semiconductor, San Jose, Calif., a leading developer of innovative architectures for 3D NAND flash and DRAM memory, launched its latest technology offering, X-DRAM, at Flash Memory Summit 2022.","og_url":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/49546896\/NEWS\/","og_site_name":"Electronic Device Failure Analysis Society","article_published_time":"2022-08-18T21:55:57+00:00","article_modified_time":"2023-02-23T21:21:21+00:00","twitter_card":"summary_large_image","twitter_misc":{"Written by":"","Est. reading time":"1 minute"},"schema":{"@context":"https:\/\/schema.org","@graph":[{"@type":"Article","@id":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/49546896\/NEWS\/#article","isPartOf":{"@id":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/49546896\/NEWS\/"},"author":{"name":"","@id":""},"headline":"NEO Semiconductor launches ground-breaking X-DRAM architecture","datePublished":"2022-08-18T21:55:57+00:00","dateModified":"2023-02-23T21:21:21+00:00","mainEntityOfPage":{"@id":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/49546896\/NEWS\/"},"wordCount":246,"commentCount":0,"publisher":{"@id":"https:\/\/www.asminternational.org\/edfas\/#organization"},"articleSection":["Consumer Products","Electronics","Industries and Applications","news","News Articles"],"inLanguage":"en-US","potentialAction":[{"@type":"CommentAction","name":"Comment","target":["https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/49546896\/NEWS\/#respond"]}]},{"@type":"WebPage","@id":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/49546896\/NEWS\/","url":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/49546896\/NEWS\/","name":"NEO Semiconductor launches ground-breaking X-DRAM architecture - Electronic Device Failure Analysis Society","isPartOf":{"@id":"https:\/\/www.asminternational.org\/edfas\/#website"},"datePublished":"2022-08-18T21:55:57+00:00","dateModified":"2023-02-23T21:21:21+00:00","breadcrumb":{"@id":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/49546896\/NEWS\/#breadcrumb"},"inLanguage":"en-US","potentialAction":[{"@type":"ReadAction","target":["https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/49546896\/NEWS\/"]}]},{"@type":"BreadcrumbList","@id":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/49546896\/NEWS\/#breadcrumb","itemListElement":[{"@type":"ListItem","position":1,"name":"Home","item":"https:\/\/www.asminternational.org\/edfas\/"},{"@type":"ListItem","position":2,"name":"NEO Semiconductor launches ground-breaking X-DRAM architecture"}]},{"@type":"WebSite","@id":"https:\/\/www.asminternational.org\/edfas\/#website","url":"https:\/\/www.asminternational.org\/edfas\/","name":"Electronic Device Failure Analysis Society","description":"Electronic Device Failure Analysis Society","publisher":{"@id":"https:\/\/www.asminternational.org\/edfas\/#organization"},"potentialAction":[{"@type":"SearchAction","target":{"@type":"EntryPoint","urlTemplate":"https:\/\/www.asminternational.org\/edfas\/?s={search_term_string}"},"query-input":{"@type":"PropertyValueSpecification","valueRequired":true,"valueName":"search_term_string"}}],"inLanguage":"en-US"},{"@type":"Organization","@id":"https:\/\/www.asminternational.org\/edfas\/#organization","name":"Electronic Device Failure Analysis Society","url":"https:\/\/www.asminternational.org\/edfas\/","logo":{"@type":"ImageObject","inLanguage":"en-US","@id":"https:\/\/www.asminternational.org\/edfas\/#\/schema\/logo\/image\/","url":"https:\/\/cdn-prd-main.asm-media.cloud\/uploads\/sites\/41\/2022\/10\/layout_set_logo.png","contentUrl":"https:\/\/cdn-prd-main.asm-media.cloud\/uploads\/sites\/41\/2022\/10\/layout_set_logo.png","width":360,"height":95,"caption":"Electronic Device Failure Analysis Society"},"image":{"@id":"https:\/\/www.asminternational.org\/edfas\/#\/schema\/logo\/image\/"}},{"@type":"Person","@id":"","url":"https:\/\/www.asminternational.org\/edfas\/author\/"}]}},"acf":[],"_links":{"self":[{"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/posts\/4822","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/users\/63103"}],"replies":[{"embeddable":true,"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/comments?post=4822"}],"version-history":[{"count":0,"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/posts\/4822\/revisions"}],"wp:attachment":[{"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/media?parent=4822"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/categories?post=4822"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/tags?post=4822"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}