{"id":4997,"date":"2020-06-19T16:26:53","date_gmt":"2020-06-19T16:26:53","guid":{"rendered":"https:\/\/staging.asminternational.org\/edfas\/samsung-electronics-develops-cloud-chip-design-platform-in-collaboration-with-rescale\/"},"modified":"2023-02-23T21:22:32","modified_gmt":"2023-02-23T21:22:32","slug":"samsung-electronics-develops-cloud-chip-design-platform-in-collaboration-with-rescale","status":"publish","type":"post","link":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/40743018\/NEWS\/","title":{"rendered":"Samsung Electronics develops cloud chip design platform in collaboration with Rescale"},"content":{"rendered":"<p style=\"margin:0in;margin-bottom:.0001pt\"><span style=\"background:#fefefe\"><span style=\",sans-serif\"><span style=\"color:#444444\">Samsung Electronics Co. Ltd., San Jose, Calif., introduces the Samsung Advanced Foundry Ecosystem (SAFE) cloud design platform for fabless customers, in collaboration with Rescale, a leader in high-performance computing applications in the cloud.&nbsp;<\/span><\/span><\/span><span style=\"background:#fefefe\"><span style=\",sans-serif\"><span style=\"color:#444444\">The key highlight feature of Samsung foundry\u2019s first SAFE cloud design platform is that it provides a virtual environment to design chips in the cloud. By accessing this platform through the cloud, customers can immediately start designing at anytime and anywhere.<\/span><\/span><\/span><\/p>\n<p style=\"margin:0in;margin-bottom:.0001pt\">&nbsp;<\/p>\n<p style=\"margin:0in;margin-bottom:.0001pt\"><span style=\"background:#fefefe\"><span style=\",sans-serif\"><span style=\"color:#444444\">To maximize design convenience, the SAFE cloud design platform supports a very secure design condition that has been verified with cloud companies. In addition, customers can utilize various electronic design automation tools offered by multiple vendors such as Ansys, Cadence, Mentor (a Siemens business), and Synopsys.<\/span><\/span><\/span><\/p>\n<p style=\"margin:0in;margin-bottom:.0001pt\">&nbsp;<\/p>\n<p style=\"margin:0in;margin-bottom:.0001pt\"><span style=\"background:#fefefe\"><span style=\",sans-serif\"><span style=\"color:#444444\">By adopting the cloud design platform, customers can reduce the burden of building their own server infrastructure, while flexibly utilizing additional computing power required for chip design and verification. Furthermore, they can take full advantage of Samsung\u2019s diverse foundry ecosystem, which includes intellectual property, cloud, and design services offered by reputable partners.<\/span><\/span><\/span><\/p>\n<p style=\"margin:0in;margin-bottom:.0001pt\">&nbsp;<\/p>\n<p style=\"margin:0in;margin-bottom:.0001pt\"><span style=\"background:#fefefe\"><span style=\",sans-serif\"><span style=\"color:#444444\">Gaonchips, one of Samsung Foundry\u2019s design solution partners, has already tested the SAFE cloud design platform on its 14nm automotive project. The company used Cadence\u2019s Innovus Implementation System, and has successfully reduced its design run-time by 30 percent compared to current on-premises execution.<\/span><\/span><\/span><\/p>\n<p style=\"margin:0in;margin-bottom:.0001pt\">&nbsp;<\/p>\n<p style=\"margin:0in;margin-bottom:.0001pt\"><span style=\"background:#fefefe\"><span style=\",sans-serif\"><span style=\"color:#4472c4\"><a href=\"https:\/\/cts.businesswire.com\/ct\/CT?id=smartlink&amp;url=http%3A%2F%2Fnews.samsung.com&amp;esheet=52236732&amp;newsitemid=20200618005278&amp;lan=en-US&amp;anchor=http%3A%2F%2Fnews.samsung.com&amp;index=2&amp;md5=f8cbaa18521e7304ba3d7098d7f327bd\" target=\"_blank\" rel=\"noopener\"><span style=\"color:#4472c4\">http:\/\/news.samsung.com<\/span><\/a><\/span><\/span><\/span><\/p>\n<p style=\"margin:0in;margin-bottom:.0001pt\">&nbsp;<\/p>\n","protected":false},"excerpt":{"rendered":"<p>Samsung Electronics Co. Ltd., San Jose, Calif., introduces the Samsung Advanced Foundry Ecosystem (SAFE) cloud design platform for fabless customers, in collaboration with Rescale, a leader in high-performance computing applications in the cloud.<\/p>\n","protected":false},"author":63103,"featured_media":0,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[434,435,436,1],"tags":[],"class_list":["post-4997","post","type-post","status-publish","format-standard","hentry","category-electronics","category-news","category-news-articles","category-uncategorized"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.9 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>Samsung Electronics develops cloud chip design platform in collaboration with Rescale - Electronic Device Failure Analysis Society<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/40743018\/NEWS\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Samsung Electronics develops cloud chip design platform in collaboration with Rescale - Electronic Device Failure Analysis Society\" \/>\n<meta property=\"og:description\" content=\"Samsung Electronics Co. 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