{"id":5052,"date":"2019-10-21T09:52:55","date_gmt":"2019-10-21T09:52:55","guid":{"rendered":"https:\/\/staging.asminternational.org\/edfas\/x-ray-microscopic-chemical-imaging-enables-rapid-failure-analysis-of-semiconductors\/"},"modified":"2023-02-23T21:22:53","modified_gmt":"2023-02-23T21:22:53","slug":"x-ray-microscopic-chemical-imaging-enables-rapid-failure-analysis-of-semiconductors","status":"publish","type":"post","link":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/38623469\/NEWS\/","title":{"rendered":"X-ray microscopic chemical imaging enables rapid failure analysis of semiconductors"},"content":{"rendered":"<p style=\"margin-bottom:.0001pt\"><span style=\"background:white\"><span style=\"line-height:normal\"><span style=\"color:#333333\">Researchers from Sigray Inc., Concord, Calif., will discuss at ISTFA 2019 that new heterogeneous integration schemes and continuing miniaturization of packaging components such as micropillars are driving demand for new substantive changes to conventional failure analysis. <\/span><\/span><\/span><\/p>\n<p style=\"margin-bottom:.0001pt\">&nbsp;<\/p>\n<p style=\"margin-bottom:.0001pt\"><span style=\"background:white\"><span style=\"line-height:normal\"><span style=\"color:#333333\">In particular, desired performance capabilities include the ability to nondestructively determine failures within seconds to minutes. Moreover, the process should be quantitative, capable of measuring 3D structures and buried structures, and have sufficient resolution to determine failures in &lt;10-20 um features. <\/span><\/span><\/span><\/p>\n<p style=\"margin-bottom:.0001pt\">&nbsp;<\/p>\n<p style=\"margin-bottom:.0001pt\"><span style=\"background:white\"><span style=\"line-height:normal\"><span style=\"color:#333333\">In this paper they present a novel solution based on x-ray chemical microscopy.<\/span><\/span><\/span><\/p>\n<p style=\"margin-bottom:.0001pt\">&nbsp;<\/p>\n<p style=\"margin-bottom:.0001pt\"><span style=\"line-height:normal\"><b>Title: \u201cNovel x-ray microscopic chemical imaging for rapid non-destructive identification of microbump voids and compositional defects\u201d<\/b><\/span><\/p>\n<p style=\"margin-bottom:.0001pt\">&nbsp;<\/p>\n<p style=\"margin-bottom:.0001pt\"><span style=\"background:white\"><span style=\"line-height:normal\"><b><i><span style=\"border:none windowtext 1.0pt;color:#333333;padding:0in\">Mr. S.H. Lau, <\/span><\/i><\/b><i><span style=\"border:none windowtext 1.0pt;color:#333333;padding:0in\">&nbsp;Dr. Benjamin Stripe, Ms. Sylvia Lewis, Ms. Xiaolin Yang, Dr. Wenbing Yun, <\/span><\/i><i><span style=\"color:#333333\">&nbsp;<span style=\"border:none windowtext 1.0pt;padding:0in\">Sigray Inc., Concord, California <\/span><\/span><\/i><\/span><\/span><\/p>\n<p style=\"margin-bottom:.0001pt\">&nbsp;<\/p>\n<p style=\"margin-bottom:.0001pt\"><span style=\"line-height:normal\"><a href=\"https:\/\/www.asminternational.org\/web\/istfa-2019\/home\">https:\/\/www.asminternational.org\/web\/istfa-2019\/home<\/a> <\/span><\/p>\n<p style=\"margin-bottom:.0001pt\">&nbsp;<\/p>\n","protected":false},"excerpt":{"rendered":"<p>Researchers from Sigray Inc., Concord, Calif., will discuss at ISTFA 2019 that new heterogeneous integration schemes and continuing miniaturization of packaging components such as micropillars are driving demand for new substantive changes to conventional failure analysis.<\/p>\n","protected":false},"author":63103,"featured_media":0,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[434,435,436,1],"tags":[],"class_list":["post-5052","post","type-post","status-publish","format-standard","hentry","category-electronics","category-news","category-news-articles","category-uncategorized"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.9 - 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