{"id":5085,"date":"2018-07-22T11:34:12","date_gmt":"2018-07-22T11:34:12","guid":{"rendered":"https:\/\/staging.asminternational.org\/edfas\/kla-tencor-defect-inspection-systems-capture-defect-excursions-at-their-source\/"},"modified":"2023-02-23T21:23:07","modified_gmt":"2023-02-23T21:23:07","slug":"kla-tencor-defect-inspection-systems-capture-defect-excursions-at-their-source","status":"publish","type":"post","link":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/34931535\/NEWS\/","title":{"rendered":"KLA-Tencor defect inspection systems capture defect excursions at their source"},"content":{"rendered":"<p><span><span>KLA-Tencor Corp., Milpitas, Calif., announces two new defect inspection products: The VoyagerTM1015 system, and the Surfscan SP7 system. &nbsp;Together, the two new inspection systems are designed to accelerate time-to-market for innovative electronic devices by capturing defect excursions at their source.<\/span><\/span><\/p>\n<p><span><span>VoyagerTM1015 offers new capability to inspect patterned wafers, including inspection in the lithography cell immediately after development of the photoresist, when the wafer can be reworked. <\/span><\/span><\/p>\n<p><span><span>The Surfscan SP7 system delivers unprecedented defect detection sensitivity on bare wafers, smooth and rough films\u2014essential for manufacturing silicon substrates intended for the 7nm logic and advanced memory device nodes, and equally critical for earliest detection of process issues during chip manufacturing. <\/span><\/span><\/p>\n<p><span><span>The Surfscan SP7 unpatterned wafer defect inspection system achieves its high sensitivity through innovations in illumination and sensor architecture that produce decades of improvement in resolution over that of the previous-generation Surfscan tool. This leap in resolution is the key to detection of the smallest killer defects. The new resolution realm also enables real-time classification of many defect types, such as particles, scratches, slip lines and stacking faults\u2014without removing the wafer from the Surfscan tool or affecting the system throughput. At the same time, control over peak power density allows the Surfscan SP7 to inspect thin, delicate EUV photoresist materials.<\/span><\/span><\/p>\n<p><span><span>The Voyager 1015 patterned wafer defect inspection system closes a long-standing industry gap in after-develop inspection (ADI), leveraging novel illumination, collection and sensor architecture. This revolutionary laser scattering inspection system drives sensitivity forward while reducing nuisance signals\u2014and delivers results substantially sooner than the next-best alternatives. Like the new Surfscan SP7, the Voyager system features exceptional control of power density, allowing inline inspection of delicate photoresist materials after develop. High throughput capture of critical defects in the litho cell and other modules of the fab allows process issues to be identified and rectified rapidly.<\/span><\/span><\/p>\n<p><span><span><a href=\"http:\/\/www.kla-tencor.com\">www.kla-tencor.co<\/a>m&nbsp;<\/span><\/span><\/p>\n","protected":false},"excerpt":{"rendered":"<p>KLA-Tencor Corp., Milpitas, Calif., announces two new defect inspection products: The VoyagerTM1015 system, and the Surfscan SP7 system.<\/p>\n","protected":false},"author":63103,"featured_media":0,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[434,435,436,1],"tags":[],"class_list":["post-5085","post","type-post","status-publish","format-standard","hentry","category-electronics","category-news","category-news-articles","category-uncategorized"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.9 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>KLA-Tencor defect inspection systems capture defect excursions at their source - Electronic Device Failure Analysis Society<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/34931535\/NEWS\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"KLA-Tencor defect inspection systems capture defect excursions at their source - Electronic Device Failure Analysis Society\" \/>\n<meta property=\"og:description\" content=\"KLA-Tencor Corp., Milpitas, Calif., announces two new defect inspection products: The VoyagerTM1015 system, and the Surfscan SP7 system.\" \/>\n<meta property=\"og:url\" content=\"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/34931535\/NEWS\/\" \/>\n<meta property=\"og:site_name\" content=\"Electronic Device Failure Analysis Society\" \/>\n<meta property=\"article:published_time\" content=\"2018-07-22T11:34:12+00:00\" \/>\n<meta property=\"article:modified_time\" content=\"2023-02-23T21:23:07+00:00\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" content=\"Written by\" \/>\n\t<meta name=\"twitter:data1\" content=\"\" \/>\n\t<meta name=\"twitter:label2\" content=\"Est. reading time\" \/>\n\t<meta name=\"twitter:data2\" content=\"2 minutes\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\\\/\\\/schema.org\",\"@graph\":[{\"@type\":\"Article\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/results\\\/-\\\/journal_content\\\/56\\\/10192\\\/34931535\\\/NEWS\\\/#article\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/results\\\/-\\\/journal_content\\\/56\\\/10192\\\/34931535\\\/NEWS\\\/\"},\"author\":{\"name\":\"\",\"@id\":\"\"},\"headline\":\"KLA-Tencor defect inspection systems capture defect excursions at their source\",\"datePublished\":\"2018-07-22T11:34:12+00:00\",\"dateModified\":\"2023-02-23T21:23:07+00:00\",\"mainEntityOfPage\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/results\\\/-\\\/journal_content\\\/56\\\/10192\\\/34931535\\\/NEWS\\\/\"},\"wordCount\":318,\"commentCount\":0,\"publisher\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#organization\"},\"articleSection\":[\"Electronics\",\"news\",\"News Articles\"],\"inLanguage\":\"en-US\",\"potentialAction\":[{\"@type\":\"CommentAction\",\"name\":\"Comment\",\"target\":[\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/results\\\/-\\\/journal_content\\\/56\\\/10192\\\/34931535\\\/NEWS\\\/#respond\"]}]},{\"@type\":\"WebPage\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/results\\\/-\\\/journal_content\\\/56\\\/10192\\\/34931535\\\/NEWS\\\/\",\"url\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/results\\\/-\\\/journal_content\\\/56\\\/10192\\\/34931535\\\/NEWS\\\/\",\"name\":\"KLA-Tencor defect inspection systems capture defect excursions at their source - 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