{"id":5165,"date":"2022-01-20T18:59:01","date_gmt":"2022-01-20T18:59:01","guid":{"rendered":"https:\/\/staging.asminternational.org\/edfas\/applied-materials-and-a-star-s-institute-of-microelectronics-expand-research-collaboration-to-accelerate-heterogeneous-chip-integration-with-hybrid-bo\/"},"modified":"2023-02-23T21:23:32","modified_gmt":"2023-02-23T21:23:32","slug":"applied-materials-and-a-star-s-institute-of-microelectronics-expand-research-collaboration-to-accelerate-heterogeneous-chip-integration-with-hybrid-bo","status":"publish","type":"post","link":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/46928490\/NEWS\/","title":{"rendered":"Research collaboration to accelerate heterogeneous chip integration with hybrid bonding technology"},"content":{"rendered":"

Applied Materials Inc., Santa Clara, Calif., and the Institute of Microelectronics (IME), a research institute of Singapore\u2019s Agency for Science, Technology and Research (A*STAR), announced a new phase of their research collaboration at the Center of Excellence in Advanced Packaging in Singapore.<\/p>\n

As traditional Moore\u2019s Law scaling slows, chipmakers and systems companies are increasingly looking to heterogeneous design and advanced packaging solutions to enable continued advances in power, performance, area, cost and time-to-market (PPACt). By combining chips of various nodes and functions in a single package, heterogeneous integration also enables smaller form factors and greater design and manufacturing flexibility.<\/p>\n

An emerging form of heterogeneous integration called hybrid bonding connects chips and wafers with direct copper-to-copper bonding, thereby reducing wiring distances and increasing input\/output (I\/O) density. This improves power efficiency and enables greater system performance.<\/p>\n

Under the new phase of their R&D engagement, Applied Materials and A*STAR\u2019s IME aim to accelerate the AI era of computing by driving breakthroughs in heterogeneous integration and advanced packaging for semiconductor innovation. The parties have signed a five-year extension to their existing research collaboration and will make a new, combined investment of approximately USD$210 million to upgrade and expand the Center of Excellence in Advanced Packaging in Singapore to accelerate materials, equipment and process technology solutions for hybrid bonding and other emerging, 3D chip integration technologies.<\/p>\n

 <\/p>\n

 <\/p>\n

For more information:<\/p>\n

Applied Materials<\/p>\n

www.appliedmaterials.com<\/a><\/p>\n

 <\/p>\n

Institute of Microelectronics A*STAR<\/p>\n

www.a-star.edu.sg<\/a><\/p>\n

 <\/p>\n","protected":false},"excerpt":{"rendered":"

Applied Materials Inc., Santa Clara, Calif., and the Institute of Microelectronics, a research institute of Singapore\u2019s Agency for Science, Technology and Research, announced a new phase of their research collaboration at the Center of Excellence in Advanced Packaging in Singapore.<\/p>\n","protected":false},"author":63103,"featured_media":0,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[439,441,435,436,1],"tags":[],"class_list":["post-5165","post","type-post","status-publish","format-standard","hentry","category-materials-processing-and-treatment","category-materials-properties-and-performance","category-news","category-news-articles","category-uncategorized"],"yoast_head":"\nResearch collaboration to accelerate heterogeneous chip integration with hybrid bonding technology - Electronic Device Failure Analysis Society<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/46928490\/NEWS\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Research collaboration to accelerate heterogeneous chip integration with hybrid bonding technology - Electronic Device Failure Analysis Society\" \/>\n<meta property=\"og:description\" content=\"Applied Materials Inc., Santa Clara, Calif., and the Institute of Microelectronics, a research institute of Singapore\u2019s Agency for Science, Technology and Research, announced a new phase of their research collaboration at the Center of Excellence in Advanced Packaging in Singapore.\" \/>\n<meta property=\"og:url\" content=\"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/46928490\/NEWS\/\" \/>\n<meta property=\"og:site_name\" content=\"Electronic Device Failure Analysis Society\" \/>\n<meta property=\"article:published_time\" content=\"2022-01-20T18:59:01+00:00\" \/>\n<meta property=\"article:modified_time\" content=\"2023-02-23T21:23:32+00:00\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" content=\"Written by\" \/>\n\t<meta name=\"twitter:data1\" content=\"\" \/>\n\t<meta name=\"twitter:label2\" content=\"Est. reading time\" \/>\n\t<meta name=\"twitter:data2\" content=\"1 minute\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\\\/\\\/schema.org\",\"@graph\":[{\"@type\":\"Article\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/results\\\/-\\\/journal_content\\\/56\\\/10192\\\/46928490\\\/NEWS\\\/#article\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/results\\\/-\\\/journal_content\\\/56\\\/10192\\\/46928490\\\/NEWS\\\/\"},\"author\":{\"name\":\"\",\"@id\":\"\"},\"headline\":\"Research collaboration to accelerate heterogeneous chip integration with hybrid bonding technology\",\"datePublished\":\"2022-01-20T18:59:01+00:00\",\"dateModified\":\"2023-02-23T21:23:32+00:00\",\"mainEntityOfPage\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/results\\\/-\\\/journal_content\\\/56\\\/10192\\\/46928490\\\/NEWS\\\/\"},\"wordCount\":262,\"commentCount\":0,\"publisher\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#organization\"},\"articleSection\":[\"Materials Processing and Treatment\",\"Materials Properties and Performance\",\"news\",\"News Articles\"],\"inLanguage\":\"en-US\",\"potentialAction\":[{\"@type\":\"CommentAction\",\"name\":\"Comment\",\"target\":[\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/results\\\/-\\\/journal_content\\\/56\\\/10192\\\/46928490\\\/NEWS\\\/#respond\"]}]},{\"@type\":\"WebPage\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/results\\\/-\\\/journal_content\\\/56\\\/10192\\\/46928490\\\/NEWS\\\/\",\"url\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/results\\\/-\\\/journal_content\\\/56\\\/10192\\\/46928490\\\/NEWS\\\/\",\"name\":\"Research collaboration to accelerate heterogeneous chip integration with hybrid bonding technology - Electronic Device Failure Analysis Society\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#website\"},\"datePublished\":\"2022-01-20T18:59:01+00:00\",\"dateModified\":\"2023-02-23T21:23:32+00:00\",\"breadcrumb\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/results\\\/-\\\/journal_content\\\/56\\\/10192\\\/46928490\\\/NEWS\\\/#breadcrumb\"},\"inLanguage\":\"en-US\",\"potentialAction\":[{\"@type\":\"ReadAction\",\"target\":[\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/results\\\/-\\\/journal_content\\\/56\\\/10192\\\/46928490\\\/NEWS\\\/\"]}]},{\"@type\":\"BreadcrumbList\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/results\\\/-\\\/journal_content\\\/56\\\/10192\\\/46928490\\\/NEWS\\\/#breadcrumb\",\"itemListElement\":[{\"@type\":\"ListItem\",\"position\":1,\"name\":\"Home\",\"item\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/\"},{\"@type\":\"ListItem\",\"position\":2,\"name\":\"Research collaboration to accelerate heterogeneous chip integration with hybrid bonding technology\"}]},{\"@type\":\"WebSite\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#website\",\"url\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/\",\"name\":\"Electronic Device Failure Analysis Society\",\"description\":\"Electronic Device Failure Analysis Society\",\"publisher\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#organization\"},\"potentialAction\":[{\"@type\":\"SearchAction\",\"target\":{\"@type\":\"EntryPoint\",\"urlTemplate\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/?s={search_term_string}\"},\"query-input\":{\"@type\":\"PropertyValueSpecification\",\"valueRequired\":true,\"valueName\":\"search_term_string\"}}],\"inLanguage\":\"en-US\"},{\"@type\":\"Organization\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#organization\",\"name\":\"Electronic Device Failure Analysis Society\",\"url\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/\",\"logo\":{\"@type\":\"ImageObject\",\"inLanguage\":\"en-US\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#\\\/schema\\\/logo\\\/image\\\/\",\"url\":\"https:\\\/\\\/cdn-prd-main.asm-media.cloud\\\/uploads\\\/sites\\\/41\\\/2022\\\/10\\\/layout_set_logo.png\",\"contentUrl\":\"https:\\\/\\\/cdn-prd-main.asm-media.cloud\\\/uploads\\\/sites\\\/41\\\/2022\\\/10\\\/layout_set_logo.png\",\"width\":360,\"height\":95,\"caption\":\"Electronic Device Failure Analysis Society\"},\"image\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#\\\/schema\\\/logo\\\/image\\\/\"}},{\"@type\":\"Person\",\"@id\":\"\",\"url\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/author\\\/\"}]}<\/script>\n<!-- \/ Yoast SEO plugin. -->","yoast_head_json":{"title":"Research collaboration to accelerate heterogeneous chip integration with hybrid bonding technology - Electronic Device Failure Analysis Society","robots":{"index":"index","follow":"follow","max-snippet":"max-snippet:-1","max-image-preview":"max-image-preview:large","max-video-preview":"max-video-preview:-1"},"canonical":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/46928490\/NEWS\/","og_locale":"en_US","og_type":"article","og_title":"Research collaboration to accelerate heterogeneous chip integration with hybrid bonding technology - Electronic Device Failure Analysis Society","og_description":"Applied Materials Inc., Santa Clara, Calif., and the Institute of Microelectronics, a research institute of Singapore\u2019s Agency for Science, Technology and Research, announced a new phase of their research collaboration at the Center of Excellence in Advanced Packaging in Singapore.","og_url":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/46928490\/NEWS\/","og_site_name":"Electronic Device Failure Analysis Society","article_published_time":"2022-01-20T18:59:01+00:00","article_modified_time":"2023-02-23T21:23:32+00:00","twitter_card":"summary_large_image","twitter_misc":{"Written by":"","Est. reading time":"1 minute"},"schema":{"@context":"https:\/\/schema.org","@graph":[{"@type":"Article","@id":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/46928490\/NEWS\/#article","isPartOf":{"@id":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/46928490\/NEWS\/"},"author":{"name":"","@id":""},"headline":"Research collaboration to accelerate heterogeneous chip integration with hybrid bonding technology","datePublished":"2022-01-20T18:59:01+00:00","dateModified":"2023-02-23T21:23:32+00:00","mainEntityOfPage":{"@id":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/46928490\/NEWS\/"},"wordCount":262,"commentCount":0,"publisher":{"@id":"https:\/\/www.asminternational.org\/edfas\/#organization"},"articleSection":["Materials Processing and Treatment","Materials Properties and Performance","news","News Articles"],"inLanguage":"en-US","potentialAction":[{"@type":"CommentAction","name":"Comment","target":["https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/46928490\/NEWS\/#respond"]}]},{"@type":"WebPage","@id":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/46928490\/NEWS\/","url":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/46928490\/NEWS\/","name":"Research collaboration to accelerate heterogeneous chip integration with hybrid bonding technology - Electronic Device Failure Analysis Society","isPartOf":{"@id":"https:\/\/www.asminternational.org\/edfas\/#website"},"datePublished":"2022-01-20T18:59:01+00:00","dateModified":"2023-02-23T21:23:32+00:00","breadcrumb":{"@id":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/46928490\/NEWS\/#breadcrumb"},"inLanguage":"en-US","potentialAction":[{"@type":"ReadAction","target":["https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/46928490\/NEWS\/"]}]},{"@type":"BreadcrumbList","@id":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/46928490\/NEWS\/#breadcrumb","itemListElement":[{"@type":"ListItem","position":1,"name":"Home","item":"https:\/\/www.asminternational.org\/edfas\/"},{"@type":"ListItem","position":2,"name":"Research collaboration to accelerate heterogeneous chip integration with hybrid bonding technology"}]},{"@type":"WebSite","@id":"https:\/\/www.asminternational.org\/edfas\/#website","url":"https:\/\/www.asminternational.org\/edfas\/","name":"Electronic Device Failure Analysis Society","description":"Electronic Device Failure Analysis Society","publisher":{"@id":"https:\/\/www.asminternational.org\/edfas\/#organization"},"potentialAction":[{"@type":"SearchAction","target":{"@type":"EntryPoint","urlTemplate":"https:\/\/www.asminternational.org\/edfas\/?s={search_term_string}"},"query-input":{"@type":"PropertyValueSpecification","valueRequired":true,"valueName":"search_term_string"}}],"inLanguage":"en-US"},{"@type":"Organization","@id":"https:\/\/www.asminternational.org\/edfas\/#organization","name":"Electronic Device Failure Analysis Society","url":"https:\/\/www.asminternational.org\/edfas\/","logo":{"@type":"ImageObject","inLanguage":"en-US","@id":"https:\/\/www.asminternational.org\/edfas\/#\/schema\/logo\/image\/","url":"https:\/\/cdn-prd-main.asm-media.cloud\/uploads\/sites\/41\/2022\/10\/layout_set_logo.png","contentUrl":"https:\/\/cdn-prd-main.asm-media.cloud\/uploads\/sites\/41\/2022\/10\/layout_set_logo.png","width":360,"height":95,"caption":"Electronic Device Failure Analysis Society"},"image":{"@id":"https:\/\/www.asminternational.org\/edfas\/#\/schema\/logo\/image\/"}},{"@type":"Person","@id":"","url":"https:\/\/www.asminternational.org\/edfas\/author\/"}]}},"acf":[],"_links":{"self":[{"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/posts\/5165","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/users\/63103"}],"replies":[{"embeddable":true,"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/comments?post=5165"}],"version-history":[{"count":0,"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/posts\/5165\/revisions"}],"wp:attachment":[{"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/media?parent=5165"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/categories?post=5165"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/tags?post=5165"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}