{"id":5364,"date":"2018-01-22T11:33:06","date_gmt":"2018-01-22T11:33:06","guid":{"rendered":"https:\/\/staging.asminternational.org\/edfas\/micron-and-intel-announce-update-to-nand-memory-joint-development-program\/"},"modified":"2023-02-23T21:24:59","modified_gmt":"2023-02-23T21:24:59","slug":"micron-and-intel-announce-update-to-nand-memory-joint-development-program","status":"publish","type":"post","link":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/31987852\/NEWS\/","title":{"rendered":"Micron and Intel announce update to NAND memory joint development program"},"content":{"rendered":"

Micron, San Jose, Calif., and Intel, Santa Clara,Calif., announce an update to their successful NAND joint development partnership that has helped the companies develop and deliver industry-leading NAND technologies to market.<\/span><\/span><\/p>\n

The announcement involves a mutual agreement to work independently on future generations of 3D NAND. The companies have agreed to complete development of their third generation of 3D NAND technology, which will be delivered toward the end of this year and extending into early 2019. Beyond that technology node, both companies will develop 3D NAND independently in order to better optimize the technology and products for their individual business needs.<\/span><\/span><\/p>\n

Micron and Intel expect no change in the cadence of their respective 3D NAND technology development of future nodes. The two companies are currently ramping products based on their second generation of 3D NAND (64 layer) technology.<\/span><\/span><\/p>\n

Both companies will also continue to jointly develop and manufacture 3D XPoint\u2122 at the Intel-Micron Flash Technologies (IMFT) joint venture fab in Lehi, Utah, which is now entirely focused on 3D XPoint memory production.<\/span><\/span><\/p>\n

www.intel.com<\/span><\/a><\/span><\/p>\n","protected":false},"excerpt":{"rendered":"

Micron, San Jose, Calif., and Intel, Santa Clara,Calif., announce an update to their successful NAND joint development partnership that has helped the companies develop and deliver industry-leading NAND technologies to market.<\/p>\n","protected":false},"author":63103,"featured_media":0,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[434,435,436,1],"tags":[],"class_list":["post-5364","post","type-post","status-publish","format-standard","hentry","category-electronics","category-news","category-news-articles","category-uncategorized"],"yoast_head":"\nMicron and Intel announce update to NAND memory joint development program - Electronic Device Failure Analysis Society<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/31987852\/NEWS\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Micron and Intel announce update to NAND memory joint development program - 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