{"id":5438,"date":"2014-06-23T02:12:19","date_gmt":"2014-06-23T02:12:19","guid":{"rendered":"https:\/\/staging.asminternational.org\/edfas\/iii-v-metal-oxide-semiconductor-fet-performance-exceeds-silicon\/"},"modified":"2023-02-23T21:25:30","modified_gmt":"2023-02-23T21:25:30","slug":"iii-v-metal-oxide-semiconductor-fet-performance-exceeds-silicon","status":"publish","type":"post","link":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/19646709\/NEWS\/","title":{"rendered":"III-V metal-oxide semiconductor FET performance exceeds silicon"},"content":{"rendered":"<p>\n\tResearchers from the University of California, Santa Barbara (UCSB), report that they have developed the highest-performing III-V metal-oxide semiconductor (MOS) field-effect transistors. The UCSB team&#8217;s III-V MOSFETs, for the first time in the industry, exhibit on-current, off-current, and operating voltage comparable to or exceeding production silicon devices \u2014 while being constructed at small dimensions relevant to the VLSI (very-large-scale integration) industry.<\/p>\n<p>\n\tFor the past decade, III-V MOSFETs have been widely studied by a large number of research groups, but no research group had reported a III-V MOSFET with a performance equal to, let alone surpassing, that of a silicon MOSFET of similar size. In particular, UCSB&#8217;s transistors possess 25nm gate lengths, an on-current of 0.5mA, and off-current of 100nA per micron of transistor width, and require only 0.5 volt to operate.<\/p>\n<p>\n\t&#8220;The goal in developing new transistors is to reach or beat performance goals while making the transistor smaller\u2014it is no good getting high performance in a big transistor,&#8221; said Mark Rodwell, professor of Electrical and Computer Engineering, UCSB. &#8220;In time, the UCSB III-V MOSFET should perform significantly better than silicon FinFETs of equal size.&#8221;<\/p>\n<p>\n\tThe UCSB research promises to help deliver higher semiconductor performance at lower power consumption levels for next-generation, high-performance servers. The research is supported by the Semiconductor Research Corporation (SRC), the world&#8217;s leading university-research consortium for semiconductors and related technologies.<\/p>\n<p>\n\t<span style=\"font-family: Helvetica, Arial, sans-serif;font-size: 0.9375em;line-height: 1.333333333em\">To reach this breakthrough in performance, the UCSB team made three key improvements to the III-V MOSFET structure. First, the transistors use extremely thin semiconductor channels, some 2.5nm (17 atoms) thick, with the semiconductor being indium arsenide (InAs). Making such thin layers improves the on-current and reduces the off-current. These ultra-thin layers were developed by UCSB Ph.D student Cheng-Ying Huang under the guidance of Professor Arthur Gossard.<\/span><\/p>\n<p>\n\t<a href=\"http:\/\/semimd.com\/blog\/2014\/06\/10\/research-alert-june-10-2014\/\" style=\"font-family: Helvetica, Arial, sans-serif;font-size: 0.9375em;line-height: 1.333333333em\">http:\/\/semimd.com\/blog\/2014\/06\/10\/research-alert-june-10-2014\/<\/a><\/p>\n<p>\n\t&nbsp;<\/p>\n","protected":false},"excerpt":{"rendered":"<p>Researchers from the University of California, Santa Barbara (UCSB), report that they have developed the highest-performing III-V metal-oxide semiconductor (MOS) field-effect transistors.<\/p>\n","protected":false},"author":63103,"featured_media":0,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[434,450,435,436,1],"tags":[],"class_list":["post-5438","post","type-post","status-publish","format-standard","hentry","category-electronics","category-general","category-news","category-news-articles","category-uncategorized"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.9 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>III-V metal-oxide semiconductor FET performance exceeds silicon - Electronic Device Failure Analysis Society<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/19646709\/NEWS\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"III-V metal-oxide semiconductor FET performance exceeds silicon - Electronic Device Failure Analysis Society\" \/>\n<meta property=\"og:description\" content=\"Researchers from the University of California, Santa Barbara (UCSB), report that they have developed the highest-performing III-V metal-oxide semiconductor (MOS) field-effect transistors.\" \/>\n<meta property=\"og:url\" content=\"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/19646709\/NEWS\/\" \/>\n<meta property=\"og:site_name\" content=\"Electronic Device Failure Analysis Society\" \/>\n<meta property=\"article:published_time\" content=\"2014-06-23T02:12:19+00:00\" \/>\n<meta property=\"article:modified_time\" content=\"2023-02-23T21:25:30+00:00\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" content=\"Written by\" \/>\n\t<meta name=\"twitter:data1\" content=\"\" \/>\n\t<meta name=\"twitter:label2\" content=\"Est. reading time\" \/>\n\t<meta name=\"twitter:data2\" content=\"1 minute\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\\\/\\\/schema.org\",\"@graph\":[{\"@type\":\"Article\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/results\\\/-\\\/journal_content\\\/56\\\/10192\\\/19646709\\\/NEWS\\\/#article\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/results\\\/-\\\/journal_content\\\/56\\\/10192\\\/19646709\\\/NEWS\\\/\"},\"author\":{\"name\":\"\",\"@id\":\"\"},\"headline\":\"III-V metal-oxide semiconductor FET performance exceeds silicon\",\"datePublished\":\"2014-06-23T02:12:19+00:00\",\"dateModified\":\"2023-02-23T21:25:30+00:00\",\"mainEntityOfPage\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/results\\\/-\\\/journal_content\\\/56\\\/10192\\\/19646709\\\/NEWS\\\/\"},\"wordCount\":307,\"commentCount\":0,\"publisher\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#organization\"},\"articleSection\":[\"Electronics\",\"general\",\"news\",\"News Articles\"],\"inLanguage\":\"en-US\",\"potentialAction\":[{\"@type\":\"CommentAction\",\"name\":\"Comment\",\"target\":[\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/results\\\/-\\\/journal_content\\\/56\\\/10192\\\/19646709\\\/NEWS\\\/#respond\"]}]},{\"@type\":\"WebPage\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/results\\\/-\\\/journal_content\\\/56\\\/10192\\\/19646709\\\/NEWS\\\/\",\"url\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/results\\\/-\\\/journal_content\\\/56\\\/10192\\\/19646709\\\/NEWS\\\/\",\"name\":\"III-V metal-oxide semiconductor FET performance exceeds silicon - 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Electronic Device Failure Analysis Society","robots":{"index":"index","follow":"follow","max-snippet":"max-snippet:-1","max-image-preview":"max-image-preview:large","max-video-preview":"max-video-preview:-1"},"canonical":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/19646709\/NEWS\/","og_locale":"en_US","og_type":"article","og_title":"III-V metal-oxide semiconductor FET performance exceeds silicon - Electronic Device Failure Analysis Society","og_description":"Researchers from the University of California, Santa Barbara (UCSB), report that they have developed the highest-performing III-V metal-oxide semiconductor (MOS) field-effect transistors.","og_url":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/19646709\/NEWS\/","og_site_name":"Electronic Device Failure Analysis Society","article_published_time":"2014-06-23T02:12:19+00:00","article_modified_time":"2023-02-23T21:25:30+00:00","twitter_card":"summary_large_image","twitter_misc":{"Written by":"","Est. reading time":"1 minute"},"schema":{"@context":"https:\/\/schema.org","@graph":[{"@type":"Article","@id":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/19646709\/NEWS\/#article","isPartOf":{"@id":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/19646709\/NEWS\/"},"author":{"name":"","@id":""},"headline":"III-V metal-oxide semiconductor FET performance exceeds silicon","datePublished":"2014-06-23T02:12:19+00:00","dateModified":"2023-02-23T21:25:30+00:00","mainEntityOfPage":{"@id":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/19646709\/NEWS\/"},"wordCount":307,"commentCount":0,"publisher":{"@id":"https:\/\/www.asminternational.org\/edfas\/#organization"},"articleSection":["Electronics","general","news","News Articles"],"inLanguage":"en-US","potentialAction":[{"@type":"CommentAction","name":"Comment","target":["https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/19646709\/NEWS\/#respond"]}]},{"@type":"WebPage","@id":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/19646709\/NEWS\/","url":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/19646709\/NEWS\/","name":"III-V metal-oxide semiconductor FET performance exceeds silicon - Electronic Device Failure Analysis Society","isPartOf":{"@id":"https:\/\/www.asminternational.org\/edfas\/#website"},"datePublished":"2014-06-23T02:12:19+00:00","dateModified":"2023-02-23T21:25:30+00:00","breadcrumb":{"@id":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/19646709\/NEWS\/#breadcrumb"},"inLanguage":"en-US","potentialAction":[{"@type":"ReadAction","target":["https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/19646709\/NEWS\/"]}]},{"@type":"BreadcrumbList","@id":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/19646709\/NEWS\/#breadcrumb","itemListElement":[{"@type":"ListItem","position":1,"name":"Home","item":"https:\/\/www.asminternational.org\/edfas\/"},{"@type":"ListItem","position":2,"name":"III-V metal-oxide semiconductor FET performance exceeds silicon"}]},{"@type":"WebSite","@id":"https:\/\/www.asminternational.org\/edfas\/#website","url":"https:\/\/www.asminternational.org\/edfas\/","name":"Electronic Device Failure Analysis Society","description":"Electronic Device Failure Analysis Society","publisher":{"@id":"https:\/\/www.asminternational.org\/edfas\/#organization"},"potentialAction":[{"@type":"SearchAction","target":{"@type":"EntryPoint","urlTemplate":"https:\/\/www.asminternational.org\/edfas\/?s={search_term_string}"},"query-input":{"@type":"PropertyValueSpecification","valueRequired":true,"valueName":"search_term_string"}}],"inLanguage":"en-US"},{"@type":"Organization","@id":"https:\/\/www.asminternational.org\/edfas\/#organization","name":"Electronic Device Failure Analysis Society","url":"https:\/\/www.asminternational.org\/edfas\/","logo":{"@type":"ImageObject","inLanguage":"en-US","@id":"https:\/\/www.asminternational.org\/edfas\/#\/schema\/logo\/image\/","url":"https:\/\/cdn-prd-main.asm-media.cloud\/uploads\/sites\/41\/2022\/10\/layout_set_logo.png","contentUrl":"https:\/\/cdn-prd-main.asm-media.cloud\/uploads\/sites\/41\/2022\/10\/layout_set_logo.png","width":360,"height":95,"caption":"Electronic Device Failure Analysis Society"},"image":{"@id":"https:\/\/www.asminternational.org\/edfas\/#\/schema\/logo\/image\/"}},{"@type":"Person","@id":"","url":"https:\/\/www.asminternational.org\/edfas\/author\/"}]}},"acf":[],"_links":{"self":[{"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/posts\/5438","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/users\/63103"}],"replies":[{"embeddable":true,"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/comments?post=5438"}],"version-history":[{"count":0,"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/posts\/5438\/revisions"}],"wp:attachment":[{"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/media?parent=5438"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/categories?post=5438"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/tags?post=5438"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}