{"id":5517,"date":"2018-01-14T21:12:14","date_gmt":"2018-01-14T21:12:14","guid":{"rendered":"https:\/\/staging.asminternational.org\/edfas\/nordson-acquires-sonoscan-for-analysis-of-electronic-devices-by-acoustic-micro-imaging\/"},"modified":"2023-02-23T21:26:01","modified_gmt":"2023-02-23T21:26:01","slug":"nordson-acquires-sonoscan-for-analysis-of-electronic-devices-by-acoustic-micro-imaging","status":"publish","type":"post","link":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/31594063\/NEWS\/","title":{"rendered":"Nordson acquires Sonoscan for analysis of electronic devices by acoustic micro-imaging"},"content":{"rendered":"

Nordson Corp., Westlake, Ohio, has acquired Sonoscan Inc., Elk Grove Village, Illinois, a designer and manufacturer of acoustic microscopes and sophisticated acoustic micro-imaging systems for a variety of microelectronic, automotive, aerospace, and industrial electronics assembly applications. <\/span><\/span><\/p>\n

“The Sonoscan acquisition broadens the offering to our customers within our Test and Inspection range of products and solutions,” says Joseph Stockunas, Vice President for Nordson’s Advanced Technology Systems segment. “Sonoscan’s acoustic imaging solutions are adjacent and highly complementary to Nordson’s existing bond testing, X-ray, and automated optical inspection solutions, and are sold to the same set of customers.” <\/span><\/span><\/p>\n

Founded in 1974 by Dr. Lawrence Kessler and employing approximately 85 people, Sonoscan will operate within Nordson’s Advanced Technology Systems segment. Since its inception, Sonoscan has been the most trusted authority on the application of acoustic microscopy, also known as acoustic micro imaging. This technology enables scientists to nondestructively find and characterize physical defects such as cracks, voids, delaminations, and porosities that occur during manufacturing, environmental testing, or even component operation. This acquisition builds on Nordson's strategic objective to grow its Electronics Systems business in the advanced semiconductor packaging and automotive electronics markets. <\/span><\/span><\/p>\n

The transaction is not material to Nordson results, and terms of the deal were not disclosed. Nordson engineers, manufactures, and markets differentiated products and systems used to dispense, apply, and control <\/span>adhesives, coatings, polymers, sealants, biomaterials, and other fluids, <\/span>to test and inspect for quality<\/span>, and to <\/span>treat and cure surfaces<\/span>. <\/span><\/span><\/p>\n

www.nordson.com<\/span><\/a> <\/span><\/p>\n

www.sonoscan.com<\/a> <\/span><\/span><\/p>\n

 <\/p>\n","protected":false},"excerpt":{"rendered":"

Nordson Corp., Westlake, Ohio, has acquired Sonoscan Inc., Elk Grove Village, Illinois, a designer and manufacturer of acoustic microscopes and sophisticated acoustic micro-imaging systems used in a variety of microelectronic, automotive, aerospace, and industrial electronics assembly applications.<\/p>\n","protected":false},"author":63103,"featured_media":0,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[448,443,434,435,436,1],"tags":[],"class_list":["post-5517","post","type-post","status-publish","format-standard","hentry","category-aerospace-and-defense","category-automobiles-and-ground-transportation","category-electronics","category-news","category-news-articles","category-uncategorized"],"yoast_head":"\nNordson acquires Sonoscan for analysis of electronic devices by acoustic micro-imaging - Electronic Device Failure Analysis Society<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/31594063\/NEWS\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Nordson acquires Sonoscan for analysis of electronic devices by acoustic micro-imaging - Electronic Device Failure Analysis Society\" \/>\n<meta property=\"og:description\" content=\"Nordson Corp., Westlake, Ohio, has acquired Sonoscan Inc., Elk Grove Village, Illinois, a designer and manufacturer of acoustic microscopes and sophisticated acoustic micro-imaging systems used in a variety of microelectronic, automotive, aerospace, and industrial electronics assembly applications.\" \/>\n<meta property=\"og:url\" content=\"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/31594063\/NEWS\/\" \/>\n<meta property=\"og:site_name\" content=\"Electronic Device Failure Analysis Society\" \/>\n<meta property=\"article:published_time\" content=\"2018-01-14T21:12:14+00:00\" \/>\n<meta property=\"article:modified_time\" content=\"2023-02-23T21:26:01+00:00\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" content=\"Written by\" \/>\n\t<meta name=\"twitter:data1\" content=\"\" \/>\n\t<meta name=\"twitter:label2\" content=\"Est. reading time\" \/>\n\t<meta name=\"twitter:data2\" content=\"1 minute\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\\\/\\\/schema.org\",\"@graph\":[{\"@type\":\"Article\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/results\\\/-\\\/journal_content\\\/56\\\/10192\\\/31594063\\\/NEWS\\\/#article\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/results\\\/-\\\/journal_content\\\/56\\\/10192\\\/31594063\\\/NEWS\\\/\"},\"author\":{\"name\":\"\",\"@id\":\"\"},\"headline\":\"Nordson acquires Sonoscan for analysis of electronic devices by acoustic micro-imaging\",\"datePublished\":\"2018-01-14T21:12:14+00:00\",\"dateModified\":\"2023-02-23T21:26:01+00:00\",\"mainEntityOfPage\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/results\\\/-\\\/journal_content\\\/56\\\/10192\\\/31594063\\\/NEWS\\\/\"},\"wordCount\":271,\"commentCount\":0,\"publisher\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#organization\"},\"articleSection\":[\"Aerospace and Defense\",\"Automobiles and Ground Transportation\",\"Electronics\",\"news\",\"News Articles\"],\"inLanguage\":\"en-US\",\"potentialAction\":[{\"@type\":\"CommentAction\",\"name\":\"Comment\",\"target\":[\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/results\\\/-\\\/journal_content\\\/56\\\/10192\\\/31594063\\\/NEWS\\\/#respond\"]}]},{\"@type\":\"WebPage\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/results\\\/-\\\/journal_content\\\/56\\\/10192\\\/31594063\\\/NEWS\\\/\",\"url\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/results\\\/-\\\/journal_content\\\/56\\\/10192\\\/31594063\\\/NEWS\\\/\",\"name\":\"Nordson acquires Sonoscan for analysis of electronic devices by acoustic micro-imaging - Electronic Device Failure Analysis Society\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#website\"},\"datePublished\":\"2018-01-14T21:12:14+00:00\",\"dateModified\":\"2023-02-23T21:26:01+00:00\",\"breadcrumb\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/results\\\/-\\\/journal_content\\\/56\\\/10192\\\/31594063\\\/NEWS\\\/#breadcrumb\"},\"inLanguage\":\"en-US\",\"potentialAction\":[{\"@type\":\"ReadAction\",\"target\":[\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/results\\\/-\\\/journal_content\\\/56\\\/10192\\\/31594063\\\/NEWS\\\/\"]}]},{\"@type\":\"BreadcrumbList\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/results\\\/-\\\/journal_content\\\/56\\\/10192\\\/31594063\\\/NEWS\\\/#breadcrumb\",\"itemListElement\":[{\"@type\":\"ListItem\",\"position\":1,\"name\":\"Home\",\"item\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/\"},{\"@type\":\"ListItem\",\"position\":2,\"name\":\"Nordson acquires Sonoscan for analysis of electronic devices by acoustic micro-imaging\"}]},{\"@type\":\"WebSite\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#website\",\"url\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/\",\"name\":\"Electronic Device Failure Analysis Society\",\"description\":\"Electronic Device Failure Analysis Society\",\"publisher\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#organization\"},\"potentialAction\":[{\"@type\":\"SearchAction\",\"target\":{\"@type\":\"EntryPoint\",\"urlTemplate\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/?s={search_term_string}\"},\"query-input\":{\"@type\":\"PropertyValueSpecification\",\"valueRequired\":true,\"valueName\":\"search_term_string\"}}],\"inLanguage\":\"en-US\"},{\"@type\":\"Organization\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#organization\",\"name\":\"Electronic Device Failure Analysis Society\",\"url\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/\",\"logo\":{\"@type\":\"ImageObject\",\"inLanguage\":\"en-US\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#\\\/schema\\\/logo\\\/image\\\/\",\"url\":\"https:\\\/\\\/cdn-prd-main.asm-media.cloud\\\/uploads\\\/sites\\\/41\\\/2022\\\/10\\\/layout_set_logo.png\",\"contentUrl\":\"https:\\\/\\\/cdn-prd-main.asm-media.cloud\\\/uploads\\\/sites\\\/41\\\/2022\\\/10\\\/layout_set_logo.png\",\"width\":360,\"height\":95,\"caption\":\"Electronic Device Failure Analysis Society\"},\"image\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#\\\/schema\\\/logo\\\/image\\\/\"}},{\"@type\":\"Person\",\"@id\":\"\",\"url\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/author\\\/\"}]}<\/script>\n<!-- \/ Yoast SEO plugin. -->","yoast_head_json":{"title":"Nordson acquires Sonoscan for analysis of electronic devices by acoustic micro-imaging - Electronic Device Failure Analysis Society","robots":{"index":"index","follow":"follow","max-snippet":"max-snippet:-1","max-image-preview":"max-image-preview:large","max-video-preview":"max-video-preview:-1"},"canonical":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/31594063\/NEWS\/","og_locale":"en_US","og_type":"article","og_title":"Nordson acquires Sonoscan for analysis of electronic devices by acoustic micro-imaging - Electronic Device Failure Analysis Society","og_description":"Nordson Corp., Westlake, Ohio, has acquired Sonoscan Inc., Elk Grove Village, Illinois, a designer and manufacturer of acoustic microscopes and sophisticated acoustic micro-imaging systems used in a variety of microelectronic, automotive, aerospace, and industrial electronics assembly applications.","og_url":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/31594063\/NEWS\/","og_site_name":"Electronic Device Failure Analysis Society","article_published_time":"2018-01-14T21:12:14+00:00","article_modified_time":"2023-02-23T21:26:01+00:00","twitter_card":"summary_large_image","twitter_misc":{"Written by":"","Est. reading time":"1 minute"},"schema":{"@context":"https:\/\/schema.org","@graph":[{"@type":"Article","@id":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/31594063\/NEWS\/#article","isPartOf":{"@id":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/31594063\/NEWS\/"},"author":{"name":"","@id":""},"headline":"Nordson acquires Sonoscan for analysis of electronic devices by acoustic micro-imaging","datePublished":"2018-01-14T21:12:14+00:00","dateModified":"2023-02-23T21:26:01+00:00","mainEntityOfPage":{"@id":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/31594063\/NEWS\/"},"wordCount":271,"commentCount":0,"publisher":{"@id":"https:\/\/www.asminternational.org\/edfas\/#organization"},"articleSection":["Aerospace and Defense","Automobiles and Ground Transportation","Electronics","news","News Articles"],"inLanguage":"en-US","potentialAction":[{"@type":"CommentAction","name":"Comment","target":["https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/31594063\/NEWS\/#respond"]}]},{"@type":"WebPage","@id":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/31594063\/NEWS\/","url":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/31594063\/NEWS\/","name":"Nordson acquires Sonoscan for analysis of electronic devices by acoustic micro-imaging - Electronic Device Failure Analysis Society","isPartOf":{"@id":"https:\/\/www.asminternational.org\/edfas\/#website"},"datePublished":"2018-01-14T21:12:14+00:00","dateModified":"2023-02-23T21:26:01+00:00","breadcrumb":{"@id":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/31594063\/NEWS\/#breadcrumb"},"inLanguage":"en-US","potentialAction":[{"@type":"ReadAction","target":["https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/31594063\/NEWS\/"]}]},{"@type":"BreadcrumbList","@id":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/31594063\/NEWS\/#breadcrumb","itemListElement":[{"@type":"ListItem","position":1,"name":"Home","item":"https:\/\/www.asminternational.org\/edfas\/"},{"@type":"ListItem","position":2,"name":"Nordson acquires Sonoscan for analysis of electronic devices by acoustic micro-imaging"}]},{"@type":"WebSite","@id":"https:\/\/www.asminternational.org\/edfas\/#website","url":"https:\/\/www.asminternational.org\/edfas\/","name":"Electronic Device Failure Analysis Society","description":"Electronic Device Failure Analysis Society","publisher":{"@id":"https:\/\/www.asminternational.org\/edfas\/#organization"},"potentialAction":[{"@type":"SearchAction","target":{"@type":"EntryPoint","urlTemplate":"https:\/\/www.asminternational.org\/edfas\/?s={search_term_string}"},"query-input":{"@type":"PropertyValueSpecification","valueRequired":true,"valueName":"search_term_string"}}],"inLanguage":"en-US"},{"@type":"Organization","@id":"https:\/\/www.asminternational.org\/edfas\/#organization","name":"Electronic Device Failure Analysis Society","url":"https:\/\/www.asminternational.org\/edfas\/","logo":{"@type":"ImageObject","inLanguage":"en-US","@id":"https:\/\/www.asminternational.org\/edfas\/#\/schema\/logo\/image\/","url":"https:\/\/cdn-prd-main.asm-media.cloud\/uploads\/sites\/41\/2022\/10\/layout_set_logo.png","contentUrl":"https:\/\/cdn-prd-main.asm-media.cloud\/uploads\/sites\/41\/2022\/10\/layout_set_logo.png","width":360,"height":95,"caption":"Electronic Device Failure Analysis Society"},"image":{"@id":"https:\/\/www.asminternational.org\/edfas\/#\/schema\/logo\/image\/"}},{"@type":"Person","@id":"","url":"https:\/\/www.asminternational.org\/edfas\/author\/"}]}},"acf":[],"_links":{"self":[{"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/posts\/5517","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/users\/63103"}],"replies":[{"embeddable":true,"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/comments?post=5517"}],"version-history":[{"count":0,"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/posts\/5517\/revisions"}],"wp:attachment":[{"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/media?parent=5517"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/categories?post=5517"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/tags?post=5517"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}