{"id":5775,"date":"2019-12-16T16:16:18","date_gmt":"2019-12-16T16:16:18","guid":{"rendered":"https:\/\/staging.asminternational.org\/edfas\/ultra-tec-top-surface-scanning-improves-final-backside-prep-of-packaged-die\/"},"modified":"2023-02-23T21:27:38","modified_gmt":"2023-02-23T21:27:38","slug":"ultra-tec-top-surface-scanning-improves-final-backside-prep-of-packaged-die","status":"publish","type":"post","link":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/39134174\/NEWS\/","title":{"rendered":"Ultra Tec Top Surface Scanning improves final backside prep of packaged die"},"content":{"rendered":"<p style=\"margin-bottom:.0001pt\"><span style=\"line-height:normal\">Ultra Tec., Santa Ana, Calif., announces that a new physical-contact Top Surface Scanning mode joins the feature set on Ultra Tec\u2019s ASAP-1 in situ selected area prep system. Top Surface Scanning proves advantageous when removing distinct successive material layers within semiconductor packages \u2014 such as multi-die stacks \u2014 where single dies often need to be individually mapped to ensure resultant decapsulation success. <\/span><\/p>\n<p style=\"margin-bottom:.0001pt\">&nbsp;<\/p>\n<p style=\"margin-bottom:.0001pt\"><span style=\"line-height:normal\">Top Surface Scanning, moreover, makes data immediately available to improve the final backside prep of \u2018difficult\u2019 packaged dies &#8211; with a much smaller amount of bulk die material needed for \u2018re-working\u2019 initial lower-fidelity thinning operations \u2013 such as those from low-end flat lapping systems or mills. <\/span><\/p>\n<p style=\"margin-bottom:.0001pt\">&nbsp;<\/p>\n<p style=\"margin-bottom:.0001pt\"><span style=\"line-height:normal\"><a href=\"http:\/\/www.ultratecusa.com\">www.ultratecusa.com<\/a> <\/span><\/p>\n","protected":false},"excerpt":{"rendered":"<p>Ultra Tec., Santa Ana, Calif., announces that a new physical-contact Top Surface Scanning mode joins the feature set on Ultra Tec\u2019s ASAP-1 in situ selected area prep system.<\/p>\n","protected":false},"author":63103,"featured_media":0,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[434,456,435,436,1],"tags":[],"class_list":["post-5775","post","type-post","status-publish","format-standard","hentry","category-electronics","category-metals-and-alloys","category-news","category-news-articles","category-uncategorized"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.9 - 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