{"id":5977,"date":"2022-06-15T12:30:53","date_gmt":"2022-06-15T12:30:53","guid":{"rendered":"https:\/\/staging.asminternational.org\/edfas\/new-thermal-management-technology-for-electronic-devices-reduces-bulk-while-improving-cooling\/"},"modified":"2023-02-23T21:29:01","modified_gmt":"2023-02-23T21:29:01","slug":"new-thermal-management-technology-for-electronic-devices-reduces-bulk-while-improving-cooling","status":"publish","type":"post","link":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/48835927\/NEWS\/","title":{"rendered":"New thermal management technology for electronic devices reduces bulk while improving cooling"},"content":{"rendered":"

A team from the University of Illinois at Urbana-Champaign (UIUC), Ill., and UC Berkeley, Calif., published a paper in Nature Electronics <\/em>detailing a new cooling method that offers a host of benefits, not the least of which is space efficiency that offers a substantial increase over conventional approaches in devices\u2019 power per unit volume.<\/p>\n

Electronic devices generate heat, and that heat must be dissipated. If it isn\u2019t, the high temperatures can compromise device function, or even damage the devices and their surroundings.<\/p>\n

Tarek Gebrael, the lead author and a UIUC Ph.D. student in mechanical engineering, explains that existing heat dissipation solutions suffer from three shortcomings. \u201cFirst, they can be expensive and difficult to scale up,\u201d he says. Heat spreaders made of diamond, for example, are sometimes used at the chip level, but they aren\u2019t cheap.<\/p>\n

Second, conventional heat spreading approaches generally require that the heat spreader and a heat sink\u2014a device for dissipating heat efficiently, toward which the spreader directs the heat\u2014be attached on top of the electronic device. Unfortunately, \u201cin many cases, most of the heat is generated underneath the electronic device,\u201d meaning that the cooling mechanism isn\u2019t where it needs to be for optimal performance.<\/p>\n

Third, state-of-the-art heat spreaders can\u2019t be installed directly on the surface of the electronics; a layer of \u201cthermal interface material\u201d must be sandwiched between them to ensure good contact. However, due to its poor heat transfer characteristics, that middle layer also introduces a negative impact on thermal performance.<\/p>\n

The new solution addresses all three of those problems.<\/p>\n

First, the primary material used is copper, which is relatively inexpensive. Second, the copper coating entirely \u201cengulfs\u201d the device, covering the top, the bottom, and the sides, as a conformal coating that covers all the exposed surfaces\u2014so that no heat-producing regions are neglected. Third, there is no need for a thermal interface material; the device and copper heat spreader are essentially one piece. Further, there is no need for a heat sink.<\/p>\n

\u201cIn our study, we compared our coatings to standard heat sinking methods,\u201d Gebrael says. \u201cWhat we showed is that you can get very similar thermal performance, or even better performance, with the coatings compared to the heat sinks.\u201d Nevertheless, a device using the new solution is dramatically smaller than one using heat sinks, which are bulky. \u201cAnd this translates to much higher power per unit volume. We were able to demonstrate a 740% increase in the power per unit volume.\u201d<\/p>\n

That makes a huge difference in the real world. \u201cLet\u2019s say you have multiple printed circuit boards,\u201d says Gebrael. \u201cYou can stack many more printed circuit boards in the same volume when you are using our coating, compared to if you are using conventional liquid- or air-cooled heat sinks.\u201d<\/p>\n

Co-author Nenad Miljkovic, an associate professor of mechanical science & engineering at UIUC and Gebrael\u2019s advisor, says, \u201cThis technology bridges two separate thermal management approaches: near-junction device-level cooling, and board-level heat spreading. Tarek\u2019s work in collaboration with the team at UC Berkeley has enabled us to use a non-siloed electro-thermo-mechanical technology development approach to develop a solution to a difficult problem for multiple industries.\u201d<\/p>\n

The team is continuing to extend the work, investigating the coatings\u2019 reliability and durability, which are critical to industry acceptance. The paper already showed that the coatings can be used both in air and in water, the latter of which is needed for \u201cimmersion cooling\u201d applications. The team is now looking at reliability in boiling water, boiling dielectric fluids, and high-voltage environments. They will also implement the coatings on full-scale power modules and GPU cards, whereas they used only simple test boards in the initial work.<\/p>\n

Those ongoing efforts should take the new solution a big step closer towards transition to industry and commercial production for a variety of applications, including power electronics cooling, data center thermal management, and electric machine cooling.<\/p>\n

 <\/p>\n

 <\/p>\n

For more information:<\/p>\n

University of Illinois at Urbana-Champaign<\/p>\n

https:\/\/mrl.illinois.edu\/<\/a><\/p>\n

 <\/p>\n","protected":false},"excerpt":{"rendered":"

A team from the University of Illinois at Urbana-Champaign , Ill., and UC Berkeley, Calif., published a paper in Nature Electronics detailing a new cooling method that offers a host of benefits, not the least of which is space efficiency that offers a substantial increase over conventional approaches in devices\u2019 power per unit volume.<\/p>\n","protected":false},"author":63103,"featured_media":0,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[437,456,435,436,1],"tags":[],"class_list":["post-5977","post","type-post","status-publish","format-standard","hentry","category-materials-testing-and-evaluation","category-metals-and-alloys","category-news","category-news-articles","category-uncategorized"],"yoast_head":"\nNew thermal management technology for electronic devices reduces bulk while improving cooling - Electronic Device Failure Analysis Society<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/48835927\/NEWS\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"New thermal management technology for electronic devices reduces bulk while improving cooling - Electronic Device Failure Analysis Society\" \/>\n<meta property=\"og:description\" content=\"A team from the University of Illinois at Urbana-Champaign , Ill., and UC Berkeley, Calif., published a paper in Nature Electronics detailing a new cooling method that offers a host of benefits, not the least of which is space efficiency that offers a substantial increase over conventional approaches in devices\u2019 power per unit volume.\" \/>\n<meta property=\"og:url\" content=\"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/48835927\/NEWS\/\" \/>\n<meta property=\"og:site_name\" content=\"Electronic Device Failure Analysis Society\" \/>\n<meta property=\"article:published_time\" content=\"2022-06-15T12:30:53+00:00\" \/>\n<meta property=\"article:modified_time\" content=\"2023-02-23T21:29:01+00:00\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" content=\"Written by\" \/>\n\t<meta name=\"twitter:data1\" content=\"\" \/>\n\t<meta name=\"twitter:label2\" content=\"Est. reading time\" \/>\n\t<meta name=\"twitter:data2\" content=\"3 minutes\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\\\/\\\/schema.org\",\"@graph\":[{\"@type\":\"Article\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/results\\\/-\\\/journal_content\\\/56\\\/10192\\\/48835927\\\/NEWS\\\/#article\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/results\\\/-\\\/journal_content\\\/56\\\/10192\\\/48835927\\\/NEWS\\\/\"},\"author\":{\"name\":\"\",\"@id\":\"\"},\"headline\":\"New thermal management technology for electronic devices reduces bulk while improving cooling\",\"datePublished\":\"2022-06-15T12:30:53+00:00\",\"dateModified\":\"2023-02-23T21:29:01+00:00\",\"mainEntityOfPage\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/results\\\/-\\\/journal_content\\\/56\\\/10192\\\/48835927\\\/NEWS\\\/\"},\"wordCount\":678,\"commentCount\":0,\"publisher\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#organization\"},\"articleSection\":[\"Materials Testing and Evaluation\",\"Metals and Alloys\",\"news\",\"News Articles\"],\"inLanguage\":\"en-US\",\"potentialAction\":[{\"@type\":\"CommentAction\",\"name\":\"Comment\",\"target\":[\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/results\\\/-\\\/journal_content\\\/56\\\/10192\\\/48835927\\\/NEWS\\\/#respond\"]}]},{\"@type\":\"WebPage\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/results\\\/-\\\/journal_content\\\/56\\\/10192\\\/48835927\\\/NEWS\\\/\",\"url\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/results\\\/-\\\/journal_content\\\/56\\\/10192\\\/48835927\\\/NEWS\\\/\",\"name\":\"New thermal management technology for electronic devices reduces bulk while improving cooling - Electronic Device Failure Analysis Society\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#website\"},\"datePublished\":\"2022-06-15T12:30:53+00:00\",\"dateModified\":\"2023-02-23T21:29:01+00:00\",\"breadcrumb\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/results\\\/-\\\/journal_content\\\/56\\\/10192\\\/48835927\\\/NEWS\\\/#breadcrumb\"},\"inLanguage\":\"en-US\",\"potentialAction\":[{\"@type\":\"ReadAction\",\"target\":[\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/results\\\/-\\\/journal_content\\\/56\\\/10192\\\/48835927\\\/NEWS\\\/\"]}]},{\"@type\":\"BreadcrumbList\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/results\\\/-\\\/journal_content\\\/56\\\/10192\\\/48835927\\\/NEWS\\\/#breadcrumb\",\"itemListElement\":[{\"@type\":\"ListItem\",\"position\":1,\"name\":\"Home\",\"item\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/\"},{\"@type\":\"ListItem\",\"position\":2,\"name\":\"New thermal management technology for electronic devices reduces bulk while improving cooling\"}]},{\"@type\":\"WebSite\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#website\",\"url\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/\",\"name\":\"Electronic Device Failure Analysis Society\",\"description\":\"Electronic Device Failure Analysis Society\",\"publisher\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#organization\"},\"potentialAction\":[{\"@type\":\"SearchAction\",\"target\":{\"@type\":\"EntryPoint\",\"urlTemplate\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/?s={search_term_string}\"},\"query-input\":{\"@type\":\"PropertyValueSpecification\",\"valueRequired\":true,\"valueName\":\"search_term_string\"}}],\"inLanguage\":\"en-US\"},{\"@type\":\"Organization\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#organization\",\"name\":\"Electronic Device Failure Analysis Society\",\"url\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/\",\"logo\":{\"@type\":\"ImageObject\",\"inLanguage\":\"en-US\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#\\\/schema\\\/logo\\\/image\\\/\",\"url\":\"https:\\\/\\\/cdn-prd-main.asm-media.cloud\\\/uploads\\\/sites\\\/41\\\/2022\\\/10\\\/layout_set_logo.png\",\"contentUrl\":\"https:\\\/\\\/cdn-prd-main.asm-media.cloud\\\/uploads\\\/sites\\\/41\\\/2022\\\/10\\\/layout_set_logo.png\",\"width\":360,\"height\":95,\"caption\":\"Electronic Device Failure Analysis Society\"},\"image\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#\\\/schema\\\/logo\\\/image\\\/\"}},{\"@type\":\"Person\",\"@id\":\"\",\"url\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/author\\\/\"}]}<\/script>\n<!-- \/ Yoast SEO plugin. -->","yoast_head_json":{"title":"New thermal management technology for electronic devices reduces bulk while improving cooling - Electronic Device Failure Analysis Society","robots":{"index":"index","follow":"follow","max-snippet":"max-snippet:-1","max-image-preview":"max-image-preview:large","max-video-preview":"max-video-preview:-1"},"canonical":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/48835927\/NEWS\/","og_locale":"en_US","og_type":"article","og_title":"New thermal management technology for electronic devices reduces bulk while improving cooling - Electronic Device Failure Analysis Society","og_description":"A team from the University of Illinois at Urbana-Champaign , Ill., and UC Berkeley, Calif., published a paper in Nature Electronics detailing a new cooling method that offers a host of benefits, not the least of which is space efficiency that offers a substantial increase over conventional approaches in devices\u2019 power per unit volume.","og_url":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/48835927\/NEWS\/","og_site_name":"Electronic Device Failure Analysis Society","article_published_time":"2022-06-15T12:30:53+00:00","article_modified_time":"2023-02-23T21:29:01+00:00","twitter_card":"summary_large_image","twitter_misc":{"Written by":"","Est. reading time":"3 minutes"},"schema":{"@context":"https:\/\/schema.org","@graph":[{"@type":"Article","@id":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/48835927\/NEWS\/#article","isPartOf":{"@id":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/48835927\/NEWS\/"},"author":{"name":"","@id":""},"headline":"New thermal management technology for electronic devices reduces bulk while improving cooling","datePublished":"2022-06-15T12:30:53+00:00","dateModified":"2023-02-23T21:29:01+00:00","mainEntityOfPage":{"@id":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/48835927\/NEWS\/"},"wordCount":678,"commentCount":0,"publisher":{"@id":"https:\/\/www.asminternational.org\/edfas\/#organization"},"articleSection":["Materials Testing and Evaluation","Metals and Alloys","news","News Articles"],"inLanguage":"en-US","potentialAction":[{"@type":"CommentAction","name":"Comment","target":["https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/48835927\/NEWS\/#respond"]}]},{"@type":"WebPage","@id":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/48835927\/NEWS\/","url":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/48835927\/NEWS\/","name":"New thermal management technology for electronic devices reduces bulk while improving cooling - Electronic Device Failure Analysis Society","isPartOf":{"@id":"https:\/\/www.asminternational.org\/edfas\/#website"},"datePublished":"2022-06-15T12:30:53+00:00","dateModified":"2023-02-23T21:29:01+00:00","breadcrumb":{"@id":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/48835927\/NEWS\/#breadcrumb"},"inLanguage":"en-US","potentialAction":[{"@type":"ReadAction","target":["https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/48835927\/NEWS\/"]}]},{"@type":"BreadcrumbList","@id":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/48835927\/NEWS\/#breadcrumb","itemListElement":[{"@type":"ListItem","position":1,"name":"Home","item":"https:\/\/www.asminternational.org\/edfas\/"},{"@type":"ListItem","position":2,"name":"New thermal management technology for electronic devices reduces bulk while improving cooling"}]},{"@type":"WebSite","@id":"https:\/\/www.asminternational.org\/edfas\/#website","url":"https:\/\/www.asminternational.org\/edfas\/","name":"Electronic Device Failure Analysis Society","description":"Electronic Device Failure Analysis Society","publisher":{"@id":"https:\/\/www.asminternational.org\/edfas\/#organization"},"potentialAction":[{"@type":"SearchAction","target":{"@type":"EntryPoint","urlTemplate":"https:\/\/www.asminternational.org\/edfas\/?s={search_term_string}"},"query-input":{"@type":"PropertyValueSpecification","valueRequired":true,"valueName":"search_term_string"}}],"inLanguage":"en-US"},{"@type":"Organization","@id":"https:\/\/www.asminternational.org\/edfas\/#organization","name":"Electronic Device Failure Analysis Society","url":"https:\/\/www.asminternational.org\/edfas\/","logo":{"@type":"ImageObject","inLanguage":"en-US","@id":"https:\/\/www.asminternational.org\/edfas\/#\/schema\/logo\/image\/","url":"https:\/\/cdn-prd-main.asm-media.cloud\/uploads\/sites\/41\/2022\/10\/layout_set_logo.png","contentUrl":"https:\/\/cdn-prd-main.asm-media.cloud\/uploads\/sites\/41\/2022\/10\/layout_set_logo.png","width":360,"height":95,"caption":"Electronic Device Failure Analysis Society"},"image":{"@id":"https:\/\/www.asminternational.org\/edfas\/#\/schema\/logo\/image\/"}},{"@type":"Person","@id":"","url":"https:\/\/www.asminternational.org\/edfas\/author\/"}]}},"acf":[],"_links":{"self":[{"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/posts\/5977","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/users\/63103"}],"replies":[{"embeddable":true,"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/comments?post=5977"}],"version-history":[{"count":0,"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/posts\/5977\/revisions"}],"wp:attachment":[{"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/media?parent=5977"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/categories?post=5977"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/tags?post=5977"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}