The U.S. Department of Defense has awarded Intel Federal LLC, Santa Clara, Calif., the second phase of its State-of-the-Art Heterogeneous Integration Prototype (SHIP) program. The SHIP program enables the U.S. government to access Intel\u2019s state-of-the-art semiconductor packaging capabilities in Arizona and Oregon and take advantage of capabilities created by Intel\u2019s tens of billions of dollars of annual R&D and manufacturing investment. The project is executed by the Naval Surface Warfare Center, Crane Division, and administered by the National Security Technology Accelerator.<\/p>\n
\u201cIntel and the U.S. government share a priority to advance domestic semiconductor manufacturing technology. The SHIP program will enable the Department of Defense to take advantage of Intel\u2019s advanced semiconductor packaging capabilities, diversifying their supply chain and protecting their intellectual property while also supporting ongoing semiconductor R&D in the U.S. and preserving critical capabilities onshore,\u201d says Jim Brinker, president and general manager of Intel Federal LLC.<\/p>\n
SHIP is sponsored by the Office of the Under Secretary of Defense for Research and Engineering and funded by the Trusted and Assured Microelectronics program. The second phase of the program will develop prototypes of multichip packages and accelerate advancement of interface standards, protocols and security for heterogeneous systems. SHIP prototypes will integrate special-purpose government chips with Intel\u2019s advanced, commercially available silicon products, including field programmable gate arrays, application-specific integrated circuits and CPUs.<\/p>\n
This combination of technologies provides new paths for the U.S. government\u2019s industry partners to develop and modernize the government\u2019s mission-critical systems while taking advantage of Intel\u2019s U.S. manufacturing capabilities.<\/p>\n
Heterogeneous packaging allows the assembly of multiple, separately manufactured integrated circuit dies onto a single package to increase performance while reducing power, size and weight. SHIP provides the U.S. government access to Intel\u2019s advanced heterogeneous packaging technologies, including embedded multi-die interconnect bridge, 3D Foveros, and Co-EMIB, combining both EMIB and Foveros.<\/p>\n