{"id":7081,"date":"2023-08-18T09:02:30","date_gmt":"2023-08-18T03:32:30","guid":{"rendered":"https:\/\/staging.asminternational.org\/edfas\/flaky-compound-to-prevent-computer-chips-from-getting-fried\/"},"modified":"2024-01-09T18:28:07","modified_gmt":"2024-01-09T18:28:07","slug":"flaky-compound-to-prevent-computer-chips-from-getting-fried","status":"publish","type":"post","link":"https:\/\/www.asminternational.org\/edfas\/flaky-compound-to-prevent-computer-chips-from-getting-fried\/","title":{"rendered":"Flaky compound to prevent computer chips from getting fried"},"content":{"rendered":"

A research team from Skoltech, Russia, has improved the properties of a polymer used in 3D printing by adding boron nitride \u201cflakes\u201d to the photopolymer, doubling the material’s thermal conductivity. This could prevent microchips encapsulated with the polymer from overheating and thus enable microelectronic devices that are smaller and more powerful. The paper has been published in Polymers<\/em>.<\/p>\n

\u201cThe printing technology we devised is a step toward fusing microelectronics and additive technology,\u201d study co-author Assistant Professor Stanislav Evlashin of Skoltech Materials commented. \u201cWhile prior research tended to focus on printing conductive contacts for flexible electronics, we undertook to improve the properties of polymers suitable for microchip packaging\u2014that is, for making the outer capsule of a microchip.\u201d<\/p>\n

As electronics get smaller, the issue of overheating gets more acute. When crammed into a smaller volume, the same amount of power results in faster overheating and device failure. To address this, materials with better thermal conductivity need to be used.<\/p>\n

The chips themselves are made of silicon, which conducts heat well, but the capsule housing the device might get in the way of heat transfer because of its low thermal conductivity. The material used for this external packaging in the case of devices of complex shape is photopolymer\u2014a paste that solidifies when exposed to radiation in a 3D printer. This photopolymer is the material whose properties were improved in the Skoltech study.<\/p>\n

For this photopolymer to be applicable in microchip packaging, it should conduct heat well while not conducting electricity. The researchers were able to double the material’s thermal conductivity without compromising its insulating properties or mechanical strength by filling the polymer with a boron nitride compound, in the form of flakes, in the amount of 20% by volume.<\/p>\n

The technique used for printing is known as digital light polymerization. It has a high resolution and is suitable for packaging devices of complex shapes. It can also be used to print the capsule directly on a silicon chip. The researchers believe the polymer’s enhanced thermal conductivity will ensure the stability and integrity of electronic components and allow them to work at higher operating characteristics.<\/p>\n

 <\/p>\n

Image \u2013 \u201cClean\u201d denotes a component made of the regular commercially used photopolymer, and “BN 20%” indicates the same part manufactured using that polymer with the addition of 20% by volume of boron nitride. As seen in the thermal image on the right, the BN filling leads to efficient heat dissipation, reducing the risk of overheating for microchips surrounded by this material. Courtesy of: Julia Bondareva et al.\/Polymers.<\/em><\/p>\n

 <\/p>\n

For more information:<\/p>\n

Skolkovo Institute of Science and Technology<\/p>\n

https:\/\/www.skoltech.ru\/en<\/a><\/p>\n","protected":false},"excerpt":{"rendered":"

A research team from Skoltech, Russia, has improved the properties of a polymer used in 3D printing by adding boron nitride \u201cflakes\u201d to the photopolymer, doubling the material’s thermal conductivity.<\/p>\n","protected":false},"author":63116,"featured_media":7898,"comment_status":"closed","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[434,439,441,435,436,570,498,571],"tags":[],"class_list":["post-7081","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-electronics","category-materials-processing-and-treatment","category-materials-properties-and-performance","category-news","category-news-articles","category-package-level-analysis","category-polymers","category-thermal-properties"],"yoast_head":"\nFlaky compound to prevent computer chips from getting fried - Electronic Device Failure Analysis Society<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.asminternational.org\/edfas\/flaky-compound-to-prevent-computer-chips-from-getting-fried\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Flaky compound to prevent computer chips from getting fried - 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