{"id":7387,"date":"2023-11-24T20:08:19","date_gmt":"2023-11-25T01:08:19","guid":{"rendered":"https:\/\/staging.asminternational.org\/edfas\/thermo-fisher-scientific-announces-new-electron-beam-fault-localization-system-for-analyzing-advanced-logic-semiconductors\/"},"modified":"2023-11-25T01:08:20","modified_gmt":"2023-11-25T01:08:20","slug":"thermo-fisher-scientific-announces-new-electron-beam-fault-localization-system-for-analyzing-advanced-logic-semiconductors","status":"publish","type":"post","link":"https:\/\/www.asminternational.org\/edfas\/thermo-fisher-scientific-announces-new-electron-beam-fault-localization-system-for-analyzing-advanced-logic-semiconductors\/","title":{"rendered":"Thermo Fisher Scientific announces new electron beam fault localization system for analyzing advanced logic semiconductors"},"content":{"rendered":"<p>Thermo Fisher Scientific, Hillsboro, Ore., the world leader in serving science, introduced the Thermo Scientific Meridian EX System\u2014 an electron-beam-based failure analysis solution designed to enable precise fault localization on advanced semiconductor logic technologies.<\/p>\n<p>As semiconductor manufacturers adopt more complex architectures to deliver higher performing, energy efficient semiconductors, they are pushing the boundaries of existing failure analysis solutions. Where optical fault isolation tools can still be used for mainstream semiconductors, advanced logic devices now require new solutions to isolate and identify subtle electrical defects which may be fully obscured by metal interconnects on the backside and frontside of the device.<\/p>\n<p>Thermo Fisher\u2019s new Meridian EX System uses an electron beam to probe the device under test. The much smaller wavelength of electron beams versus lasers can help users achieve a 10X spatial resolution improvement compared to commercially available optical laser-based fault isolation solutions. This improvement helps eliminate \u201ccross-talk\u201d from adjacent circuits to deliver more reliable characterization data.<\/p>\n<p>In addition, Meridian EX\u2019s electron beam can enable users to capture dynamic data off metal interconnects, such as power distribution layers, which optical fault isolations systems cannot.<\/p>\n<p>\u201cChip manufacturers are developing devices with smaller features, new power distribution architectures and new materials, resulting in an increased number of process defects that must be localized and characterized,\u201d said Mohan Iyer, vice president and general manager, semiconductor, at Thermo Fisher Scientific. \u201cAs an industry leader in failure analysis workflows and applications, we\u2019re proud to help semiconductor manufacturers address key fault isolation challenges by introducing the Meridian EX and adding electron beam probing technology to Thermo Fisher\u2019s suite of advanced device analysis workflows.\u201d<\/p>\n<p>Features include:<\/p>\n<ul>\n<li>A new, dedicated electron column design enables precision, through metal probing.<\/li>\n<li>A new, high-speed beam switching sub-system enables localization of subtle chip defects.<\/li>\n<li>Industry standard Thermo Scientific Meridian software interface for ease of use and rapid integration into existing lab failure analysis workflows.<\/li>\n<\/ul>\n<p>&nbsp;<\/p>\n<p>Image &#8211;<em> Introducing the Thermo Scientific Meridian EX Semiconductor Fault Isolation System Courtesy of: Business Wire.<\/em><\/p>\n<p>&nbsp;<\/p>\n<p>For more information:<\/p>\n<p>Thermo Fisher Scientifi<\/p>\n<p><a href=\"http:\/\/www.thermofisher.com\">www.thermofisher.com<\/a><\/p>\n<p>&nbsp;<\/p>\n<p>Thermo Scientific Meridian EX System<\/p>\n<p><a href=\"http:\/\/thermofisher.com\/meridian-ex\">thermofisher.com\/meridian-ex<\/a><\/p>\n<p>&nbsp;<\/p>\n<p>&nbsp;<\/p>\n","protected":false},"excerpt":{"rendered":"<p>Thermo Fisher Scientific, Hillsboro, Ore., the world leader in serving science, introduced the Thermo Scientific Meridian EX System\u2014 an electron-beam-based failure analysis solution designed to enable precise fault localization on advanced semiconductor logic technologies that  helps users localize defects within complex power networks and achieve 10X improvement in spatial resolution compared to optical fault isolation solutions.<\/p>\n","protected":false},"author":63245,"featured_media":7388,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[499,582,460,441,437,517,435,436,576,512],"tags":[],"class_list":["post-7387","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-electrical-properties","category-equipment-and-instrumentation","category-failure-analysis","category-materials-properties-and-performance","category-materials-testing-and-evaluation","category-microelectronic-failure-analysis","category-news","category-news-articles","category-processes-and-procedures","category-testing-and-monitoring"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.9 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>Thermo Fisher Scientific announces new electron beam fault localization system for analyzing advanced logic 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