{"id":8333,"date":"2024-10-17T18:36:10","date_gmt":"2024-10-17T22:36:10","guid":{"rendered":"https:\/\/staging.asminternational.org\/edfas\/faraday-enhances-3d-ic-design-service-with-ansys-multiphysics-analysis\/"},"modified":"2024-10-17T22:37:39","modified_gmt":"2024-10-17T22:37:39","slug":"faraday-enhances-3d-ic-design-service-with-ansys-multiphysics-analysis","status":"publish","type":"post","link":"https:\/\/www.asminternational.org\/edfas\/faraday-enhances-3d-ic-design-service-with-ansys-multiphysics-analysis\/","title":{"rendered":"Faraday enhances 3D-IC design service with Ansys multiphysics analysis"},"content":{"rendered":"

Faraday Technology Corporation, Pittsburgh, Pa., a leading application specific integrated circuits (ASIC) design service and IP provider, is expanding its use of Ansys technology to enhance its capabilities in developing advanced designs for multi-die 2.5D\/3D-ICs \u2014 critical for artificial intelligence (AI), IoT, and 5G applications. With support from Ansys, Faraday will empower its customers to explore more robust design options for more innovative products.<\/p>\n

Faraday recently announced a 2.5D\/3D-IC advanced package service to address exploding demand for multi-die designs that target products with better performance and lower power consumption. To meet this demand, engineers need the right multiphysics analysis tools to verify that chip designs include reliable signal and structural integrity and reliable power distribution before it goes to fabrication. This challenge is compounded by the trend toward developing denser chips that are more vulnerable to EM issues.<\/p>\n

Adding RaptorX into the design flow will enable Faraday to increase precision and efficiency in its development process. Moreover, it enables predictively accurate EM modeling and analysis for advanced 3D-IC products, ensuring data transfer meets stringent modern standards. This will improve the design’s fidelity, enhance performance and reliability, and accelerate time-to-market.<\/p>\n

\u201cOur extensive silicon IP allows our customers to start designing from a solid foundation, enabling them to focus solely on innovation and differentiating themselves in the market,\u201d said C.H. Chien, vice president of R&D at Faraday. \u201cFabrication is exceptionally expensive and there is no room for error. So, keeping the overall project cost low is paramount, and it starts with the initial design. With the addition of RaptorX in this phase, we can offer customers an efficient workflow that includes design verification and signoff as well as access to top-tier test and fabrication services, removing doubts about the chip\u2019s performance and longevity.\u201d<\/p>\n

\u201cAnsys\u2019 focus on multiphysics platforms enables innovators like Faraday to address key challenges for 3D-IC and accelerate their time-to-market,\u201d said John Lee, vice president and general manager of the semiconductor, electronics, and optics business unit at Ansys. \u201cOur industry-leading tools facilitate meticulous modeling and analysis of electromagnetic phenomena, helping our customers remain at the forefront of technological advancements in 5G, AI, and IoT.\u201d<\/p>\n

 <\/p>\n

Image – EMag extraction of an interposer lane, including 48 signals in the presence of their respective VDD\/VSS network and indicative simulation results, and S-Parameter analysis and transient (eye diagram) analysis of a signal line.<\/em><\/p>\n

 <\/p>\n

For more information:<\/p>\n

Ansys<\/p>\n

https:\/\/www.ansys.com<\/a><\/p>\n

Faraday Technology Corporation<\/p>\n

http:\/\/www.faraday-tech.com\/<\/a><\/p>\n

 <\/p>\n

 <\/p>\n","protected":false},"excerpt":{"rendered":"

Faraday Technology Corporation, Pittsburgh, Pa., a leading application specific integrated circuits (ASIC) design service and IP provider, is expanding its use of Ansys technology to enhance its capabilities in developing advanced designs for multi-die 2.5D\/3D-ICs \u2014 critical for artificial intelligence (AI), IoT, and 5G applications. With support from Ansys, Faraday will empower its customers to… View Article<\/a><\/p>\n","protected":false},"author":63245,"featured_media":8336,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[499,434,444,435,436,576],"tags":[],"class_list":["post-8333","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-electrical-properties","category-electronics","category-industries-and-applications","category-news","category-news-articles","category-processes-and-procedures"],"yoast_head":"\nFaraday enhances 3D-IC design service with Ansys multiphysics analysis - Electronic Device Failure Analysis Society<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.asminternational.org\/edfas\/faraday-enhances-3d-ic-design-service-with-ansys-multiphysics-analysis\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Faraday enhances 3D-IC design service with Ansys multiphysics analysis - Electronic Device Failure Analysis Society\" \/>\n<meta property=\"og:description\" content=\"Faraday Technology Corporation, Pittsburgh, Pa., a leading application specific integrated circuits (ASIC) design service and IP provider, is expanding its use of Ansys technology to enhance its capabilities in developing advanced designs for multi-die 2.5D\/3D-ICs \u2014 critical for artificial intelligence (AI), IoT, and 5G applications. With support from Ansys, Faraday will empower its customers to... 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