{"id":8337,"date":"2024-10-17T18:51:29","date_gmt":"2024-10-17T22:51:29","guid":{"rendered":"https:\/\/staging.asminternational.org\/edfas\/materials-analysis-technology-releases-a-mou-with-sgs\/"},"modified":"2024-10-17T22:51:30","modified_gmt":"2024-10-17T22:51:30","slug":"materials-analysis-technology-releases-a-mou-with-sgs","status":"publish","type":"post","link":"https:\/\/www.asminternational.org\/edfas\/materials-analysis-technology-releases-a-mou-with-sgs\/","title":{"rendered":"Materials Analysis Technology releases a MOU with SGS"},"content":{"rendered":"<p>Materials Analysis Technology Inc., Taiwan, and Swiss SGS Taiwan Ltd. signed a Memorandum of Understanding (MOU) in Oct. 2024, with the goal of providing comprehensive ISO 26262 functional safety product certification services, AEC-Q automotive electronic component reliability verification services, and soft error rate (SER) assessment and analysis in the automotive semiconductor and electronic component industries in Taiwan.<\/p>\n<p>This collaboration not only aims to enhance customers\u2019 awareness of the importance of functional safety product certification, but also to promote the widespread application of related services, thus improving the competitiveness of clients\u2019 products in the automotive supply chain market.<\/p>\n<p>The partnership aims to meet clients\u2019 needs by combining SGS\u2019s expertise in functional safety and cybersecurity certification for automotive electronics, soft error radiation testing, planning and evaluation, system-level reliability, EMC, and wireless communication testing and certification services with Materials Analysis Technology\u2019s knowledge and technical support in AEC-Q automotive electronic component reliability verification, automotive semiconductor and component materials, and failure analysis.<\/p>\n<p>This collaboration focuses on the design and testing validation phases of the ISO 26262 V-model development process for automotive electronic products, ensuring a seamless transition from planning to practical verification.<\/p>\n<p>SGS, the world\u2019s leading inspection and certification organization, offers services across various industries including electronics, automotive, machinery, food, textiles, construction, industrial products, petrochemicals, minerals, agriculture, environmental protection, public utilities, and life sciences. SGS has recently assisted automotive supply chain manufacturers in implementing ISO 26262 functional safety and ISO 21434 cybersecurity processes and product certification, helping them meet the requirements of the ISO 26262 functional safety V-model development process in early design phase. At the system level, SGS also provides reliability, EMC, wireless communication, and product safety certification services.<\/p>\n<p>Materials Analysis Technology Inc. is well-equipped with automotive-standard laboratories, qualified by ISO 9000, ISO 17025, ISO 15408, and ISO 27001 certifications. With extensive experience in automotive electronic certification, Materials Analysis Technology Inc. has successfully guided over 60 clients through AEC-Q automotive electronic component certification. This wealth of experience, coupled with the relevant automotive certification laboratories, allows Materials Analysis Technology Inc. to deliver highly credible and high-quality practical verification services within the ISO 26262 V-model.<\/p>\n<p>&nbsp;<\/p>\n<p>For more information:<\/p>\n<p>Materials Analysis Technology Inc.<\/p>\n<p><a href=\"https:\/\/www.matek.com\/\">https:\/\/www.matek.com\/<\/a><\/p>\n<p>SGS<\/p>\n<p><a href=\"https:\/\/www.sgs.com\/en\">https:\/\/www.sgs.com\/en<\/a><\/p>\n<p>&nbsp;<\/p>\n","protected":false},"excerpt":{"rendered":"<p>Materials Analysis Technology Inc., Taiwan, and Swiss SGS Taiwan Ltd. signed a memorandum of understanding with the goal of providing comprehensive ISO 26262 functional safety product certification services, AEC-Q automotive electronic component reliability verification services, and soft error rate assessment and analysis in the automotive semiconductor and electronic component industries in Taiwan. <\/p>\n","protected":false},"author":63245,"featured_media":8338,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[443,614,444,441,435,436,488,469,470,512],"tags":[],"class_list":["post-8337","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-automobiles-and-ground-transportation","category-automotive","category-industries-and-applications","category-materials-properties-and-performance","category-news","category-news-articles","category-process-and-quality-control","category-properties-and-performance","category-testing-and-characterization","category-testing-and-monitoring"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.9 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>Materials Analysis Technology releases a MOU with SGS - Electronic Device Failure Analysis Society<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.asminternational.org\/edfas\/materials-analysis-technology-releases-a-mou-with-sgs\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Materials Analysis Technology releases a MOU with SGS - Electronic Device Failure Analysis Society\" \/>\n<meta property=\"og:description\" content=\"Materials Analysis Technology Inc., Taiwan, and Swiss SGS Taiwan Ltd. signed a memorandum of understanding with the goal of providing comprehensive ISO 26262 functional safety product certification services, AEC-Q automotive electronic component reliability verification services, and soft error rate assessment and analysis in the automotive semiconductor and electronic component industries in Taiwan.\" \/>\n<meta property=\"og:url\" content=\"https:\/\/www.asminternational.org\/edfas\/materials-analysis-technology-releases-a-mou-with-sgs\/\" \/>\n<meta property=\"og:site_name\" content=\"Electronic Device Failure Analysis Society\" \/>\n<meta property=\"article:published_time\" content=\"2024-10-17T22:51:29+00:00\" \/>\n<meta property=\"article:modified_time\" content=\"2024-10-17T22:51:30+00:00\" \/>\n<meta property=\"og:image\" content=\"https:\/\/www.asminternational.org\/app\/uploads\/sites\/41\/2024\/10\/EDFAS__102424__MaTek__250.jpg\" \/>\n\t<meta property=\"og:image:width\" content=\"250\" \/>\n\t<meta property=\"og:image:height\" content=\"164\" \/>\n\t<meta property=\"og:image:type\" content=\"image\/jpeg\" \/>\n<meta name=\"author\" content=\"Debbie Sniderman\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" content=\"Written by\" \/>\n\t<meta name=\"twitter:data1\" content=\"Debbie Sniderman\" \/>\n\t<meta name=\"twitter:label2\" content=\"Est. reading time\" \/>\n\t<meta name=\"twitter:data2\" content=\"2 minutes\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\\\/\\\/schema.org\",\"@graph\":[{\"@type\":\"Article\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/materials-analysis-technology-releases-a-mou-with-sgs\\\/#article\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/materials-analysis-technology-releases-a-mou-with-sgs\\\/\"},\"author\":{\"name\":\"Debbie Sniderman\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#\\\/schema\\\/person\\\/135b2d8ac98a363d0bd9ec033a2904ad\"},\"headline\":\"Materials Analysis Technology releases a MOU with SGS\",\"datePublished\":\"2024-10-17T22:51:29+00:00\",\"dateModified\":\"2024-10-17T22:51:30+00:00\",\"mainEntityOfPage\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/materials-analysis-technology-releases-a-mou-with-sgs\\\/\"},\"wordCount\":367,\"publisher\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#organization\"},\"image\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/materials-analysis-technology-releases-a-mou-with-sgs\\\/#primaryimage\"},\"thumbnailUrl\":\"https:\\\/\\\/cdn-prd-main.asm-media.cloud\\\/uploads\\\/sites\\\/41\\\/2024\\\/10\\\/EDFAS__102424__MaTek__250.jpg\",\"articleSection\":[\"Automobiles and Ground Transportation\",\"Automotive\",\"Industries and Applications\",\"Materials Properties and Performance\",\"news\",\"News Articles\",\"Process and Quality Control\",\"Properties and Performance\",\"Testing and Characterization\",\"Testing and Monitoring\"],\"inLanguage\":\"en-US\"},{\"@type\":\"WebPage\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/materials-analysis-technology-releases-a-mou-with-sgs\\\/\",\"url\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/materials-analysis-technology-releases-a-mou-with-sgs\\\/\",\"name\":\"Materials Analysis Technology releases a MOU with SGS - Electronic Device Failure Analysis Society\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#website\"},\"primaryImageOfPage\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/materials-analysis-technology-releases-a-mou-with-sgs\\\/#primaryimage\"},\"image\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/materials-analysis-technology-releases-a-mou-with-sgs\\\/#primaryimage\"},\"thumbnailUrl\":\"https:\\\/\\\/cdn-prd-main.asm-media.cloud\\\/uploads\\\/sites\\\/41\\\/2024\\\/10\\\/EDFAS__102424__MaTek__250.jpg\",\"datePublished\":\"2024-10-17T22:51:29+00:00\",\"dateModified\":\"2024-10-17T22:51:30+00:00\",\"breadcrumb\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/materials-analysis-technology-releases-a-mou-with-sgs\\\/#breadcrumb\"},\"inLanguage\":\"en-US\",\"potentialAction\":[{\"@type\":\"ReadAction\",\"target\":[\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/materials-analysis-technology-releases-a-mou-with-sgs\\\/\"]}]},{\"@type\":\"ImageObject\",\"inLanguage\":\"en-US\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/materials-analysis-technology-releases-a-mou-with-sgs\\\/#primaryimage\",\"url\":\"https:\\\/\\\/cdn-prd-main.asm-media.cloud\\\/uploads\\\/sites\\\/41\\\/2024\\\/10\\\/EDFAS__102424__MaTek__250.jpg\",\"contentUrl\":\"https:\\\/\\\/cdn-prd-main.asm-media.cloud\\\/uploads\\\/sites\\\/41\\\/2024\\\/10\\\/EDFAS__102424__MaTek__250.jpg\",\"width\":250,\"height\":164},{\"@type\":\"BreadcrumbList\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/materials-analysis-technology-releases-a-mou-with-sgs\\\/#breadcrumb\",\"itemListElement\":[{\"@type\":\"ListItem\",\"position\":1,\"name\":\"Home\",\"item\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/\"},{\"@type\":\"ListItem\",\"position\":2,\"name\":\"Materials Analysis Technology releases a MOU with SGS\"}]},{\"@type\":\"WebSite\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#website\",\"url\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/\",\"name\":\"Electronic Device Failure Analysis Society\",\"description\":\"Electronic Device Failure Analysis Society\",\"publisher\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#organization\"},\"potentialAction\":[{\"@type\":\"SearchAction\",\"target\":{\"@type\":\"EntryPoint\",\"urlTemplate\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/?s={search_term_string}\"},\"query-input\":{\"@type\":\"PropertyValueSpecification\",\"valueRequired\":true,\"valueName\":\"search_term_string\"}}],\"inLanguage\":\"en-US\"},{\"@type\":\"Organization\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#organization\",\"name\":\"Electronic Device Failure Analysis Society\",\"url\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/\",\"logo\":{\"@type\":\"ImageObject\",\"inLanguage\":\"en-US\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#\\\/schema\\\/logo\\\/image\\\/\",\"url\":\"https:\\\/\\\/cdn-prd-main.asm-media.cloud\\\/uploads\\\/sites\\\/41\\\/2022\\\/10\\\/layout_set_logo.png\",\"contentUrl\":\"https:\\\/\\\/cdn-prd-main.asm-media.cloud\\\/uploads\\\/sites\\\/41\\\/2022\\\/10\\\/layout_set_logo.png\",\"width\":360,\"height\":95,\"caption\":\"Electronic Device Failure Analysis Society\"},\"image\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#\\\/schema\\\/logo\\\/image\\\/\"}},{\"@type\":\"Person\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#\\\/schema\\\/person\\\/135b2d8ac98a363d0bd9ec033a2904ad\",\"name\":\"Debbie Sniderman\",\"url\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/author\\\/dsniderman\\\/\"}]}<\/script>\n<!-- \/ Yoast SEO plugin. -->","yoast_head_json":{"title":"Materials Analysis Technology releases a MOU with SGS - Electronic Device Failure Analysis Society","robots":{"index":"index","follow":"follow","max-snippet":"max-snippet:-1","max-image-preview":"max-image-preview:large","max-video-preview":"max-video-preview:-1"},"canonical":"https:\/\/www.asminternational.org\/edfas\/materials-analysis-technology-releases-a-mou-with-sgs\/","og_locale":"en_US","og_type":"article","og_title":"Materials Analysis Technology releases a MOU with SGS - Electronic Device Failure Analysis Society","og_description":"Materials Analysis Technology Inc., Taiwan, and Swiss SGS Taiwan Ltd. signed a memorandum of understanding with the goal of providing comprehensive ISO 26262 functional safety product certification services, AEC-Q automotive electronic component reliability verification services, and soft error rate assessment and analysis in the automotive semiconductor and electronic component industries in Taiwan.","og_url":"https:\/\/www.asminternational.org\/edfas\/materials-analysis-technology-releases-a-mou-with-sgs\/","og_site_name":"Electronic Device Failure Analysis Society","article_published_time":"2024-10-17T22:51:29+00:00","article_modified_time":"2024-10-17T22:51:30+00:00","og_image":[{"width":250,"height":164,"url":"https:\/\/www.asminternational.org\/app\/uploads\/sites\/41\/2024\/10\/EDFAS__102424__MaTek__250.jpg","type":"image\/jpeg"}],"author":"Debbie Sniderman","twitter_card":"summary_large_image","twitter_misc":{"Written by":"Debbie Sniderman","Est. reading time":"2 minutes"},"schema":{"@context":"https:\/\/schema.org","@graph":[{"@type":"Article","@id":"https:\/\/www.asminternational.org\/edfas\/materials-analysis-technology-releases-a-mou-with-sgs\/#article","isPartOf":{"@id":"https:\/\/www.asminternational.org\/edfas\/materials-analysis-technology-releases-a-mou-with-sgs\/"},"author":{"name":"Debbie Sniderman","@id":"https:\/\/www.asminternational.org\/edfas\/#\/schema\/person\/135b2d8ac98a363d0bd9ec033a2904ad"},"headline":"Materials Analysis Technology releases a MOU with SGS","datePublished":"2024-10-17T22:51:29+00:00","dateModified":"2024-10-17T22:51:30+00:00","mainEntityOfPage":{"@id":"https:\/\/www.asminternational.org\/edfas\/materials-analysis-technology-releases-a-mou-with-sgs\/"},"wordCount":367,"publisher":{"@id":"https:\/\/www.asminternational.org\/edfas\/#organization"},"image":{"@id":"https:\/\/www.asminternational.org\/edfas\/materials-analysis-technology-releases-a-mou-with-sgs\/#primaryimage"},"thumbnailUrl":"https:\/\/cdn-prd-main.asm-media.cloud\/uploads\/sites\/41\/2024\/10\/EDFAS__102424__MaTek__250.jpg","articleSection":["Automobiles and Ground Transportation","Automotive","Industries and Applications","Materials Properties and Performance","news","News Articles","Process and Quality Control","Properties and Performance","Testing and Characterization","Testing and Monitoring"],"inLanguage":"en-US"},{"@type":"WebPage","@id":"https:\/\/www.asminternational.org\/edfas\/materials-analysis-technology-releases-a-mou-with-sgs\/","url":"https:\/\/www.asminternational.org\/edfas\/materials-analysis-technology-releases-a-mou-with-sgs\/","name":"Materials Analysis Technology releases a MOU with SGS - Electronic Device Failure Analysis Society","isPartOf":{"@id":"https:\/\/www.asminternational.org\/edfas\/#website"},"primaryImageOfPage":{"@id":"https:\/\/www.asminternational.org\/edfas\/materials-analysis-technology-releases-a-mou-with-sgs\/#primaryimage"},"image":{"@id":"https:\/\/www.asminternational.org\/edfas\/materials-analysis-technology-releases-a-mou-with-sgs\/#primaryimage"},"thumbnailUrl":"https:\/\/cdn-prd-main.asm-media.cloud\/uploads\/sites\/41\/2024\/10\/EDFAS__102424__MaTek__250.jpg","datePublished":"2024-10-17T22:51:29+00:00","dateModified":"2024-10-17T22:51:30+00:00","breadcrumb":{"@id":"https:\/\/www.asminternational.org\/edfas\/materials-analysis-technology-releases-a-mou-with-sgs\/#breadcrumb"},"inLanguage":"en-US","potentialAction":[{"@type":"ReadAction","target":["https:\/\/www.asminternational.org\/edfas\/materials-analysis-technology-releases-a-mou-with-sgs\/"]}]},{"@type":"ImageObject","inLanguage":"en-US","@id":"https:\/\/www.asminternational.org\/edfas\/materials-analysis-technology-releases-a-mou-with-sgs\/#primaryimage","url":"https:\/\/cdn-prd-main.asm-media.cloud\/uploads\/sites\/41\/2024\/10\/EDFAS__102424__MaTek__250.jpg","contentUrl":"https:\/\/cdn-prd-main.asm-media.cloud\/uploads\/sites\/41\/2024\/10\/EDFAS__102424__MaTek__250.jpg","width":250,"height":164},{"@type":"BreadcrumbList","@id":"https:\/\/www.asminternational.org\/edfas\/materials-analysis-technology-releases-a-mou-with-sgs\/#breadcrumb","itemListElement":[{"@type":"ListItem","position":1,"name":"Home","item":"https:\/\/www.asminternational.org\/edfas\/"},{"@type":"ListItem","position":2,"name":"Materials Analysis Technology releases a MOU with SGS"}]},{"@type":"WebSite","@id":"https:\/\/www.asminternational.org\/edfas\/#website","url":"https:\/\/www.asminternational.org\/edfas\/","name":"Electronic Device Failure Analysis Society","description":"Electronic Device Failure Analysis Society","publisher":{"@id":"https:\/\/www.asminternational.org\/edfas\/#organization"},"potentialAction":[{"@type":"SearchAction","target":{"@type":"EntryPoint","urlTemplate":"https:\/\/www.asminternational.org\/edfas\/?s={search_term_string}"},"query-input":{"@type":"PropertyValueSpecification","valueRequired":true,"valueName":"search_term_string"}}],"inLanguage":"en-US"},{"@type":"Organization","@id":"https:\/\/www.asminternational.org\/edfas\/#organization","name":"Electronic Device Failure Analysis Society","url":"https:\/\/www.asminternational.org\/edfas\/","logo":{"@type":"ImageObject","inLanguage":"en-US","@id":"https:\/\/www.asminternational.org\/edfas\/#\/schema\/logo\/image\/","url":"https:\/\/cdn-prd-main.asm-media.cloud\/uploads\/sites\/41\/2022\/10\/layout_set_logo.png","contentUrl":"https:\/\/cdn-prd-main.asm-media.cloud\/uploads\/sites\/41\/2022\/10\/layout_set_logo.png","width":360,"height":95,"caption":"Electronic Device Failure Analysis Society"},"image":{"@id":"https:\/\/www.asminternational.org\/edfas\/#\/schema\/logo\/image\/"}},{"@type":"Person","@id":"https:\/\/www.asminternational.org\/edfas\/#\/schema\/person\/135b2d8ac98a363d0bd9ec033a2904ad","name":"Debbie Sniderman","url":"https:\/\/www.asminternational.org\/edfas\/author\/dsniderman\/"}]}},"acf":[],"_links":{"self":[{"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/posts\/8337","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/users\/63245"}],"replies":[{"embeddable":true,"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/comments?post=8337"}],"version-history":[{"count":0,"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/posts\/8337\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/media\/8338"}],"wp:attachment":[{"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/media?parent=8337"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/categories?post=8337"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/tags?post=8337"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}