Around the globe day and night, the microelectronics behind much of modern technology help run computers, medical devices and state-of-the-art instruments that power scientific discoveries. But all of that technology consumes energy, and adding artificial intelligence to the mix increases our energy needs dramatically. Some experts caution that this pace of energy usage is unsustainable.<\/p>\n
To tackle this challenge, the Department of Energy (DOE) has announced funding $179 million for three Microelectronics Science Research Centers that bring together multi-institutional, multidisciplinary projects in partnership with industry. The centers are organized around making microelectronics more energy efficient and able to operate better in extreme environments.<\/p>\n
The DOE\u2019s SLAC National Accelerator Laboratory will lead two projects in the Microelectronics Energy Efficiency Research Center for Advanced Technologies (MEERCAT). The lab will also partner in projects for the Extreme Lithography & Materials Innovation Center (ELMIC) and Co-design & Heterogeneous Integration for Microelectronics in Extreme Environments (CHIME) center.<\/p>\n
Existing methods for shrinking devices are approaching their limits, so researchers must find a fresh approach to microelectronics that balances demands for more computing power and handling more data while reducing energy consumption. To address these challenges, MEERCAT is poised to innovate the design and discovery of new materials, devices and systems architectures for microelectronics to push the limits of current computing and sensing capabilities, critical areas for the DOE scientific mission.<\/p>\n
The center will host Enabling Science for Transformative Energy-Efficient Microelectronics (ESTEEM), a project led by Paul McIntyre, SLAC associate lab director for the Stanford Synchrotron Radiation Lightsource, and includes partners from Stanford University, Georgia Institute of Technology, Northwestern University, University of Tennessee, Knoxville, and University of Texas, San Antonio. The team will concentrate on advancing new methods for manufacturing, metrology, design and simulation of energy-efficient microelectronics, including discovery of nanostructured materials, new device architectures and software-hardware integration.<\/p>\n
In their quest, researchers are \u201cfinding ways to vertically stack devices through new manufacturing methods,\u201d said McIntyre, and looking to the human brain for inspiration. For example, instead of improving the current computer hardware configuration, where data is shuttled back and forth through relatively long wires connecting separate logic and memory chips, the team will integrate several functions into the same component or device.<\/p>\n
\u201cThe brain is a very energy-efficient system compared to a silicon-based computer,\u201d said McIntyre.<\/p>\n
Implementing these ideas will require an \u201catoms-to-algorithms strategy\u201d to control physical processes across wide-ranging distance and time scales and to map these processes to software. To optimize these efforts, the team will work on all of these areas simultaneously \u2013 an approach called co-design. SLAC brings its world-leading X-ray and ultrafast instruments and cryogenic electron microscopes to this challenge, as well as expertise in materials science and device design.<\/p>\n
State-of-the-art instruments across the DOE national laboratories speed scientific discovery and generate massive amounts of data at blazing speeds. Conventional methods of saving data and then analyzing it on a computer will no longer be sufficient, so researchers are turning to extracting useful information in real time by reimagining many aspects of the data collection and analysis process of sensing systems \u2013 networks of sensors that detect and measure environmental phenomena.<\/p>\n
Also part of MEERCAT, the Adaptive Ultra-Fast Energy-Efficient Intelligent Sensing Technologies (AUREIS) project, led by Angelo Dragone, SLAC deputy associate lab director in the Technology Innovation Directorate, will focus on redesigning the sensing systems to intelligently process and analyze the raw data as close to the sensor as possible, reducing the amount of data that arrives to the computer. Through co-design, the team, composed of researchers from across SLAC and collaborators from six other national laboratories and universities, will explore new materials, computing architectures, AI and machine learning algorithms and fabrication processes to develop adaptive, ultrafast, intelligent and energy-efficient sensing technologies.<\/p>\n
\u201cWe have long-standing expertise and capabilities at the lab in developing detectors for X-ray science and high energy physics,\u201d said Dragone. \u201cAt the same time, we leverage AI and machine learning to support complex workflows and edge computing.\u201d Between SLAC and the partner institutions, the AUREIS team will have access to world-class facilities for the design, fabrication and characterization of sensors and circuits, for example, the Stanford Nanofabrication Facility and Stanford Nano Shared Facilities; the SLAC Shared Science Data Facility; and the design, assembly and test facilities within the SLAC Instrumentation Division.<\/p>\n
Making and operating microelectronics devices can involve extremely cold, high radiation and high magnetic field environments. SLAC\u2019s work on scientific instruments for high-energy physics experiments, quantum sensing and ultrafast X-ray science brings unique expertise in designing semiconductors, microelectronics circuits and systems to work in such extreme environments.<\/p>\n
The goal of ELMIC is to integrate new materials and processes for future microelectronics, focusing on areas such as plasma-based nanofabrication, extreme ultraviolet (EUV) sources and new materials systems just a few atoms or molecules thick, known as two-dimensional materials.<\/p>\n
Siegfried Glenzer, director of SLAC\u2019s High Energy Density Science division, will partner in the High Conversion Efficiency 2 um (micrometer) Laser-Driven Sources for EUV Lithography and Plasma Science project, led by Lawrence Livermore National Laboratory. To make chips in a more energy efficient manner, the team is working on a novel plasma source that can emit light in the extreme ultraviolet wavelength. The project will use SLAC\u2019s advanced technology in target systems, which help with alignment and measurements, and expertise in laser-plasma interactions.<\/p>\n
Meanwhile, CHIME will bring together projects that optimize and advance next-generation technologies from the atomic scale to the fully integrated instrument for use in challenging environments.<\/p>\n
Within CHIME, Technology Innovation Directorate staff scientist Lorenzo Rota is partnering in the Fermilab-led Single Photon Detectors Integrated with Cryogenic Electronics (SPICE) project, which aims to develop advanced devices for detecting fundamental particles, shedding light on how the universe works. To facilitate these cutting-edge experiments, the SPICE team will focus on the co-design and integration of new materials, sensors and circuits operating at extremely cold temperatures. The project will draw upon SLAC\u2019s extensive experience in designing important components in these detectors, called image sensors, and in designing and developing X-ray detectors for scientific exploration.<\/p>\n
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Image – The Microelectronics Science Research Centers will study novel, efficient microelectronics technologies and enable transformative applications in computing and sensing, such as this front-end module of SLAC\u2019s ePixUHR, an ultrafast 100,000 frames-per-second detector for the LCLS.<\/em><\/p>\n <\/p>\n For more information:<\/p>\n SLAC National Accelerator Laboratory <\/p>\n","protected":false},"excerpt":{"rendered":" The Department of Energy has announced funding $179 million for three Microelectronics Science Research Centers that bring together multi-institutional, multidisciplinary projects in partnership with industry organized around making microelectronics more energy efficient and able to operate better in extreme environments.<\/p>\n","protected":false},"author":63245,"featured_media":8558,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[499,457,501,603,684,437,486,435,436,464,605,470,580],"tags":[],"class_list":["post-8557","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-electrical-properties","category-electronic-materials","category-electronics-and-microelectronics","category-environments","category-low-temperature-environments","category-materials-testing-and-evaluation","category-microstructures","category-news","category-news-articles","category-research-and-development","category-space","category-testing-and-characterization","category-us-government-other"],"yoast_head":"\n
\nhttps:\/\/www6.slac.stanford.edu\/<\/p>\n