{"id":8815,"date":"2025-06-19T19:05:22","date_gmt":"2025-06-19T23:05:22","guid":{"rendered":"https:\/\/staging.asminternational.org\/edfas\/applied-materials-and-cea-leti-expand-joint-lab-to-drive-innovation-in-specialty-chips\/"},"modified":"2025-06-19T23:05:23","modified_gmt":"2025-06-19T23:05:23","slug":"applied-materials-and-cea-leti-expand-joint-lab-to-drive-innovation-in-specialty-chips","status":"publish","type":"post","link":"https:\/\/www.asminternational.org\/edfas\/applied-materials-and-cea-leti-expand-joint-lab-to-drive-innovation-in-specialty-chips\/","title":{"rendered":"Applied Materials and CEA-Leti expand joint lab to drive innovation in specialty chips"},"content":{"rendered":"

Applied Materials, Inc., Santa Clara, Calif., and CEA-Leti, France, announced the next phase of their longstanding collaboration to accelerate innovation in specialty semiconductors. Under a memorandum of understanding (MOU), the organizations plan to expand their joint lab and develop materials engineering solutions to address emerging infrastructure challenges in AI data centers.<\/p>\n

The joint lab is focused on device innovations for chipmakers serving ICAPS markets (IoT, Communications, Automotive, Power and Sensors). These specialty chips are used in a wide range of applications \u2013 from industrial automation to electric vehicles \u2013 and they play a critical role managing data and power distribution within data centers. Growing resource demands in AI infrastructure have highlighted the need for a new wave of innovation in ICAPS chips to enable more energy-efficient computing.<\/p>\n

Under the new arrangement, Applied and CEA-Leti plan to expand the lab with new equipment and capabilities that move beyond individual process steps to include full-flow development of specialty devices. Additionally, the lab would be equipped with state-of-the-art advanced packaging tools to support heterogeneous integration of chips across different wafer types and process nodes \u2013 enabling entirely new classes of specialty devices for a range of next-generation applications.<\/p>\n

The joint facility features several Applied Materials wafer processing systems together with CEA-Leti\u2019s world-class capabilities for evaluating performance of new materials and device validation. The upgraded lab is expected to strengthen the chipmaking ecosystem in France by further expanding the technology hub in Grenoble, a leading site for collaborative innovation across government, academia and industry. The lab also marks an extension of Applied\u2019s global EPIC Platform, a new high-velocity innovation model designed to accelerate commercialization of new chip technologies. Applied and CEA-Leti will be able to leverage the R&D work taking place across Applied\u2019s global innovation centers to drive progress in specialty semiconductor technologies.<\/p>\n

\u201cApplied Materials and CEA-Leti have a long history of successful collaboration, and we are excited to strengthen our capabilities for accelerating innovation and commercialization of next-generation specialty chips,\u201d said Aninda Moitra, corporate vice president and general manager of Applied Materials\u2019 ICAPS business. \u201cOur combined expertise will help foster breakthroughs and push the boundaries of semiconductor innovation, contributing to sustainable advancements in a range of critical applications for the AI era.\u201d<\/p>\n

S\u00e9bastian Dauv\u00e9, CEO of CEA-Leti, said the first phase of the expanded collaboration laid important groundwork for addressing materials-engineering challenges of specialty semiconductor devices.<\/p>\n

\u201cBuilding on this momentum, the joint lab\u2019s new focus on energy-efficient solutions for AI data-center infrastructure reflects our shared commitment to making technological progress that meets both industrial and societal needs. The extended collaboration also leverages our complementary strengths to accelerate innovation at the system level, while supporting sustainable growth in France\u2019s semiconductor ecosystem,\u201d he said.<\/p>\n

 <\/p>\n

For more information:<\/p>\n

Applied Materials
\nwww.appliedmaterials.com<\/a><\/p>\n

CEA-Leti
\nwww.leti-cea.com<\/a><\/p>\n

 <\/p>\n","protected":false},"excerpt":{"rendered":"

Applied Materials, Inc., Santa Clara, Calif., and CEA-Leti, France, announced the next phase of their longstanding collaboration to accelerate innovation in specialty semiconductors, expanding their joint lab and developing materials engineering solutions to address emerging infrastructure challenges in AI data centers.<\/p>\n","protected":false},"author":63245,"featured_media":8816,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[443,614,434,501,444,435,436],"tags":[],"class_list":["post-8815","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-automobiles-and-ground-transportation","category-automotive","category-electronics","category-electronics-and-microelectronics","category-industries-and-applications","category-news","category-news-articles"],"yoast_head":"\nApplied Materials and CEA-Leti expand joint lab to drive innovation in specialty chips - 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