{"id":8865,"date":"2025-08-22T00:41:32","date_gmt":"2025-08-22T04:41:32","guid":{"rendered":"https:\/\/staging.asminternational.org\/edfas\/unlocking-spad-technology-for-advanced-imaging-applications-in-microscopy-and-beyond\/"},"modified":"2025-08-22T04:41:33","modified_gmt":"2025-08-22T04:41:33","slug":"unlocking-spad-technology-for-advanced-imaging-applications-in-microscopy-and-beyond","status":"publish","type":"post","link":"https:\/\/www.asminternational.org\/edfas\/unlocking-spad-technology-for-advanced-imaging-applications-in-microscopy-and-beyond\/","title":{"rendered":"Unlocking SPAD technology for advanced imaging applications in microscopy and beyond"},"content":{"rendered":"<p>Carl Zeiss Microscopy GmbH, Germany, has acquired all equity shares of Pi Imaging Technology SA, based in Lausanne, Switzerland. Pi Imaging Technology SA now operates as \u201cPi Imaging Technology SA \u2013 a ZEISS company\u201d. The Lausanne location with all employees will be retained.<\/p>\n<p>Pi Imaging Technology SA has been a trusted partner of ZEISS Research Microscopy Solutions for many years. To continue and deepen a successful long-term collaboration, ZEISS now purchased all equity shares of Pi Imaging Technology.<\/p>\n<p>The Swiss-based sensing provider focuses on the development of single-photon avalanche diode (SPAD) arrays and image sensors, engineered using cutting-edge semiconductor technology. SPAD is a type of photo detector that can detect very weak light signals, even down to the level of individual photons. SPADs are commonly used in a variety of applications in everyday life, industry and various research fields.<\/p>\n<p>\u201cThe goal of the acquisition is to combine the innovative SPAD technology with ZEISS microscopy solutions and jointly further develop them, thereby expanding our market-leading position. With the acquisition of Pi Imaging Technology SA, we are investing in a technology that secures our future core business and enables further growth\u201d, says Dr. Michael Albiez, head of ZEISS Research Microscopy Solutions.<\/p>\n<p>SPAD detectors from Pi Imaging Technology SA will complement the current and future sensor technologies used in ZEISS high-end microscopes. The combination of Pi Imaging Technology SA&#8217;s technology and ZEISS microscopy solutions will enable innovative solutions for researchers in the field of high-end fluorescence microscopy in the future. The integration of SPAD technology into ZEISS microscopes improves both the quality and throughput in microscopic imaging in life sciences and so opens new technological possibilities and applications. Since SPAD detectors offer exceptional sensitivity in low-light conditions, they allow researchers to study molecular environments and interactions with remarkable clarity, for example.<\/p>\n<p>\u201cWe achieved pioneering milestones by being the first company to integrate a SPAD array into a commercial microscope in 2020 and subsequently introducing the first SPAD camera to the market in 2021\u201d, says Michel Antolovic, managing director and co-founder of Pi Imaging Technology. \u201cI am very pleased that after many years of trusting collaboration with ZEISS, we are now taking the next step and integrating our entire business into the ZEISS Group. We will merge our innovation capabilities and together shape the field of light detection.\u201d<\/p>\n<p>Following the acquisition, ZEISS customers can expect advanced imaging applications with the next generation of detectors.<\/p>\n<p>&nbsp;<\/p>\n<p>For more information:<\/p>\n<p>Carl Zeiss AG<br \/>\n<a href=\"http:\/\/www.zeiss.com\">www.zeiss.com<\/a><\/p>\n<p>ZEISS Research Microscopy Solutions<br \/>\n<a href=\"http:\/\/www.zeiss.com\/microscopy\">www.zeiss.com\/microscopy<\/a><\/p>\n","protected":false},"excerpt":{"rendered":"<p>Carl Zeiss Microscopy GmbH, Germany, has acquired all equity shares of the Swiss company Pi Imaging Technology SA, developer of single-photon avalanche diode arrays and image sensors.<\/p>\n","protected":false},"author":63245,"featured_media":8866,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[434,510,458,517,435,436],"tags":[],"class_list":["post-8865","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-electronics","category-materials-characterization","category-metallography-and-microstructures","category-microelectronic-failure-analysis","category-news","category-news-articles"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.9 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>Unlocking SPAD technology for advanced imaging applications in microscopy and beyond - Electronic Device Failure Analysis Society<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.asminternational.org\/edfas\/unlocking-spad-technology-for-advanced-imaging-applications-in-microscopy-and-beyond\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Unlocking SPAD technology for advanced imaging applications in microscopy and beyond - Electronic Device Failure Analysis Society\" \/>\n<meta property=\"og:description\" content=\"Carl Zeiss Microscopy GmbH, Germany, has acquired all equity shares of the Swiss company Pi Imaging Technology SA, developer of single-photon avalanche diode arrays and image sensors.\" \/>\n<meta property=\"og:url\" content=\"https:\/\/www.asminternational.org\/edfas\/unlocking-spad-technology-for-advanced-imaging-applications-in-microscopy-and-beyond\/\" \/>\n<meta property=\"og:site_name\" content=\"Electronic Device Failure Analysis Society\" \/>\n<meta property=\"article:published_time\" content=\"2025-08-22T04:41:32+00:00\" \/>\n<meta property=\"article:modified_time\" content=\"2025-08-22T04:41:33+00:00\" \/>\n<meta property=\"og:image\" content=\"https:\/\/www.asminternational.org\/app\/uploads\/sites\/41\/2025\/08\/EDFAS__082825__Zeiss__400.webp\" \/>\n\t<meta property=\"og:image:width\" content=\"400\" \/>\n\t<meta property=\"og:image:height\" content=\"346\" \/>\n\t<meta property=\"og:image:type\" content=\"image\/jpeg\" \/>\n<meta name=\"author\" content=\"Debbie Sniderman\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" content=\"Written by\" \/>\n\t<meta name=\"twitter:data1\" content=\"Debbie Sniderman\" \/>\n\t<meta name=\"twitter:label2\" content=\"Est. reading time\" \/>\n\t<meta name=\"twitter:data2\" content=\"2 minutes\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\\\/\\\/schema.org\",\"@graph\":[{\"@type\":\"Article\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/unlocking-spad-technology-for-advanced-imaging-applications-in-microscopy-and-beyond\\\/#article\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/unlocking-spad-technology-for-advanced-imaging-applications-in-microscopy-and-beyond\\\/\"},\"author\":{\"name\":\"Debbie Sniderman\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#\\\/schema\\\/person\\\/135b2d8ac98a363d0bd9ec033a2904ad\"},\"headline\":\"Unlocking SPAD technology for advanced imaging applications in microscopy and beyond\",\"datePublished\":\"2025-08-22T04:41:32+00:00\",\"dateModified\":\"2025-08-22T04:41:33+00:00\",\"mainEntityOfPage\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/unlocking-spad-technology-for-advanced-imaging-applications-in-microscopy-and-beyond\\\/\"},\"wordCount\":427,\"publisher\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#organization\"},\"image\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/unlocking-spad-technology-for-advanced-imaging-applications-in-microscopy-and-beyond\\\/#primaryimage\"},\"thumbnailUrl\":\"https:\\\/\\\/cdn-prd-main.asm-media.cloud\\\/uploads\\\/sites\\\/41\\\/2025\\\/08\\\/EDFAS__082825__Zeiss__400.webp\",\"articleSection\":[\"Electronics\",\"materials characterization\",\"Metallography and Microstructures\",\"Microelectronic Failure Analysis\",\"news\",\"News Articles\"],\"inLanguage\":\"en-US\"},{\"@type\":\"WebPage\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/unlocking-spad-technology-for-advanced-imaging-applications-in-microscopy-and-beyond\\\/\",\"url\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/unlocking-spad-technology-for-advanced-imaging-applications-in-microscopy-and-beyond\\\/\",\"name\":\"Unlocking SPAD technology for advanced imaging applications in microscopy and beyond - Electronic Device Failure Analysis Society\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#website\"},\"primaryImageOfPage\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/unlocking-spad-technology-for-advanced-imaging-applications-in-microscopy-and-beyond\\\/#primaryimage\"},\"image\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/unlocking-spad-technology-for-advanced-imaging-applications-in-microscopy-and-beyond\\\/#primaryimage\"},\"thumbnailUrl\":\"https:\\\/\\\/cdn-prd-main.asm-media.cloud\\\/uploads\\\/sites\\\/41\\\/2025\\\/08\\\/EDFAS__082825__Zeiss__400.webp\",\"datePublished\":\"2025-08-22T04:41:32+00:00\",\"dateModified\":\"2025-08-22T04:41:33+00:00\",\"breadcrumb\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/unlocking-spad-technology-for-advanced-imaging-applications-in-microscopy-and-beyond\\\/#breadcrumb\"},\"inLanguage\":\"en-US\",\"potentialAction\":[{\"@type\":\"ReadAction\",\"target\":[\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/unlocking-spad-technology-for-advanced-imaging-applications-in-microscopy-and-beyond\\\/\"]}]},{\"@type\":\"ImageObject\",\"inLanguage\":\"en-US\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/unlocking-spad-technology-for-advanced-imaging-applications-in-microscopy-and-beyond\\\/#primaryimage\",\"url\":\"https:\\\/\\\/cdn-prd-main.asm-media.cloud\\\/uploads\\\/sites\\\/41\\\/2025\\\/08\\\/EDFAS__082825__Zeiss__400.webp\",\"contentUrl\":\"https:\\\/\\\/cdn-prd-main.asm-media.cloud\\\/uploads\\\/sites\\\/41\\\/2025\\\/08\\\/EDFAS__082825__Zeiss__400.webp\",\"width\":400,\"height\":346},{\"@type\":\"BreadcrumbList\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/unlocking-spad-technology-for-advanced-imaging-applications-in-microscopy-and-beyond\\\/#breadcrumb\",\"itemListElement\":[{\"@type\":\"ListItem\",\"position\":1,\"name\":\"Home\",\"item\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/\"},{\"@type\":\"ListItem\",\"position\":2,\"name\":\"Unlocking SPAD technology for advanced imaging applications in microscopy and beyond\"}]},{\"@type\":\"WebSite\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#website\",\"url\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/\",\"name\":\"Electronic Device Failure Analysis Society\",\"description\":\"Electronic Device Failure Analysis Society\",\"publisher\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#organization\"},\"potentialAction\":[{\"@type\":\"SearchAction\",\"target\":{\"@type\":\"EntryPoint\",\"urlTemplate\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/?s={search_term_string}\"},\"query-input\":{\"@type\":\"PropertyValueSpecification\",\"valueRequired\":true,\"valueName\":\"search_term_string\"}}],\"inLanguage\":\"en-US\"},{\"@type\":\"Organization\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#organization\",\"name\":\"Electronic Device Failure Analysis Society\",\"url\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/\",\"logo\":{\"@type\":\"ImageObject\",\"inLanguage\":\"en-US\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#\\\/schema\\\/logo\\\/image\\\/\",\"url\":\"https:\\\/\\\/cdn-prd-main.asm-media.cloud\\\/uploads\\\/sites\\\/41\\\/2022\\\/10\\\/layout_set_logo.png\",\"contentUrl\":\"https:\\\/\\\/cdn-prd-main.asm-media.cloud\\\/uploads\\\/sites\\\/41\\\/2022\\\/10\\\/layout_set_logo.png\",\"width\":360,\"height\":95,\"caption\":\"Electronic Device Failure Analysis Society\"},\"image\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#\\\/schema\\\/logo\\\/image\\\/\"}},{\"@type\":\"Person\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#\\\/schema\\\/person\\\/135b2d8ac98a363d0bd9ec033a2904ad\",\"name\":\"Debbie Sniderman\",\"url\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/author\\\/dsniderman\\\/\"}]}<\/script>\n<!-- \/ Yoast SEO plugin. -->","yoast_head_json":{"title":"Unlocking SPAD technology for advanced imaging applications in microscopy and beyond - Electronic Device Failure Analysis Society","robots":{"index":"index","follow":"follow","max-snippet":"max-snippet:-1","max-image-preview":"max-image-preview:large","max-video-preview":"max-video-preview:-1"},"canonical":"https:\/\/www.asminternational.org\/edfas\/unlocking-spad-technology-for-advanced-imaging-applications-in-microscopy-and-beyond\/","og_locale":"en_US","og_type":"article","og_title":"Unlocking SPAD technology for advanced imaging applications in microscopy and beyond - Electronic Device Failure Analysis Society","og_description":"Carl Zeiss Microscopy GmbH, Germany, has acquired all equity shares of the Swiss company Pi Imaging Technology SA, developer of single-photon avalanche diode arrays and image sensors.","og_url":"https:\/\/www.asminternational.org\/edfas\/unlocking-spad-technology-for-advanced-imaging-applications-in-microscopy-and-beyond\/","og_site_name":"Electronic Device Failure Analysis Society","article_published_time":"2025-08-22T04:41:32+00:00","article_modified_time":"2025-08-22T04:41:33+00:00","og_image":[{"width":400,"height":346,"url":"https:\/\/www.asminternational.org\/app\/uploads\/sites\/41\/2025\/08\/EDFAS__082825__Zeiss__400.webp","type":"image\/jpeg"}],"author":"Debbie Sniderman","twitter_card":"summary_large_image","twitter_misc":{"Written by":"Debbie Sniderman","Est. reading time":"2 minutes"},"schema":{"@context":"https:\/\/schema.org","@graph":[{"@type":"Article","@id":"https:\/\/www.asminternational.org\/edfas\/unlocking-spad-technology-for-advanced-imaging-applications-in-microscopy-and-beyond\/#article","isPartOf":{"@id":"https:\/\/www.asminternational.org\/edfas\/unlocking-spad-technology-for-advanced-imaging-applications-in-microscopy-and-beyond\/"},"author":{"name":"Debbie Sniderman","@id":"https:\/\/www.asminternational.org\/edfas\/#\/schema\/person\/135b2d8ac98a363d0bd9ec033a2904ad"},"headline":"Unlocking SPAD technology for advanced imaging applications in microscopy and beyond","datePublished":"2025-08-22T04:41:32+00:00","dateModified":"2025-08-22T04:41:33+00:00","mainEntityOfPage":{"@id":"https:\/\/www.asminternational.org\/edfas\/unlocking-spad-technology-for-advanced-imaging-applications-in-microscopy-and-beyond\/"},"wordCount":427,"publisher":{"@id":"https:\/\/www.asminternational.org\/edfas\/#organization"},"image":{"@id":"https:\/\/www.asminternational.org\/edfas\/unlocking-spad-technology-for-advanced-imaging-applications-in-microscopy-and-beyond\/#primaryimage"},"thumbnailUrl":"https:\/\/cdn-prd-main.asm-media.cloud\/uploads\/sites\/41\/2025\/08\/EDFAS__082825__Zeiss__400.webp","articleSection":["Electronics","materials characterization","Metallography and Microstructures","Microelectronic Failure Analysis","news","News Articles"],"inLanguage":"en-US"},{"@type":"WebPage","@id":"https:\/\/www.asminternational.org\/edfas\/unlocking-spad-technology-for-advanced-imaging-applications-in-microscopy-and-beyond\/","url":"https:\/\/www.asminternational.org\/edfas\/unlocking-spad-technology-for-advanced-imaging-applications-in-microscopy-and-beyond\/","name":"Unlocking SPAD technology for advanced imaging applications in microscopy and beyond - Electronic Device Failure Analysis Society","isPartOf":{"@id":"https:\/\/www.asminternational.org\/edfas\/#website"},"primaryImageOfPage":{"@id":"https:\/\/www.asminternational.org\/edfas\/unlocking-spad-technology-for-advanced-imaging-applications-in-microscopy-and-beyond\/#primaryimage"},"image":{"@id":"https:\/\/www.asminternational.org\/edfas\/unlocking-spad-technology-for-advanced-imaging-applications-in-microscopy-and-beyond\/#primaryimage"},"thumbnailUrl":"https:\/\/cdn-prd-main.asm-media.cloud\/uploads\/sites\/41\/2025\/08\/EDFAS__082825__Zeiss__400.webp","datePublished":"2025-08-22T04:41:32+00:00","dateModified":"2025-08-22T04:41:33+00:00","breadcrumb":{"@id":"https:\/\/www.asminternational.org\/edfas\/unlocking-spad-technology-for-advanced-imaging-applications-in-microscopy-and-beyond\/#breadcrumb"},"inLanguage":"en-US","potentialAction":[{"@type":"ReadAction","target":["https:\/\/www.asminternational.org\/edfas\/unlocking-spad-technology-for-advanced-imaging-applications-in-microscopy-and-beyond\/"]}]},{"@type":"ImageObject","inLanguage":"en-US","@id":"https:\/\/www.asminternational.org\/edfas\/unlocking-spad-technology-for-advanced-imaging-applications-in-microscopy-and-beyond\/#primaryimage","url":"https:\/\/cdn-prd-main.asm-media.cloud\/uploads\/sites\/41\/2025\/08\/EDFAS__082825__Zeiss__400.webp","contentUrl":"https:\/\/cdn-prd-main.asm-media.cloud\/uploads\/sites\/41\/2025\/08\/EDFAS__082825__Zeiss__400.webp","width":400,"height":346},{"@type":"BreadcrumbList","@id":"https:\/\/www.asminternational.org\/edfas\/unlocking-spad-technology-for-advanced-imaging-applications-in-microscopy-and-beyond\/#breadcrumb","itemListElement":[{"@type":"ListItem","position":1,"name":"Home","item":"https:\/\/www.asminternational.org\/edfas\/"},{"@type":"ListItem","position":2,"name":"Unlocking SPAD technology for advanced imaging applications in microscopy and beyond"}]},{"@type":"WebSite","@id":"https:\/\/www.asminternational.org\/edfas\/#website","url":"https:\/\/www.asminternational.org\/edfas\/","name":"Electronic Device Failure Analysis Society","description":"Electronic Device Failure Analysis Society","publisher":{"@id":"https:\/\/www.asminternational.org\/edfas\/#organization"},"potentialAction":[{"@type":"SearchAction","target":{"@type":"EntryPoint","urlTemplate":"https:\/\/www.asminternational.org\/edfas\/?s={search_term_string}"},"query-input":{"@type":"PropertyValueSpecification","valueRequired":true,"valueName":"search_term_string"}}],"inLanguage":"en-US"},{"@type":"Organization","@id":"https:\/\/www.asminternational.org\/edfas\/#organization","name":"Electronic Device Failure Analysis Society","url":"https:\/\/www.asminternational.org\/edfas\/","logo":{"@type":"ImageObject","inLanguage":"en-US","@id":"https:\/\/www.asminternational.org\/edfas\/#\/schema\/logo\/image\/","url":"https:\/\/cdn-prd-main.asm-media.cloud\/uploads\/sites\/41\/2022\/10\/layout_set_logo.png","contentUrl":"https:\/\/cdn-prd-main.asm-media.cloud\/uploads\/sites\/41\/2022\/10\/layout_set_logo.png","width":360,"height":95,"caption":"Electronic Device Failure Analysis Society"},"image":{"@id":"https:\/\/www.asminternational.org\/edfas\/#\/schema\/logo\/image\/"}},{"@type":"Person","@id":"https:\/\/www.asminternational.org\/edfas\/#\/schema\/person\/135b2d8ac98a363d0bd9ec033a2904ad","name":"Debbie Sniderman","url":"https:\/\/www.asminternational.org\/edfas\/author\/dsniderman\/"}]}},"acf":[],"_links":{"self":[{"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/posts\/8865","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/users\/63245"}],"replies":[{"embeddable":true,"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/comments?post=8865"}],"version-history":[{"count":0,"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/posts\/8865\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/media\/8866"}],"wp:attachment":[{"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/media?parent=8865"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/categories?post=8865"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/tags?post=8865"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}