{"id":8878,"date":"2025-08-22T02:15:44","date_gmt":"2025-08-22T06:15:44","guid":{"rendered":"https:\/\/staging.asminternational.org\/edfas\/worlds-first-hybrid-chip-combines-electronics-photonics-and-quantum-power\/"},"modified":"2025-08-22T06:25:40","modified_gmt":"2025-08-22T06:25:40","slug":"worlds-first-hybrid-chip-combines-electronics-photonics-and-quantum-power","status":"publish","type":"post","link":"https:\/\/www.asminternational.org\/edfas\/worlds-first-hybrid-chip-combines-electronics-photonics-and-quantum-power\/","title":{"rendered":"World\u2019s first hybrid chip combines electronics, photonics, and quantum power"},"content":{"rendered":"

In a significant advancement for quantum technology, researchers from Boston University, UC Berkeley, and Northwestern University have developed the first chip that integrates electronic, photonic, and quantum components. Their findings, published in Nature Electronic<\/em>s, describe a system that merges quantum light sources with stabilizing electronics, all fabricated using a standard 45-nanometer semiconductor process.<\/p>\n

This integration allows the chip to generate consistent streams of correlated photon pairs (particles of light), which are essential building blocks for many quantum applications. The breakthrough marks a major step toward the large-scale production of \u201cquantum light factory\u201d chips and the development of more complex quantum systems composed of multiple interconnected chips.<\/p>\n

\u201cQuantum computing, communication, and sensing are on a decades-long path from concept to reality,\u201d says Milo\u0161 Popovi\u0107, associate professor of electrical and computer engineering at BU and a senior author on the study. \u201cThis is a small step on that path\u2014but an important one, because it shows we can build repeatable, controllable quantum systems in commercial semiconductor foundries.\u201d<\/p>\n

\u201cThe kind of interdisciplinary collaboration this work required is exactly what\u2019s needed to move quantum systems from the lab to scalable platforms,\u201d says Prem Kumar, professor of electrical and computer engineering at Northwestern and a pioneer in quantum optics. \u201cWe couldn\u2019t have done this without the combined efforts in electronics, photonics, and quantum measurement.\u201d<\/p>\n

Just as electronic chips are powered by electric currents, and optical communication links by laser light, future quantum technologies will require a steady stream of quantum light resource units to perform their functions. To provide this, the researchers\u2019 work created an array of \u201cquantum light factories\u201d on a silicon chip, each less than a millimeter by a millimeter in dimension.<\/p>\n

Generating quantum states of light on chip requires precisely engineered photonic devices\u2014specifically, microring resonators (the same devices recently identified by Nvidia CEO Jensen Huang as being integral to Nvidia\u2019s future scaling of its AI compute hardware via optical interconnection). To generate streams of quantum light, in the form of correlated pairs of photons, the resonators must be tuned in sync with incoming laser light that powers each quantum light factory on the chip (and is used as fuel for the generation process). But those devices are extremely sensitive to temperature and fabrication variations, which can push them out of sync and disrupt the steady generation of quantum light.<\/p>\n

To address this challenge, the team built an integrated system that actively stabilizes quantum light sources on chip\u2014specifically, the silicon microring resonators that generate the streams of correlated photons. Each chip contains twelve such sources operable in parallel, and each resonator must stay in sync with its incoming laser light even in the presence of temperature drift and interference from nearby devices, including the other eleven photon-pair sources on the chip.<\/p>\n

\u201cWhat excites me most is that we embedded the control directly on-chip\u2014stabilizing a quantum process in real time,\u201d says Anirudh Ramesh, a PhD student at Northwestern who led the quantum measurements. \u201cThat\u2019s a critical step toward scalable quantum systems.\u201d<\/p>\n

The extreme sensitivity of the microring resonators, the building blocks for the quantum light sources, is well known and is both a blessing and a curse. It is the reason why they can generate quantum light streams efficiently and in a minimal chip area. However, small shifts in temperature can derail the photon-pair generation process. The BU-led team solved this by integrating photodiodes inside the resonators in a way that monitors alignment with the incoming laser while preserving the quantum light generation. On-chip heaters and control logic continually adjust the resonance in response to drift.<\/p>\n

\u201cA key challenge relative to our previous work was to push photonics design to meet the demanding requirements of quantum optics while remaining within the strict constraints of a commercial CMOS platform,\u201d says Imbert Wang, a PhD student at Boston University who led the photonic device design. \u201cThat enabled co-design of the electronics and quantum optics as a unified system.\u201d<\/p>\n

Because the chip uses built-in feedback to stabilize each source, it behaves predictably despite temperature changes and fabrication variations\u2014an essential requirement for scaling up quantum systems. It was fabricated in a commercial 45-nanometer complementary metal-oxide semiconductor (CMOS) chip platform originally developed through a close collaboration between BU, UC Berkeley, GlobalFoundries, and Silicon Valley startup Ayar Labs, which grew out of research at the two universities and is now an industry leader in optical interconnect chiplets.<\/p>\n

Through the new collaboration with Northwestern, that same manufacturing process now enables not only advanced optical interconnects for AI and supercomputing, but also, as shown in the study, complex quantum photonic systems on a scalable silicon platform.<\/p>\n

\u201cOur goal was to show that complex quantum photonic systems can be built and stabilized entirely within a CMOS chip,\u201d says Daniel Kramnik, a PhD student at UC Berkeley who led chip design, packaging, and integration. \u201cThat required tight coordination across domains that don\u2019t usually talk to each other.\u201d<\/p>\n

As quantum photonic systems progress in scale and complexity, chips like this could become building blocks for technologies ranging from secure communication networks to advanced sensing and, eventually, quantum computing infrastructure.<\/p>\n

 <\/p>\n

For more information:
\nBoston University
\nhttps:\/\/www.bu.edu\/<\/a><\/p>\n

Northwestern University
\nhttps:\/\/www.northwestern.edu\/<\/a><\/p>\n

UC Berkeley
\nhttps:\/\/www.berkeley.edu\/<\/a><\/p>\n","protected":false},"excerpt":{"rendered":"

Researchers from Boston University, UC Berkeley, and Northwestern University have developed the first chip that integrates electronic, photonic, and quantum components, fabricated using a standard 45-nanometer semiconductor process.<\/p>\n","protected":false},"author":63245,"featured_media":8883,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[499,434,501,435,436,464],"tags":[],"class_list":["post-8878","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-electrical-properties","category-electronics","category-electronics-and-microelectronics","category-news","category-news-articles","category-research-and-development"],"yoast_head":"\nWorld\u2019s first hybrid chip combines electronics, photonics, and quantum power - Electronic Device Failure Analysis Society<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.asminternational.org\/edfas\/worlds-first-hybrid-chip-combines-electronics-photonics-and-quantum-power\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"World\u2019s first hybrid chip combines electronics, photonics, and quantum power - Electronic Device Failure Analysis Society\" \/>\n<meta property=\"og:description\" content=\"Researchers from Boston University, UC Berkeley, and Northwestern University have developed the first chip that integrates electronic, photonic, and quantum components, fabricated using a standard 45-nanometer semiconductor process.\" \/>\n<meta property=\"og:url\" content=\"https:\/\/www.asminternational.org\/edfas\/worlds-first-hybrid-chip-combines-electronics-photonics-and-quantum-power\/\" \/>\n<meta property=\"og:site_name\" content=\"Electronic Device Failure Analysis Society\" \/>\n<meta property=\"article:published_time\" content=\"2025-08-22T06:15:44+00:00\" \/>\n<meta property=\"article:modified_time\" content=\"2025-08-22T06:25:40+00:00\" \/>\n<meta property=\"og:image\" content=\"https:\/\/www.asminternational.org\/app\/uploads\/sites\/41\/2025\/08\/EDFAS__082825__Quantum__400.webp\" \/>\n\t<meta property=\"og:image:width\" content=\"600\" \/>\n\t<meta property=\"og:image:height\" content=\"300\" \/>\n\t<meta property=\"og:image:type\" content=\"image\/jpeg\" \/>\n<meta name=\"author\" content=\"Debbie Sniderman\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" content=\"Written by\" \/>\n\t<meta name=\"twitter:data1\" content=\"Debbie Sniderman\" \/>\n\t<meta name=\"twitter:label2\" content=\"Est. reading time\" \/>\n\t<meta name=\"twitter:data2\" content=\"4 minutes\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\\\/\\\/schema.org\",\"@graph\":[{\"@type\":\"Article\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/worlds-first-hybrid-chip-combines-electronics-photonics-and-quantum-power\\\/#article\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/worlds-first-hybrid-chip-combines-electronics-photonics-and-quantum-power\\\/\"},\"author\":{\"name\":\"Debbie Sniderman\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#\\\/schema\\\/person\\\/135b2d8ac98a363d0bd9ec033a2904ad\"},\"headline\":\"World\u2019s first hybrid chip combines electronics, photonics, and quantum power\",\"datePublished\":\"2025-08-22T06:15:44+00:00\",\"dateModified\":\"2025-08-22T06:25:40+00:00\",\"mainEntityOfPage\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/worlds-first-hybrid-chip-combines-electronics-photonics-and-quantum-power\\\/\"},\"wordCount\":886,\"publisher\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#organization\"},\"image\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/worlds-first-hybrid-chip-combines-electronics-photonics-and-quantum-power\\\/#primaryimage\"},\"thumbnailUrl\":\"https:\\\/\\\/cdn-prd-main.asm-media.cloud\\\/uploads\\\/sites\\\/41\\\/2025\\\/08\\\/EDFAS__082825__Quantum__400-1-2.webp\",\"articleSection\":[\"electrical-properties\",\"Electronics\",\"Electronics and Microelectronics\",\"news\",\"News Articles\",\"Research and Development\"],\"inLanguage\":\"en-US\"},{\"@type\":\"WebPage\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/worlds-first-hybrid-chip-combines-electronics-photonics-and-quantum-power\\\/\",\"url\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/worlds-first-hybrid-chip-combines-electronics-photonics-and-quantum-power\\\/\",\"name\":\"World\u2019s first hybrid chip combines electronics, photonics, and quantum power - Electronic Device Failure Analysis Society\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#website\"},\"primaryImageOfPage\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/worlds-first-hybrid-chip-combines-electronics-photonics-and-quantum-power\\\/#primaryimage\"},\"image\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/worlds-first-hybrid-chip-combines-electronics-photonics-and-quantum-power\\\/#primaryimage\"},\"thumbnailUrl\":\"https:\\\/\\\/cdn-prd-main.asm-media.cloud\\\/uploads\\\/sites\\\/41\\\/2025\\\/08\\\/EDFAS__082825__Quantum__400-1-2.webp\",\"datePublished\":\"2025-08-22T06:15:44+00:00\",\"dateModified\":\"2025-08-22T06:25:40+00:00\",\"breadcrumb\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/worlds-first-hybrid-chip-combines-electronics-photonics-and-quantum-power\\\/#breadcrumb\"},\"inLanguage\":\"en-US\",\"potentialAction\":[{\"@type\":\"ReadAction\",\"target\":[\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/worlds-first-hybrid-chip-combines-electronics-photonics-and-quantum-power\\\/\"]}]},{\"@type\":\"ImageObject\",\"inLanguage\":\"en-US\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/worlds-first-hybrid-chip-combines-electronics-photonics-and-quantum-power\\\/#primaryimage\",\"url\":\"https:\\\/\\\/cdn-prd-main.asm-media.cloud\\\/uploads\\\/sites\\\/41\\\/2025\\\/08\\\/EDFAS__082825__Quantum__400-1-2.webp\",\"contentUrl\":\"https:\\\/\\\/cdn-prd-main.asm-media.cloud\\\/uploads\\\/sites\\\/41\\\/2025\\\/08\\\/EDFAS__082825__Quantum__400-1-2.webp\",\"width\":400,\"height\":200},{\"@type\":\"BreadcrumbList\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/worlds-first-hybrid-chip-combines-electronics-photonics-and-quantum-power\\\/#breadcrumb\",\"itemListElement\":[{\"@type\":\"ListItem\",\"position\":1,\"name\":\"Home\",\"item\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/\"},{\"@type\":\"ListItem\",\"position\":2,\"name\":\"World\u2019s first hybrid chip combines electronics, photonics, and quantum power\"}]},{\"@type\":\"WebSite\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#website\",\"url\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/\",\"name\":\"Electronic Device Failure Analysis Society\",\"description\":\"Electronic Device Failure Analysis Society\",\"publisher\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#organization\"},\"potentialAction\":[{\"@type\":\"SearchAction\",\"target\":{\"@type\":\"EntryPoint\",\"urlTemplate\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/?s={search_term_string}\"},\"query-input\":{\"@type\":\"PropertyValueSpecification\",\"valueRequired\":true,\"valueName\":\"search_term_string\"}}],\"inLanguage\":\"en-US\"},{\"@type\":\"Organization\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#organization\",\"name\":\"Electronic Device Failure Analysis Society\",\"url\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/\",\"logo\":{\"@type\":\"ImageObject\",\"inLanguage\":\"en-US\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#\\\/schema\\\/logo\\\/image\\\/\",\"url\":\"https:\\\/\\\/cdn-prd-main.asm-media.cloud\\\/uploads\\\/sites\\\/41\\\/2022\\\/10\\\/layout_set_logo.png\",\"contentUrl\":\"https:\\\/\\\/cdn-prd-main.asm-media.cloud\\\/uploads\\\/sites\\\/41\\\/2022\\\/10\\\/layout_set_logo.png\",\"width\":360,\"height\":95,\"caption\":\"Electronic Device Failure Analysis Society\"},\"image\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#\\\/schema\\\/logo\\\/image\\\/\"}},{\"@type\":\"Person\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#\\\/schema\\\/person\\\/135b2d8ac98a363d0bd9ec033a2904ad\",\"name\":\"Debbie Sniderman\",\"url\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/author\\\/dsniderman\\\/\"}]}<\/script>\n<!-- \/ Yoast SEO plugin. -->","yoast_head_json":{"title":"World\u2019s first hybrid chip combines electronics, photonics, and quantum power - Electronic Device Failure Analysis Society","robots":{"index":"index","follow":"follow","max-snippet":"max-snippet:-1","max-image-preview":"max-image-preview:large","max-video-preview":"max-video-preview:-1"},"canonical":"https:\/\/www.asminternational.org\/edfas\/worlds-first-hybrid-chip-combines-electronics-photonics-and-quantum-power\/","og_locale":"en_US","og_type":"article","og_title":"World\u2019s first hybrid chip combines electronics, photonics, and quantum power - Electronic Device Failure Analysis Society","og_description":"Researchers from Boston University, UC Berkeley, and Northwestern University have developed the first chip that integrates electronic, photonic, and quantum components, fabricated using a standard 45-nanometer semiconductor process.","og_url":"https:\/\/www.asminternational.org\/edfas\/worlds-first-hybrid-chip-combines-electronics-photonics-and-quantum-power\/","og_site_name":"Electronic Device Failure Analysis Society","article_published_time":"2025-08-22T06:15:44+00:00","article_modified_time":"2025-08-22T06:25:40+00:00","og_image":[{"width":600,"height":300,"url":"https:\/\/www.asminternational.org\/app\/uploads\/sites\/41\/2025\/08\/EDFAS__082825__Quantum__400.webp","type":"image\/jpeg"}],"author":"Debbie Sniderman","twitter_card":"summary_large_image","twitter_misc":{"Written by":"Debbie Sniderman","Est. reading time":"4 minutes"},"schema":{"@context":"https:\/\/schema.org","@graph":[{"@type":"Article","@id":"https:\/\/www.asminternational.org\/edfas\/worlds-first-hybrid-chip-combines-electronics-photonics-and-quantum-power\/#article","isPartOf":{"@id":"https:\/\/www.asminternational.org\/edfas\/worlds-first-hybrid-chip-combines-electronics-photonics-and-quantum-power\/"},"author":{"name":"Debbie Sniderman","@id":"https:\/\/www.asminternational.org\/edfas\/#\/schema\/person\/135b2d8ac98a363d0bd9ec033a2904ad"},"headline":"World\u2019s first hybrid chip combines electronics, photonics, and quantum power","datePublished":"2025-08-22T06:15:44+00:00","dateModified":"2025-08-22T06:25:40+00:00","mainEntityOfPage":{"@id":"https:\/\/www.asminternational.org\/edfas\/worlds-first-hybrid-chip-combines-electronics-photonics-and-quantum-power\/"},"wordCount":886,"publisher":{"@id":"https:\/\/www.asminternational.org\/edfas\/#organization"},"image":{"@id":"https:\/\/www.asminternational.org\/edfas\/worlds-first-hybrid-chip-combines-electronics-photonics-and-quantum-power\/#primaryimage"},"thumbnailUrl":"https:\/\/cdn-prd-main.asm-media.cloud\/uploads\/sites\/41\/2025\/08\/EDFAS__082825__Quantum__400-1-2.webp","articleSection":["electrical-properties","Electronics","Electronics and Microelectronics","news","News Articles","Research and Development"],"inLanguage":"en-US"},{"@type":"WebPage","@id":"https:\/\/www.asminternational.org\/edfas\/worlds-first-hybrid-chip-combines-electronics-photonics-and-quantum-power\/","url":"https:\/\/www.asminternational.org\/edfas\/worlds-first-hybrid-chip-combines-electronics-photonics-and-quantum-power\/","name":"World\u2019s first hybrid chip combines electronics, photonics, and quantum power - Electronic Device Failure Analysis Society","isPartOf":{"@id":"https:\/\/www.asminternational.org\/edfas\/#website"},"primaryImageOfPage":{"@id":"https:\/\/www.asminternational.org\/edfas\/worlds-first-hybrid-chip-combines-electronics-photonics-and-quantum-power\/#primaryimage"},"image":{"@id":"https:\/\/www.asminternational.org\/edfas\/worlds-first-hybrid-chip-combines-electronics-photonics-and-quantum-power\/#primaryimage"},"thumbnailUrl":"https:\/\/cdn-prd-main.asm-media.cloud\/uploads\/sites\/41\/2025\/08\/EDFAS__082825__Quantum__400-1-2.webp","datePublished":"2025-08-22T06:15:44+00:00","dateModified":"2025-08-22T06:25:40+00:00","breadcrumb":{"@id":"https:\/\/www.asminternational.org\/edfas\/worlds-first-hybrid-chip-combines-electronics-photonics-and-quantum-power\/#breadcrumb"},"inLanguage":"en-US","potentialAction":[{"@type":"ReadAction","target":["https:\/\/www.asminternational.org\/edfas\/worlds-first-hybrid-chip-combines-electronics-photonics-and-quantum-power\/"]}]},{"@type":"ImageObject","inLanguage":"en-US","@id":"https:\/\/www.asminternational.org\/edfas\/worlds-first-hybrid-chip-combines-electronics-photonics-and-quantum-power\/#primaryimage","url":"https:\/\/cdn-prd-main.asm-media.cloud\/uploads\/sites\/41\/2025\/08\/EDFAS__082825__Quantum__400-1-2.webp","contentUrl":"https:\/\/cdn-prd-main.asm-media.cloud\/uploads\/sites\/41\/2025\/08\/EDFAS__082825__Quantum__400-1-2.webp","width":400,"height":200},{"@type":"BreadcrumbList","@id":"https:\/\/www.asminternational.org\/edfas\/worlds-first-hybrid-chip-combines-electronics-photonics-and-quantum-power\/#breadcrumb","itemListElement":[{"@type":"ListItem","position":1,"name":"Home","item":"https:\/\/www.asminternational.org\/edfas\/"},{"@type":"ListItem","position":2,"name":"World\u2019s first hybrid chip combines electronics, photonics, and quantum power"}]},{"@type":"WebSite","@id":"https:\/\/www.asminternational.org\/edfas\/#website","url":"https:\/\/www.asminternational.org\/edfas\/","name":"Electronic Device Failure Analysis Society","description":"Electronic Device Failure Analysis Society","publisher":{"@id":"https:\/\/www.asminternational.org\/edfas\/#organization"},"potentialAction":[{"@type":"SearchAction","target":{"@type":"EntryPoint","urlTemplate":"https:\/\/www.asminternational.org\/edfas\/?s={search_term_string}"},"query-input":{"@type":"PropertyValueSpecification","valueRequired":true,"valueName":"search_term_string"}}],"inLanguage":"en-US"},{"@type":"Organization","@id":"https:\/\/www.asminternational.org\/edfas\/#organization","name":"Electronic Device Failure Analysis Society","url":"https:\/\/www.asminternational.org\/edfas\/","logo":{"@type":"ImageObject","inLanguage":"en-US","@id":"https:\/\/www.asminternational.org\/edfas\/#\/schema\/logo\/image\/","url":"https:\/\/cdn-prd-main.asm-media.cloud\/uploads\/sites\/41\/2022\/10\/layout_set_logo.png","contentUrl":"https:\/\/cdn-prd-main.asm-media.cloud\/uploads\/sites\/41\/2022\/10\/layout_set_logo.png","width":360,"height":95,"caption":"Electronic Device Failure Analysis Society"},"image":{"@id":"https:\/\/www.asminternational.org\/edfas\/#\/schema\/logo\/image\/"}},{"@type":"Person","@id":"https:\/\/www.asminternational.org\/edfas\/#\/schema\/person\/135b2d8ac98a363d0bd9ec033a2904ad","name":"Debbie Sniderman","url":"https:\/\/www.asminternational.org\/edfas\/author\/dsniderman\/"}]}},"acf":[],"_links":{"self":[{"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/posts\/8878","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/users\/63245"}],"replies":[{"embeddable":true,"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/comments?post=8878"}],"version-history":[{"count":1,"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/posts\/8878\/revisions"}],"predecessor-version":[{"id":8880,"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/posts\/8878\/revisions\/8880"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/media\/8883"}],"wp:attachment":[{"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/media?parent=8878"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/categories?post=8878"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/tags?post=8878"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}