{"id":9148,"date":"2026-01-15T22:43:13","date_gmt":"2026-01-16T03:43:13","guid":{"rendered":"https:\/\/staging.asminternational.org\/edfas\/advantest-and-tokyo-seimitsu-announce-joint-development-of-die-level-prober\/"},"modified":"2026-01-16T03:43:14","modified_gmt":"2026-01-16T03:43:14","slug":"advantest-and-tokyo-seimitsu-announce-joint-development-of-die-level-prober","status":"publish","type":"post","link":"https:\/\/www.asminternational.org\/edfas\/advantest-and-tokyo-seimitsu-announce-joint-development-of-die-level-prober\/","title":{"rendered":"Advantest and Tokyo Seimitsu announce joint development of die-level prober"},"content":{"rendered":"

Advantest Corporation, Japan, and Tokyo Seimitsu Co., Ltd.(\u201cTokyo Seimitsu\u201d) announce plans to co-develop a new die-level prober, designed for the testing of high-performance computing (HPC) devices.<\/p>\n

Semiconductors are expected to become increasingly advanced and complex in the coming years. To promptly meet evolving market needs and deliver high-performance total test solutions to customers, close collaboration across the semiconductor value chain is essential. Advantest and Tokyo Seimitsu will jointly develop die-level probers, leveraging their respective expertise to deliver advanced probing capabilities essential for testing AI and high-performance computing (HPC) devices.<\/p>\n

AI and high-performance computing (HPC) devices, such as GPUs and CPUs used in servers, require extremely high computational performance for AI model training, inference and execution. These devices often employ advanced 2.5D\/3D packaging technologies, which generate significant heat during massive data processing. As a result, controlling temperature during test is a major challenge. Through this collaboration, the two companies will strengthen next-generation probing and handling technologies to address these challenges and contribute to the growth of the AI\/HPC market.<\/p>\n

\u201cWe offer various solutions centered on precision positioning technology in response to the advancement of AI\/HPC technologies that are transforming the world. This collaboration will enable us to reach new heights of innovation as we work with Advantest to develop sophisticated die-level probing solutions that cater to the demands of the AI era,\u201d said Ryuichi Kimura, president and CEO of Tokyo Seimitsu.<\/p>\n

\u201cWe are actively pursuing partnerships with key players in the semiconductor value chain to address customer challenges in semiconductor testing, including the rapidly growing AI\/HPC market,\u201d said Douglas Lefever, representative director and group CEO of Advantest. \u201cThrough our collaboration with Tokyo Seimitsu, we will deliver high-performance, comprehensive test solutions that meet our customers’ future needs in areas of die-level probing.\u201d<\/p>\n

For more information:<\/p>\n

Advantest Corporation
\nhttps:\/\/www.advantest.com\/<\/a><\/p>\n

Tokyo Seimitsu Co., Ltd
\nhttps:\/\/www.accretech.com\/en\/<\/a><\/p>\n","protected":false},"excerpt":{"rendered":"

Advantest Corporation, Japan, and Tokyo Seimitsu Co., Ltd. announce plans to co-develop a new die-level prober, designed for the testing of high-performance computing devices. <\/p>\n","protected":false},"author":63245,"featured_media":9149,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[434,501,460,437,435,436,618],"tags":[],"class_list":["post-9148","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-electronics","category-electronics-and-microelectronics","category-failure-analysis","category-materials-testing-and-evaluation","category-news","category-news-articles","category-nondestructive-testing"],"yoast_head":"\nAdvantest and Tokyo Seimitsu announce joint development of die-level prober - Electronic Device Failure Analysis Society<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.asminternational.org\/edfas\/advantest-and-tokyo-seimitsu-announce-joint-development-of-die-level-prober\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Advantest and Tokyo Seimitsu announce joint development of die-level prober - 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