{"id":1168,"date":"2022-11-01T13:14:23","date_gmt":"2022-11-01T13:14:23","guid":{"rendered":"https:\/\/staging.asminternational.org\/edfas\/wkcl-shop\/uncategorized\/microelectronics-failure-analysis-desk-reference-seventh-edition\/"},"modified":"2025-01-23T21:22:17","modified_gmt":"2025-01-23T21:22:17","slug":"microelectronics-failure-analysis-desk-reference-seventh-edition","status":"publish","type":"product","link":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/38278573\/PUBLICATION\/","title":{"rendered":"Microelectronics Failure Analysis Desk Reference, Seventh Edition"},"content":{"rendered":"<p>The Electronic Device Failure Analysis Society proudly announces the Seventh Edition of the Microelectronics Failure Analysis Desk Reference, published by ASM International. The new edition will help engineers improve their ability to verify, isolate, uncover, and identify the root cause of failures. Prepared by a team of experts, this updated reference offers the latest information on advanced failure analysis tools and techniques, illustrated with numerous real-life examples.<\/p>\n<p>Topics include:<\/p>\n<ul>\n<li>\u00a0\u00a0\u00a0 Failure Analysis Process and Management\u2014wafer, package, and board level failure analysis flow.<\/li>\n<li>\u00a0\u00a0\u00a0 Incoming Inspection Tools\u2014optical, x-ray, and scanning acoustic microscopy.<\/li>\n<li>\u00a0\u00a0\u00a0 Fault Isolation\u2014front and backside sample prepara\u00adtion, CAD navigation, laser-assisted device alteration (LADA), soft defect location (SDL), lock-in thermog\u00adraphy, laser voltage probing (LVP), photon emission, EOTPR\/TDR\/TDT, and current imaging.<\/li>\n<li>\u00a0\u00a0\u00a0 Device and Circuit Characterization\u2014scanning electron microscopy (SEM)-based and atomic force microscopy (AFM)-based nanoprobing.<\/li>\n<li>\u00a0\u00a0\u00a0 FIB Technique and Circuit Edit\u2014 FIB overview and advanced circuit edit for first silicon debug.<\/li>\n<li>\u00a0\u00a0\u00a0 Physical Analysis\u2014deprocessing, cross section analysis, scanning electron microscopy, material analysis techniques, transmission electron micros\u00adcopy (TEM), and scanning probe microscopy.<\/li>\n<li>\u00a0\u00a0\u00a0 Memory FA\u2014DRAM, semiconductor memory failure signature analysis.<\/li>\n<li>\u00a0\u00a0\u00a0 Special Applications\u2014automotive FA, 2.5 and 3D packaging failure analysis, microelectromechanical systems (MEMS), optoelectronics, solar, and counterfeit electronics.<\/li>\n<li>\u00a0\u00a0\u00a0 Fundamental Topics\u2014integrated circuit testing, analog design, reliability, quality, and training.<\/li>\n<\/ul>\n<p>&nbsp;<\/p>\n<p>Seven new topics have been added and all themes covered in earlier editions are included in the Seventh Edition. Many previous articles have been updated.<\/p>\n<p>&nbsp;<\/p>\n<ul class=\"additionalDescription\">\n<li>Publisher: ASM International<\/li>\n<li>Published: 2019<\/li>\n<li>Pages: 705<\/li>\n<li>ISBN: 9781627082457<\/li>\n<\/ul>\n","protected":false},"excerpt":{"rendered":"<p>The Electronic Device Failure Analysis Society proudly announces the Seventh Edition of the Microelectronics Failure Analysis Desk Reference. The new edition will help engineers improve their ability to verify, isolate, uncover, and identify the root cause of failures. Prepared by a team of experts, this updated reference offers the latest information on advanced failure analysis tools and techniques, illustrated with numerous real-life examples.<\/p>\n","protected":false},"featured_media":8589,"comment_status":"open","ping_status":"closed","template":"","meta":{"_acf_changed":false},"product_brand":[],"product_cat":[34],"product_tag":[],"product_structure":[58],"subject":[60,63],"class_list":{"0":"post-1168","1":"product","2":"type-product","3":"status-publish","4":"has-post-thumbnail","6":"product_cat-books-and-handbooks","7":"product_structure-publication","8":"subject-materials-testing-and-evaluation","9":"subject-microelectronic-failure-analysis","11":"first","12":"instock","13":"shipping-taxable","14":"purchasable","15":"product-type-simple"},"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.9 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>Microelectronics Failure Analysis Desk Reference, Seventh Edition - Electronic Device Failure Analysis Society<\/title>\n<meta name=\"robots\" content=\"noindex, follow\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Microelectronics Failure Analysis Desk Reference, Seventh Edition - Electronic Device Failure Analysis Society\" \/>\n<meta property=\"og:description\" content=\"The Electronic Device Failure Analysis Society proudly announces the Seventh Edition of the Microelectronics Failure Analysis Desk Reference. 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