{"id":1840,"date":"2015-04-09T17:46:27","date_gmt":"2015-04-09T17:46:27","guid":{"rendered":"https:\/\/staging.asminternational.org\/edfas\/video\/carbon3d-demo\/"},"modified":"2015-04-09T17:46:27","modified_gmt":"2015-04-09T17:46:27","slug":"carbon3d-demo","status":"publish","type":"video","link":"https:\/\/www.asminternational.org\/edfas\/videos\/-\/journal_content\/56\/10192\/24952279\/VIDEO\/","title":{"rendered":"Carbon3D Demo"},"content":{"rendered":"<p>\n\t<strong style=\"line-height: 1.4;\">How to Build 3D Polymer Parts Fast<\/strong><\/p>\n<p>\n\tCarbon3D&#8217;s layerless continuous liquid interface production technology (CLIP) eliminates the shortcomings of curing polymers layer by layer. By carefully balancing the interaction of UV light, which triggers photo polymerization, and oxygen, which inhibits the reaction, CLIP continuously grows objects from a pool of resin at speeds 25-100 times faster than traditional 3D printing.<\/p>\n","protected":false},"featured_media":58763,"template":"","class_list":["post-1840","video","type-video","status-publish","has-post-thumbnail","hentry"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.9 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>Carbon3D Demo - Electronic Device Failure Analysis Society<\/title>\n<meta name=\"robots\" content=\"noindex, follow\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Carbon3D Demo - Electronic Device Failure Analysis Society\" \/>\n<meta property=\"og:description\" content=\"Carbon3D&#039;s layerless continuous liquid interface production technology (CLIP) eliminates the shortcomings of curing polymers layer by layer.\" \/>\n<meta property=\"og:url\" content=\"https:\/\/www.asminternational.org\/edfas\/videos\/-\/journal_content\/56\/10192\/24952279\/VIDEO\/\" \/>\n<meta property=\"og:site_name\" content=\"Electronic Device Failure Analysis Society\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\\\/\\\/schema.org\",\"@graph\":[{\"@type\":\"WebPage\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/videos\\\/-\\\/journal_content\\\/56\\\/10192\\\/24952279\\\/VIDEO\\\/\",\"url\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/videos\\\/-\\\/journal_content\\\/56\\\/10192\\\/24952279\\\/VIDEO\\\/\",\"name\":\"Carbon3D Demo - Electronic Device Failure Analysis Society\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#website\"},\"primaryImageOfPage\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/videos\\\/-\\\/journal_content\\\/56\\\/10192\\\/24952279\\\/VIDEO\\\/#primaryimage\"},\"image\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/videos\\\/-\\\/journal_content\\\/56\\\/10192\\\/24952279\\\/VIDEO\\\/#primaryimage\"},\"thumbnailUrl\":\"\",\"datePublished\":\"2015-04-09T17:46:27+00:00\",\"breadcrumb\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/videos\\\/-\\\/journal_content\\\/56\\\/10192\\\/24952279\\\/VIDEO\\\/#breadcrumb\"},\"inLanguage\":\"en-US\",\"potentialAction\":[{\"@type\":\"ReadAction\",\"target\":[\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/videos\\\/-\\\/journal_content\\\/56\\\/10192\\\/24952279\\\/VIDEO\\\/\"]}]},{\"@type\":\"ImageObject\",\"inLanguage\":\"en-US\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/videos\\\/-\\\/journal_content\\\/56\\\/10192\\\/24952279\\\/VIDEO\\\/#primaryimage\",\"url\":\"\",\"contentUrl\":\"\"},{\"@type\":\"BreadcrumbList\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/videos\\\/-\\\/journal_content\\\/56\\\/10192\\\/24952279\\\/VIDEO\\\/#breadcrumb\",\"itemListElement\":[{\"@type\":\"ListItem\",\"position\":1,\"name\":\"Home\",\"item\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/\"},{\"@type\":\"ListItem\",\"position\":2,\"name\":\"Carbon3D Demo\"}]},{\"@type\":\"WebSite\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#website\",\"url\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/\",\"name\":\"Electronic Device Failure Analysis Society\",\"description\":\"Electronic Device Failure Analysis Society\",\"publisher\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#organization\"},\"potentialAction\":[{\"@type\":\"SearchAction\",\"target\":{\"@type\":\"EntryPoint\",\"urlTemplate\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/?s={search_term_string}\"},\"query-input\":{\"@type\":\"PropertyValueSpecification\",\"valueRequired\":true,\"valueName\":\"search_term_string\"}}],\"inLanguage\":\"en-US\"},{\"@type\":\"Organization\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#organization\",\"name\":\"Electronic Device Failure Analysis Society\",\"url\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/\",\"logo\":{\"@type\":\"ImageObject\",\"inLanguage\":\"en-US\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#\\\/schema\\\/logo\\\/image\\\/\",\"url\":\"https:\\\/\\\/cdn-prd-main.asm-media.cloud\\\/uploads\\\/sites\\\/41\\\/2022\\\/10\\\/layout_set_logo.png\",\"contentUrl\":\"https:\\\/\\\/cdn-prd-main.asm-media.cloud\\\/uploads\\\/sites\\\/41\\\/2022\\\/10\\\/layout_set_logo.png\",\"width\":360,\"height\":95,\"caption\":\"Electronic Device Failure Analysis Society\"},\"image\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#\\\/schema\\\/logo\\\/image\\\/\"}}]}<\/script>\n<!-- \/ Yoast SEO plugin. -->","yoast_head_json":{"title":"Carbon3D Demo - Electronic Device Failure Analysis Society","robots":{"index":"noindex","follow":"follow"},"og_locale":"en_US","og_type":"article","og_title":"Carbon3D Demo - Electronic Device Failure Analysis Society","og_description":"Carbon3D's layerless continuous liquid interface production technology (CLIP) eliminates the shortcomings of curing polymers layer by layer.","og_url":"https:\/\/www.asminternational.org\/edfas\/videos\/-\/journal_content\/56\/10192\/24952279\/VIDEO\/","og_site_name":"Electronic Device Failure Analysis Society","twitter_card":"summary_large_image","schema":{"@context":"https:\/\/schema.org","@graph":[{"@type":"WebPage","@id":"https:\/\/www.asminternational.org\/edfas\/videos\/-\/journal_content\/56\/10192\/24952279\/VIDEO\/","url":"https:\/\/www.asminternational.org\/edfas\/videos\/-\/journal_content\/56\/10192\/24952279\/VIDEO\/","name":"Carbon3D Demo - Electronic Device Failure Analysis Society","isPartOf":{"@id":"https:\/\/www.asminternational.org\/edfas\/#website"},"primaryImageOfPage":{"@id":"https:\/\/www.asminternational.org\/edfas\/videos\/-\/journal_content\/56\/10192\/24952279\/VIDEO\/#primaryimage"},"image":{"@id":"https:\/\/www.asminternational.org\/edfas\/videos\/-\/journal_content\/56\/10192\/24952279\/VIDEO\/#primaryimage"},"thumbnailUrl":"","datePublished":"2015-04-09T17:46:27+00:00","breadcrumb":{"@id":"https:\/\/www.asminternational.org\/edfas\/videos\/-\/journal_content\/56\/10192\/24952279\/VIDEO\/#breadcrumb"},"inLanguage":"en-US","potentialAction":[{"@type":"ReadAction","target":["https:\/\/www.asminternational.org\/edfas\/videos\/-\/journal_content\/56\/10192\/24952279\/VIDEO\/"]}]},{"@type":"ImageObject","inLanguage":"en-US","@id":"https:\/\/www.asminternational.org\/edfas\/videos\/-\/journal_content\/56\/10192\/24952279\/VIDEO\/#primaryimage","url":"","contentUrl":""},{"@type":"BreadcrumbList","@id":"https:\/\/www.asminternational.org\/edfas\/videos\/-\/journal_content\/56\/10192\/24952279\/VIDEO\/#breadcrumb","itemListElement":[{"@type":"ListItem","position":1,"name":"Home","item":"https:\/\/www.asminternational.org\/edfas\/"},{"@type":"ListItem","position":2,"name":"Carbon3D Demo"}]},{"@type":"WebSite","@id":"https:\/\/www.asminternational.org\/edfas\/#website","url":"https:\/\/www.asminternational.org\/edfas\/","name":"Electronic Device Failure Analysis Society","description":"Electronic Device Failure Analysis Society","publisher":{"@id":"https:\/\/www.asminternational.org\/edfas\/#organization"},"potentialAction":[{"@type":"SearchAction","target":{"@type":"EntryPoint","urlTemplate":"https:\/\/www.asminternational.org\/edfas\/?s={search_term_string}"},"query-input":{"@type":"PropertyValueSpecification","valueRequired":true,"valueName":"search_term_string"}}],"inLanguage":"en-US"},{"@type":"Organization","@id":"https:\/\/www.asminternational.org\/edfas\/#organization","name":"Electronic Device Failure Analysis Society","url":"https:\/\/www.asminternational.org\/edfas\/","logo":{"@type":"ImageObject","inLanguage":"en-US","@id":"https:\/\/www.asminternational.org\/edfas\/#\/schema\/logo\/image\/","url":"https:\/\/cdn-prd-main.asm-media.cloud\/uploads\/sites\/41\/2022\/10\/layout_set_logo.png","contentUrl":"https:\/\/cdn-prd-main.asm-media.cloud\/uploads\/sites\/41\/2022\/10\/layout_set_logo.png","width":360,"height":95,"caption":"Electronic Device Failure Analysis Society"},"image":{"@id":"https:\/\/www.asminternational.org\/edfas\/#\/schema\/logo\/image\/"}}]}},"acf":[],"_links":{"self":[{"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/video\/1840","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/video"}],"about":[{"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/types\/video"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/"}],"wp:attachment":[{"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/media?parent=1840"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}