{"id":1868,"date":"2018-10-24T15:20:17","date_gmt":"2018-10-24T15:20:17","guid":{"rendered":"https:\/\/staging.asminternational.org\/edfas\/video\/argonne-s-hot-new-camera\/"},"modified":"2018-10-24T15:20:17","modified_gmt":"2018-10-24T15:20:17","slug":"argonne-s-hot-new-camera","status":"publish","type":"video","link":"https:\/\/www.asminternational.org\/edfas\/videos\/-\/journal_content\/56\/10192\/35637309\/VIDEO\/","title":{"rendered":"Argonne\u2019s hot new camera"},"content":{"rendered":"

The addition of a new infrared camera at Argonne\u2019s Advanced Photon Source narrows the gap between basic and applied research in additive manufacturing. The new camera allows Argonne researchers to delve into the detailed dynamics of 3D printing by measuring thermal signatures across surfaces in real time. Argonne was the first U.S. national laboratory to integrate a metal 3D printing apparatus into a beamline, or photon path, for x-ray diagnostics. Adding the high-speed infrared camera to a synchrotron beamline is another first, and enables researchers to more closely replicate the deposition processes that occur on a real manufacturing floor.<\/p>\n","protected":false},"featured_media":58984,"template":"","class_list":["post-1868","video","type-video","status-publish","has-post-thumbnail","hentry"],"yoast_head":"\nArgonne\u2019s hot new camera - Electronic Device Failure Analysis Society<\/title>\n<meta name=\"robots\" content=\"noindex, follow\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Argonne\u2019s hot new camera - Electronic Device Failure Analysis Society\" \/>\n<meta property=\"og:description\" content=\"The addition of a new infrared camera at Argonne\u2019s Advanced Photon Source narrows the gap between basic and applied research in additive manufacturing.\" \/>\n<meta property=\"og:url\" content=\"https:\/\/www.asminternational.org\/edfas\/videos\/-\/journal_content\/56\/10192\/35637309\/VIDEO\/\" \/>\n<meta property=\"og:site_name\" content=\"Electronic Device Failure Analysis Society\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" content=\"Est. reading time\" \/>\n\t<meta name=\"twitter:data1\" content=\"1 minute\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\\\/\\\/schema.org\",\"@graph\":[{\"@type\":\"WebPage\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/videos\\\/-\\\/journal_content\\\/56\\\/10192\\\/35637309\\\/VIDEO\\\/\",\"url\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/videos\\\/-\\\/journal_content\\\/56\\\/10192\\\/35637309\\\/VIDEO\\\/\",\"name\":\"Argonne\u2019s hot new camera - Electronic Device Failure Analysis Society\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#website\"},\"primaryImageOfPage\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/videos\\\/-\\\/journal_content\\\/56\\\/10192\\\/35637309\\\/VIDEO\\\/#primaryimage\"},\"image\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/videos\\\/-\\\/journal_content\\\/56\\\/10192\\\/35637309\\\/VIDEO\\\/#primaryimage\"},\"thumbnailUrl\":\"\",\"datePublished\":\"2018-10-24T15:20:17+00:00\",\"breadcrumb\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/videos\\\/-\\\/journal_content\\\/56\\\/10192\\\/35637309\\\/VIDEO\\\/#breadcrumb\"},\"inLanguage\":\"en-US\",\"potentialAction\":[{\"@type\":\"ReadAction\",\"target\":[\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/videos\\\/-\\\/journal_content\\\/56\\\/10192\\\/35637309\\\/VIDEO\\\/\"]}]},{\"@type\":\"ImageObject\",\"inLanguage\":\"en-US\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/videos\\\/-\\\/journal_content\\\/56\\\/10192\\\/35637309\\\/VIDEO\\\/#primaryimage\",\"url\":\"\",\"contentUrl\":\"\"},{\"@type\":\"BreadcrumbList\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/videos\\\/-\\\/journal_content\\\/56\\\/10192\\\/35637309\\\/VIDEO\\\/#breadcrumb\",\"itemListElement\":[{\"@type\":\"ListItem\",\"position\":1,\"name\":\"Home\",\"item\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/\"},{\"@type\":\"ListItem\",\"position\":2,\"name\":\"Argonne\u2019s hot new camera\"}]},{\"@type\":\"WebSite\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#website\",\"url\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/\",\"name\":\"Electronic Device Failure Analysis Society\",\"description\":\"Electronic Device Failure Analysis Society\",\"publisher\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#organization\"},\"potentialAction\":[{\"@type\":\"SearchAction\",\"target\":{\"@type\":\"EntryPoint\",\"urlTemplate\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/?s={search_term_string}\"},\"query-input\":{\"@type\":\"PropertyValueSpecification\",\"valueRequired\":true,\"valueName\":\"search_term_string\"}}],\"inLanguage\":\"en-US\"},{\"@type\":\"Organization\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#organization\",\"name\":\"Electronic Device Failure Analysis Society\",\"url\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/\",\"logo\":{\"@type\":\"ImageObject\",\"inLanguage\":\"en-US\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#\\\/schema\\\/logo\\\/image\\\/\",\"url\":\"https:\\\/\\\/cdn-prd-main.asm-media.cloud\\\/uploads\\\/sites\\\/41\\\/2022\\\/10\\\/layout_set_logo.png\",\"contentUrl\":\"https:\\\/\\\/cdn-prd-main.asm-media.cloud\\\/uploads\\\/sites\\\/41\\\/2022\\\/10\\\/layout_set_logo.png\",\"width\":360,\"height\":95,\"caption\":\"Electronic Device Failure Analysis Society\"},\"image\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#\\\/schema\\\/logo\\\/image\\\/\"}}]}<\/script>\n<!-- \/ Yoast SEO plugin. -->","yoast_head_json":{"title":"Argonne\u2019s hot new camera - Electronic Device Failure Analysis Society","robots":{"index":"noindex","follow":"follow"},"og_locale":"en_US","og_type":"article","og_title":"Argonne\u2019s hot new camera - Electronic Device Failure Analysis Society","og_description":"The addition of a new infrared camera at Argonne\u2019s Advanced Photon Source narrows the gap between basic and applied research in additive manufacturing.","og_url":"https:\/\/www.asminternational.org\/edfas\/videos\/-\/journal_content\/56\/10192\/35637309\/VIDEO\/","og_site_name":"Electronic Device Failure Analysis Society","twitter_card":"summary_large_image","twitter_misc":{"Est. reading time":"1 minute"},"schema":{"@context":"https:\/\/schema.org","@graph":[{"@type":"WebPage","@id":"https:\/\/www.asminternational.org\/edfas\/videos\/-\/journal_content\/56\/10192\/35637309\/VIDEO\/","url":"https:\/\/www.asminternational.org\/edfas\/videos\/-\/journal_content\/56\/10192\/35637309\/VIDEO\/","name":"Argonne\u2019s hot new camera - Electronic Device Failure Analysis Society","isPartOf":{"@id":"https:\/\/www.asminternational.org\/edfas\/#website"},"primaryImageOfPage":{"@id":"https:\/\/www.asminternational.org\/edfas\/videos\/-\/journal_content\/56\/10192\/35637309\/VIDEO\/#primaryimage"},"image":{"@id":"https:\/\/www.asminternational.org\/edfas\/videos\/-\/journal_content\/56\/10192\/35637309\/VIDEO\/#primaryimage"},"thumbnailUrl":"","datePublished":"2018-10-24T15:20:17+00:00","breadcrumb":{"@id":"https:\/\/www.asminternational.org\/edfas\/videos\/-\/journal_content\/56\/10192\/35637309\/VIDEO\/#breadcrumb"},"inLanguage":"en-US","potentialAction":[{"@type":"ReadAction","target":["https:\/\/www.asminternational.org\/edfas\/videos\/-\/journal_content\/56\/10192\/35637309\/VIDEO\/"]}]},{"@type":"ImageObject","inLanguage":"en-US","@id":"https:\/\/www.asminternational.org\/edfas\/videos\/-\/journal_content\/56\/10192\/35637309\/VIDEO\/#primaryimage","url":"","contentUrl":""},{"@type":"BreadcrumbList","@id":"https:\/\/www.asminternational.org\/edfas\/videos\/-\/journal_content\/56\/10192\/35637309\/VIDEO\/#breadcrumb","itemListElement":[{"@type":"ListItem","position":1,"name":"Home","item":"https:\/\/www.asminternational.org\/edfas\/"},{"@type":"ListItem","position":2,"name":"Argonne\u2019s hot new camera"}]},{"@type":"WebSite","@id":"https:\/\/www.asminternational.org\/edfas\/#website","url":"https:\/\/www.asminternational.org\/edfas\/","name":"Electronic Device Failure Analysis Society","description":"Electronic Device Failure Analysis Society","publisher":{"@id":"https:\/\/www.asminternational.org\/edfas\/#organization"},"potentialAction":[{"@type":"SearchAction","target":{"@type":"EntryPoint","urlTemplate":"https:\/\/www.asminternational.org\/edfas\/?s={search_term_string}"},"query-input":{"@type":"PropertyValueSpecification","valueRequired":true,"valueName":"search_term_string"}}],"inLanguage":"en-US"},{"@type":"Organization","@id":"https:\/\/www.asminternational.org\/edfas\/#organization","name":"Electronic Device Failure Analysis Society","url":"https:\/\/www.asminternational.org\/edfas\/","logo":{"@type":"ImageObject","inLanguage":"en-US","@id":"https:\/\/www.asminternational.org\/edfas\/#\/schema\/logo\/image\/","url":"https:\/\/cdn-prd-main.asm-media.cloud\/uploads\/sites\/41\/2022\/10\/layout_set_logo.png","contentUrl":"https:\/\/cdn-prd-main.asm-media.cloud\/uploads\/sites\/41\/2022\/10\/layout_set_logo.png","width":360,"height":95,"caption":"Electronic Device Failure Analysis Society"},"image":{"@id":"https:\/\/www.asminternational.org\/edfas\/#\/schema\/logo\/image\/"}}]}},"acf":[],"_links":{"self":[{"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/video\/1868","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/video"}],"about":[{"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/types\/video"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/"}],"wp:attachment":[{"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/media?parent=1868"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}