{"id":2028,"date":"2021-10-22T09:05:13","date_gmt":"2021-10-22T09:05:13","guid":{"rendered":"https:\/\/staging.asminternational.org\/edfas\/video\/order-hardening-and-heat-hardening-in-gold\/"},"modified":"2021-10-22T09:05:13","modified_gmt":"2021-10-22T09:05:13","slug":"order-hardening-and-heat-hardening-in-gold","status":"publish","type":"video","link":"https:\/\/www.asminternational.org\/edfas\/videos\/-\/journal_content\/56\/10192\/46001494\/VIDEO\/","title":{"rendered":"Order hardening and heat hardening in gold"},"content":{"rendered":"<p>This video explains order hardening and heat hardening in gold alloys. Order hardening is the transformation of disordered solid solution to an ordered solid solution. Heat hardening is strengthening due to structural transformations and dislocation hindrance.&nbsp;<\/p>\n","protected":false},"featured_media":59146,"template":"","class_list":["post-2028","video","type-video","status-publish","has-post-thumbnail","hentry"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.9 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>Order hardening and heat hardening in gold - Electronic Device Failure Analysis Society<\/title>\n<meta name=\"robots\" content=\"noindex, follow\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Order hardening and heat hardening in gold - Electronic Device Failure Analysis Society\" \/>\n<meta property=\"og:description\" content=\"This video explains order hardening and heat hardening in gold alloys. Order hardening is the transformation of disordered solid solution to an ordered solid solution. Heat hardening is strengthening due to structural transformations and dislocation hindrance.&nbsp;\" \/>\n<meta property=\"og:url\" content=\"https:\/\/www.asminternational.org\/edfas\/videos\/-\/journal_content\/56\/10192\/46001494\/VIDEO\/\" \/>\n<meta property=\"og:site_name\" content=\"Electronic Device Failure Analysis Society\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\\\/\\\/schema.org\",\"@graph\":[{\"@type\":\"WebPage\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/videos\\\/-\\\/journal_content\\\/56\\\/10192\\\/46001494\\\/VIDEO\\\/\",\"url\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/videos\\\/-\\\/journal_content\\\/56\\\/10192\\\/46001494\\\/VIDEO\\\/\",\"name\":\"Order hardening and heat hardening in gold - Electronic Device Failure Analysis Society\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#website\"},\"primaryImageOfPage\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/videos\\\/-\\\/journal_content\\\/56\\\/10192\\\/46001494\\\/VIDEO\\\/#primaryimage\"},\"image\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/videos\\\/-\\\/journal_content\\\/56\\\/10192\\\/46001494\\\/VIDEO\\\/#primaryimage\"},\"thumbnailUrl\":\"\",\"datePublished\":\"2021-10-22T09:05:13+00:00\",\"breadcrumb\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/videos\\\/-\\\/journal_content\\\/56\\\/10192\\\/46001494\\\/VIDEO\\\/#breadcrumb\"},\"inLanguage\":\"en-US\",\"potentialAction\":[{\"@type\":\"ReadAction\",\"target\":[\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/videos\\\/-\\\/journal_content\\\/56\\\/10192\\\/46001494\\\/VIDEO\\\/\"]}]},{\"@type\":\"ImageObject\",\"inLanguage\":\"en-US\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/videos\\\/-\\\/journal_content\\\/56\\\/10192\\\/46001494\\\/VIDEO\\\/#primaryimage\",\"url\":\"\",\"contentUrl\":\"\"},{\"@type\":\"BreadcrumbList\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/videos\\\/-\\\/journal_content\\\/56\\\/10192\\\/46001494\\\/VIDEO\\\/#breadcrumb\",\"itemListElement\":[{\"@type\":\"ListItem\",\"position\":1,\"name\":\"Home\",\"item\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/\"},{\"@type\":\"ListItem\",\"position\":2,\"name\":\"Order hardening and heat hardening in gold\"}]},{\"@type\":\"WebSite\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#website\",\"url\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/\",\"name\":\"Electronic Device Failure Analysis Society\",\"description\":\"Electronic Device Failure Analysis Society\",\"publisher\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#organization\"},\"potentialAction\":[{\"@type\":\"SearchAction\",\"target\":{\"@type\":\"EntryPoint\",\"urlTemplate\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/?s={search_term_string}\"},\"query-input\":{\"@type\":\"PropertyValueSpecification\",\"valueRequired\":true,\"valueName\":\"search_term_string\"}}],\"inLanguage\":\"en-US\"},{\"@type\":\"Organization\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#organization\",\"name\":\"Electronic Device Failure Analysis Society\",\"url\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/\",\"logo\":{\"@type\":\"ImageObject\",\"inLanguage\":\"en-US\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#\\\/schema\\\/logo\\\/image\\\/\",\"url\":\"https:\\\/\\\/cdn-prd-main.asm-media.cloud\\\/uploads\\\/sites\\\/41\\\/2022\\\/10\\\/layout_set_logo.png\",\"contentUrl\":\"https:\\\/\\\/cdn-prd-main.asm-media.cloud\\\/uploads\\\/sites\\\/41\\\/2022\\\/10\\\/layout_set_logo.png\",\"width\":360,\"height\":95,\"caption\":\"Electronic Device Failure Analysis Society\"},\"image\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#\\\/schema\\\/logo\\\/image\\\/\"}}]}<\/script>\n<!-- \/ Yoast SEO plugin. -->","yoast_head_json":{"title":"Order hardening and heat hardening in gold - Electronic Device Failure Analysis Society","robots":{"index":"noindex","follow":"follow"},"og_locale":"en_US","og_type":"article","og_title":"Order hardening and heat hardening in gold - Electronic Device Failure Analysis Society","og_description":"This video explains order hardening and heat hardening in gold alloys. Order hardening is the transformation of disordered solid solution to an ordered solid solution. Heat hardening is strengthening due to structural transformations and dislocation hindrance.&nbsp;","og_url":"https:\/\/www.asminternational.org\/edfas\/videos\/-\/journal_content\/56\/10192\/46001494\/VIDEO\/","og_site_name":"Electronic Device Failure Analysis Society","twitter_card":"summary_large_image","schema":{"@context":"https:\/\/schema.org","@graph":[{"@type":"WebPage","@id":"https:\/\/www.asminternational.org\/edfas\/videos\/-\/journal_content\/56\/10192\/46001494\/VIDEO\/","url":"https:\/\/www.asminternational.org\/edfas\/videos\/-\/journal_content\/56\/10192\/46001494\/VIDEO\/","name":"Order hardening and heat hardening in gold - Electronic Device Failure Analysis Society","isPartOf":{"@id":"https:\/\/www.asminternational.org\/edfas\/#website"},"primaryImageOfPage":{"@id":"https:\/\/www.asminternational.org\/edfas\/videos\/-\/journal_content\/56\/10192\/46001494\/VIDEO\/#primaryimage"},"image":{"@id":"https:\/\/www.asminternational.org\/edfas\/videos\/-\/journal_content\/56\/10192\/46001494\/VIDEO\/#primaryimage"},"thumbnailUrl":"","datePublished":"2021-10-22T09:05:13+00:00","breadcrumb":{"@id":"https:\/\/www.asminternational.org\/edfas\/videos\/-\/journal_content\/56\/10192\/46001494\/VIDEO\/#breadcrumb"},"inLanguage":"en-US","potentialAction":[{"@type":"ReadAction","target":["https:\/\/www.asminternational.org\/edfas\/videos\/-\/journal_content\/56\/10192\/46001494\/VIDEO\/"]}]},{"@type":"ImageObject","inLanguage":"en-US","@id":"https:\/\/www.asminternational.org\/edfas\/videos\/-\/journal_content\/56\/10192\/46001494\/VIDEO\/#primaryimage","url":"","contentUrl":""},{"@type":"BreadcrumbList","@id":"https:\/\/www.asminternational.org\/edfas\/videos\/-\/journal_content\/56\/10192\/46001494\/VIDEO\/#breadcrumb","itemListElement":[{"@type":"ListItem","position":1,"name":"Home","item":"https:\/\/www.asminternational.org\/edfas\/"},{"@type":"ListItem","position":2,"name":"Order hardening and heat hardening in gold"}]},{"@type":"WebSite","@id":"https:\/\/www.asminternational.org\/edfas\/#website","url":"https:\/\/www.asminternational.org\/edfas\/","name":"Electronic Device Failure Analysis Society","description":"Electronic Device Failure Analysis Society","publisher":{"@id":"https:\/\/www.asminternational.org\/edfas\/#organization"},"potentialAction":[{"@type":"SearchAction","target":{"@type":"EntryPoint","urlTemplate":"https:\/\/www.asminternational.org\/edfas\/?s={search_term_string}"},"query-input":{"@type":"PropertyValueSpecification","valueRequired":true,"valueName":"search_term_string"}}],"inLanguage":"en-US"},{"@type":"Organization","@id":"https:\/\/www.asminternational.org\/edfas\/#organization","name":"Electronic Device Failure Analysis Society","url":"https:\/\/www.asminternational.org\/edfas\/","logo":{"@type":"ImageObject","inLanguage":"en-US","@id":"https:\/\/www.asminternational.org\/edfas\/#\/schema\/logo\/image\/","url":"https:\/\/cdn-prd-main.asm-media.cloud\/uploads\/sites\/41\/2022\/10\/layout_set_logo.png","contentUrl":"https:\/\/cdn-prd-main.asm-media.cloud\/uploads\/sites\/41\/2022\/10\/layout_set_logo.png","width":360,"height":95,"caption":"Electronic Device Failure Analysis Society"},"image":{"@id":"https:\/\/www.asminternational.org\/edfas\/#\/schema\/logo\/image\/"}}]}},"acf":[],"_links":{"self":[{"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/video\/2028","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/video"}],"about":[{"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/types\/video"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/"}],"wp:attachment":[{"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/media?parent=2028"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}