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ISTFA 2018 Conference summary and highlights

November 08, 2018
Source: ASM International

Two weeks ago, ASM Events coordinated the International Symposium for Testing and Failure Analysis (ISTFA) in Phoenix, co-located with IEEE International Test Conference (ITC). The event drew 944 attendees and included 118 exhibitor booths, with the total attendance of both events over 1800. ISTFA exceeded its 2017 attendance record by 80 people.

Saturday the conference kicked off with three education courses:

— Failure Analysis of Electronic Devices

— Fault Isolation Techniques for Failure Analysis

— Beam-Based Defect Localization

 

Sunday continued with five tutorial topics:

— Package and Physical Analysis Challenges Tutorials

— Microscopy Tutorials

— Electrical and Yield I Tutorials

— Fault Isolation Tutorials

— Featured Tutorials

 

In addition, a focus group on content development and the EDFA journal/magazine staff held meetings that evening.

Monday opened with the EDFAS general membership meeting and opening sessions, then the comprehensive technical programming continued throughout the day. Monday evening the Tools of the Trade Tour was an overwhelming success with 11 companies participating and over 140 attendees. AND…………Monday was not over yet — the social event was held at Lucky Strike, where attendees enjoyed a variety of games, bowling, networking, dinner, and cocktails to end a very successful day.

The rest of the week was busy with two Keynote presentations, dedicated exhibit hours, a joint exposition with an exhibitor reception with ITC, programming, tutorials, panel sessions, user groups, and the poster and video contests with dessert reception on the expo floor.

www.asminternational.org/web/istfa-2018  

 

Subject Classifications

Industries and Applications | Consumer Products

Industries and Applications | Electronics

Industries and Applications | Nanotechnology

Materials Testing and Evaluation | Failure Analysis

Materials Testing and Evaluation | Microelectronic Failure Analysis


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