The Linde Group, Holly Springs, Ga., launches its Hydroprime plant line of innovative, cost effective compact hydrogen generators based on proven steam methane reforming technology.
Continue readingMicroporous copper foam with relative density of 37% is effective heat sink
Goodfellow, England, offers a microporous copper foam with pore sizes between 300 and 600 µm and a relative density of around 37%.
Continue readingCentorr ships furnaces for production of aluminum nitride substrates
Centorr Vacuum Industries, Nashua, N.H., has shipped orders for two high-temperature sintering furnaces for 2015 delivery to a leading firm in the production of aluminum nitride substrates for the LED market in China.
Continue readingFemtosecond lasers make metals superhydrophobic
Scientists at the University of Rochester, N.Y., have reportedly transformed platinum, titanium, and brass into superhydrophobic materials with femtosecond laser pulses.
Continue readingHarper vertical and rotary reactors support microelectronics research in China
Harper International, Buffalo, N.Y., has finalized a contract exceeding $3 million for high-temperature vertical and rotary reactors to support the East China Research Institute of Microelectronics (ECRIM).
Continue readingGraftech to relocate headquarters to Independence, R&D to Brooklyn Heights
GrafTech International Ltd., Parma, Ohio, announces that its global headquarters will be relocated to Independence, Ohio, and will house approximately 50 employees working in the company’s corporate functions.
Continue readingSemiconductor equipment sales to reach nearly $44B in 2015
SEMI, San Jose, Calif., projects that worldwide sales of new semiconductor manufacturing equipment will increase 19.3% to $38.0 billion in 2014, according to its year-end forecast.
Continue readingSematech makes progress in EUV-resist outgas testing
Sematech, Albany, N.Y., reports that promising progress has been made in qualifying outgassing specifications for extreme ultraviolet (EUV) lithography.
Continue readingMentor Graphics EZ-VIP provides re-usable building blocks to cut testbench assembly time
Mentor Graphics Corp., Wilsonville, Ore., announces the immediate availability of its new Mentor EZ-VIP PCI Express Verification IP (VIP).
Continue readingHelios PFIB designed for semiconductor failure analysis and process development
FEI Corp., Hillsboro, Ore., offers the Helios PFIB for large area deprocessing to enable electrical fault isolation of advanced process ICs, and advanced failure analysis of 3D packages.
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