{"id":3172,"date":"2026-09-14T16:33:13","date_gmt":"2026-09-14T20:33:13","guid":{"rendered":"https:\/\/www.asminternational.org\/istfa-event\/?page_id=3172"},"modified":"2026-09-21T12:10:29","modified_gmt":"2026-09-21T16:10:29","slug":"call-for-papers","status":"publish","type":"page","link":"https:\/\/www.asminternational.org\/istfa-event\/future-istfa\/call-for-papers\/","title":{"rendered":"Call for Papers"},"content":{"rendered":"<h1>Call for Abstracts \u2013 ISTFA 2027<\/h1>\n\n<p><strong>October 31 \u2013 November 4, 2027 | Phoenix, Arizona<\/strong><br \/><strong>Abstract Submission Deadline: April 16, 2027<\/strong><\/p>\n\n<h4>Failure Analysis of Ultra-Efficient Electronics<\/h4>\n\n<p>The drive for greater energy efficiency is reshaping the semiconductor industry. As AI, cloud computing, and connected devices continue to accelerate demand for computing power, energy consumption associated with microelectronics has become an increasingly important global concern. At the same time, advances in device scaling, low-voltage operation, advanced packaging, and heterogeneous integration are pushing power delivery systems to their limits. Today's high-performance AI devices are being designed to manage currents measuring in thousands of amps, bringing renewed attention to the fundamental challenges of resistance, power loss, and thermal management.<\/p><p>These innovations are enabling unprecedented levels of performance and efficiency, but they also introduce new reliability risks and failure mechanisms. From advanced packaging architectures and high-current interconnects to thermal stresses and power integrity challenges, failure analysts must develop new tools, methodologies, and insights to understand and mitigate the complexities of next-generation microelectronic<\/p>\n\n<p>Come to share your experiences and advance the industry and your career at the International Symposium for Testing and Failure Analysis, the premier event for the microelectronics failure analysis community. <strong>We invite you to submit your work for publication and to present it to the community in Phoenix, Arizona, for the 53rd year of ISTFA.<\/strong><\/p>\n\n<ul><li>Original, unpublished, and novel material is being solicited on testing, analysis, characterization, and metrology of electronic devices and systems from the nanoscale and upward.<\/li><li>Case studies, review papers, and non-commercial work from vendors are encouraged.<\/li><\/ul><p>Paper selection is based entirely on information submitted in abstracts and will be evaluated on novelty, completeness, quality, and benefit to the FA community. <strong>Abstracts should be a minimum of two pages long, including images and figures. References are required.<\/strong><\/p>\n\n<p>Original, unpublished abstracts are solicited in the following topic areas:<\/p>\n\n<ul><li><strong>AI Applications for Failure Analysis<\/strong><\/li><li><strong>Boards and Systems<\/strong><\/li><li><strong>Design for Analysis, Test, and Diagnostics<\/strong><\/li><li><strong>Device Analysis Case Studies<\/strong><\/li><li><strong>Die Level Fault Isolation<\/strong><\/li><li><strong>Emerging FA Techniques and Concepts<\/strong><\/li><li><strong>FA of Ultra-Efficient Device Technologies<\/strong><\/li><li><strong>FA Process and Workflows<\/strong><\/li><li><strong>FIB Sample Preparation and Circuit Edit<\/strong><\/li><li><strong>Microscopy Analysis and Material Characterization<\/strong><\/li><li><strong>Package Level Fault Isolation<\/strong><\/li><li><strong>Product Yield<\/strong><\/li><li><strong>Sample Preparation and Device De-processing<\/strong><\/li><li><strong>Silicon Photonics and Co-Packaged Optics<\/strong><\/li><li><strong>System in Package and 3D Devices<\/strong><\/li><li><strong>Trusted Electronics<\/strong><\/li><li><strong>Wide Bandgap Power Devices (SiC, GaN, new materials)<\/strong><\/li><\/ul>\n\n<p><a href=\"https:\/\/www.asminternational.org\/\"><img class=\"alignnone wp-image-2535 size-full\" src=\"https:\/\/cdn-prd-main.asm-media.cloud\/uploads\/sites\/99\/2026\/03\/ASM_Logo_Black_Stacked-250x150-6-120x72-2.webp\" alt=\"\" width=\"120\" height=\"72\" \/><\/a><br \/><br \/><a href=\"https:\/\/www.asminternational.org\/edfas\/\"><img class=\"alignnone wp-image-2116 size-full\" src=\"https:\/\/cdn-prd-main.asm-media.cloud\/uploads\/sites\/99\/2025\/11\/Logo-EDFAS.webp\" alt=\"\" width=\"265\" height=\"70\" \/><\/a><\/p>","protected":false},"excerpt":{"rendered":"","protected":false},"author":63081,"featured_media":0,"parent":3165,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"_acf_changed":false,"footnotes":""},"class_list":["post-3172","page","type-page","status-publish","hentry"],"bricks_content":"<h1>Call for Abstracts \u2013 ISTFA 2027<\/h1>\n\n<p><strong>October 31 \u2013 November 4, 2027 | Phoenix, Arizona<\/strong><br \/><strong>Abstract Submission Deadline: April 16, 2027<\/strong><\/p>\n\n<h4>Failure Analysis of Ultra-Efficient Electronics<\/h4>\n\n<p>The drive for greater energy efficiency is reshaping the semiconductor industry. As AI, cloud computing, and connected devices continue to accelerate demand for computing power, energy consumption associated with microelectronics has become an increasingly important global concern. At the same time, advances in device scaling, low-voltage operation, advanced packaging, and heterogeneous integration are pushing power delivery systems to their limits. Today's high-performance AI devices are being designed to manage currents measuring in thousands of amps, bringing renewed attention to the fundamental challenges of resistance, power loss, and thermal management.<\/p><p>These innovations are enabling unprecedented levels of performance and efficiency, but they also introduce new reliability risks and failure mechanisms. From advanced packaging architectures and high-current interconnects to thermal stresses and power integrity challenges, failure analysts must develop new tools, methodologies, and insights to understand and mitigate the complexities of next-generation microelectronic<\/p>\n\n<p>Come to share your experiences and advance the industry and your career at the International Symposium for Testing and Failure Analysis, the premier event for the microelectronics failure analysis community. <strong>We invite you to submit your work for publication and to present it to the community in Phoenix, Arizona, for the 53rd year of ISTFA.<\/strong><\/p>\n\n<ul><li>Original, unpublished, and novel material is being solicited on testing, analysis, characterization, and metrology of electronic devices and systems from the nanoscale and upward.<\/li><li>Case studies, review papers, and non-commercial work from vendors are encouraged.<\/li><\/ul><p>Paper selection is based entirely on information submitted in abstracts and will be evaluated on novelty, completeness, quality, and benefit to the FA community. <strong>Abstracts should be a minimum of two pages long, including images and figures. References are required.<\/strong><\/p>\n\n<p>Original, unpublished abstracts are solicited in the following topic areas:<\/p>\n\n<ul><li><strong>AI Applications for Failure Analysis<\/strong><\/li><li><strong>Boards and Systems<\/strong><\/li><li><strong>Design for Analysis, Test, and Diagnostics<\/strong><\/li><li><strong>Device Analysis Case Studies<\/strong><\/li><li><strong>Die Level Fault Isolation<\/strong><\/li><li><strong>Emerging FA Techniques and Concepts<\/strong><\/li><li><strong>FA of Ultra-Efficient Device Technologies<\/strong><\/li><li><strong>FA Process and Workflows<\/strong><\/li><li><strong>FIB Sample Preparation and Circuit Edit<\/strong><\/li><li><strong>Microscopy Analysis and Material Characterization<\/strong><\/li><li><strong>Package Level Fault Isolation<\/strong><\/li><li><strong>Product Yield<\/strong><\/li><li><strong>Sample Preparation and Device De-processing<\/strong><\/li><li><strong>Silicon Photonics and Co-Packaged Optics<\/strong><\/li><li><strong>System in Package and 3D Devices<\/strong><\/li><li><strong>Trusted Electronics<\/strong><\/li><li><strong>Wide Bandgap Power Devices (SiC, GaN, new materials)<\/strong><\/li><\/ul>\n\n<p><a href=\"https:\/\/www.asminternational.org\/\"><img class=\"alignnone wp-image-2535 size-full\" src=\"https:\/\/cdn-prd-main.asm-media.cloud\/uploads\/sites\/99\/2026\/03\/ASM_Logo_Black_Stacked-250x150-6-120x72-2.webp\" alt=\"\" width=\"120\" height=\"72\" \/><\/a><br \/><br \/><a href=\"https:\/\/www.asminternational.org\/edfas\/\"><img class=\"alignnone wp-image-2116 size-full\" src=\"https:\/\/cdn-prd-main.asm-media.cloud\/uploads\/sites\/99\/2025\/11\/Logo-EDFAS.webp\" alt=\"\" width=\"265\" height=\"70\" \/><\/a><\/p>","yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.9 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>Call for Papers - ISTFA | ASM International<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.asminternational.org\/istfa-event\/future-istfa\/call-for-papers\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Call for Papers - ISTFA | ASM International\" \/>\n<meta property=\"og:url\" content=\"https:\/\/www.asminternational.org\/istfa-event\/future-istfa\/call-for-papers\/\" \/>\n<meta property=\"og:site_name\" content=\"ISTFA | ASM International\" \/>\n<meta property=\"article:modified_time\" content=\"2026-09-21T16:10:29+00:00\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\\\/\\\/schema.org\",\"@graph\":[{\"@type\":\"WebPage\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/istfa-event\\\/future-istfa\\\/call-for-papers\\\/\",\"url\":\"https:\\\/\\\/www.asminternational.org\\\/istfa-event\\\/future-istfa\\\/call-for-papers\\\/\",\"name\":\"Call for Papers - ISTFA | ASM International\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/istfa-event\\\/#website\"},\"datePublished\":\"2026-09-14T20:33:13+00:00\",\"dateModified\":\"2026-09-21T16:10:29+00:00\",\"breadcrumb\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/istfa-event\\\/future-istfa\\\/call-for-papers\\\/#breadcrumb\"},\"inLanguage\":\"en-US\",\"potentialAction\":[{\"@type\":\"ReadAction\",\"target\":[\"https:\\\/\\\/www.asminternational.org\\\/istfa-event\\\/future-istfa\\\/call-for-papers\\\/\"]}]},{\"@type\":\"BreadcrumbList\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/istfa-event\\\/future-istfa\\\/call-for-papers\\\/#breadcrumb\",\"itemListElement\":[{\"@type\":\"ListItem\",\"position\":1,\"name\":\"Home\",\"item\":\"https:\\\/\\\/www.asminternational.org\\\/istfa-event\\\/\"},{\"@type\":\"ListItem\",\"position\":2,\"name\":\"Future ISTFA\",\"item\":\"https:\\\/\\\/www.asminternational.org\\\/istfa-event\\\/future-istfa\\\/\"},{\"@type\":\"ListItem\",\"position\":3,\"name\":\"Call for Papers\"}]},{\"@type\":\"WebSite\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/istfa-event\\\/#website\",\"url\":\"https:\\\/\\\/www.asminternational.org\\\/istfa-event\\\/\",\"name\":\"ISTFA | ASM International\",\"description\":\"International Materials, Applications &amp; 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