{"id":443,"date":"2025-06-27T18:54:16","date_gmt":"2025-06-27T18:54:43","guid":{"rendered":"https:\/\/staging.asminternational.org\/istfa\/technical-program\/"},"modified":"2026-09-23T14:12:02","modified_gmt":"2026-09-23T18:12:02","slug":"learn","status":"publish","type":"page","link":"https:\/\/www.asminternational.org\/istfa-event\/learn\/","title":{"rendered":"Learn"},"content":{"rendered":"<h1>Technical Program<\/h1>\n\nVIEW THE TECHNICAL PROGRAM\n\n<h5><strong>Plan today to attend ISTFA 2026<br \/><br \/><\/strong><\/h5><p>The comprehensive event offers attendees a dynamic experience with diverse learning opportunities. From engaging oral and poster presentations to interactive user groups and tutorials, participants can delve into intricate research findings and innovative ideas. Keynotes and panels provide overarching insights from industry experts, enriching collective knowledge. With such a multifaceted program, attendees are sure to leave inspired and equipped with valuable insights for future endeavors.<\/p><h6>Topics for the 2026 conference include:<\/h6><ul><li>AI Applications for Failure Analysis<\/li><li>Emerging FA Techniques and Concepts<\/li><li>Die Level Fault Isolation<\/li><li>Package Level Fault Isolation<\/li><li>Packaging and Assembly<\/li><li>System in Package and 3D Devices<\/li><li>Wide Bandgap Power Devices (SiC, GaN, new materials)<\/li><li>Boards and Systems<\/li><li>FIB Circuit Edit<\/li><li>Sample Preparation and Device De-processing<\/li><li>FIB Sample Preparation<\/li><li>Microscopy Analysis and Material Characterization<\/li><li>Case Studies: Device Analysis\u00a0<\/li><li>Case Studies: FA Process and Workflows<\/li><li>Product Yield, Test and Diagnostics<\/li><li>Trusted Electronics<\/li><\/ul>\n\nISTFA KEYNOTE\n\nUSER GROUPS\n\nEDUCATION WORKSHOPS\n\nPANEL DISCUSSION\n\nTOOLS OF THE TRADE\n\nTECHNICAL PROGRAM","protected":false},"excerpt":{"rendered":"","protected":false},"author":71671,"featured_media":0,"parent":0,"menu_order":5,"comment_status":"closed","ping_status":"closed","template":"","meta":{"_acf_changed":false,"footnotes":""},"class_list":["post-443","page","type-page","status-publish","hentry"],"bricks_content":"<h1>Technical Program<\/h1>\n\nVIEW THE TECHNICAL PROGRAM\n\n<h5><strong>Plan today to attend ISTFA 2026<br \/><br \/><\/strong><\/h5><p>The comprehensive event offers attendees a dynamic experience with diverse learning opportunities. From engaging oral and poster presentations to interactive user groups and tutorials, participants can delve into intricate research findings and innovative ideas. Keynotes and panels provide overarching insights from industry experts, enriching collective knowledge. With such a multifaceted program, attendees are sure to leave inspired and equipped with valuable insights for future endeavors.<\/p><h6>Topics for the 2026 conference include:<\/h6><ul><li>AI Applications for Failure Analysis<\/li><li>Emerging FA Techniques and Concepts<\/li><li>Die Level Fault Isolation<\/li><li>Package Level Fault Isolation<\/li><li>Packaging and Assembly<\/li><li>System in Package and 3D Devices<\/li><li>Wide Bandgap Power Devices (SiC, GaN, new materials)<\/li><li>Boards and Systems<\/li><li>FIB Circuit Edit<\/li><li>Sample Preparation and Device De-processing<\/li><li>FIB Sample Preparation<\/li><li>Microscopy Analysis and Material Characterization<\/li><li>Case Studies: Device Analysis\u00a0<\/li><li>Case Studies: FA Process and Workflows<\/li><li>Product Yield, Test and Diagnostics<\/li><li>Trusted Electronics<\/li><\/ul>\n\nISTFA KEYNOTE\n\nUSER GROUPS\n\nEDUCATION WORKSHOPS\n\nPANEL DISCUSSION\n\nTOOLS OF THE TRADE\n\nTECHNICAL PROGRAM","yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.9 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>Learn - ISTFA | ASM International<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.asminternational.org\/istfa-event\/learn\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Learn - ISTFA | ASM International\" \/>\n<meta property=\"og:url\" content=\"https:\/\/www.asminternational.org\/istfa-event\/learn\/\" \/>\n<meta property=\"og:site_name\" content=\"ISTFA | ASM International\" \/>\n<meta property=\"article:modified_time\" content=\"2026-09-23T18:12:02+00:00\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\\\/\\\/schema.org\",\"@graph\":[{\"@type\":\"WebPage\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/istfa-event\\\/learn\\\/\",\"url\":\"https:\\\/\\\/www.asminternational.org\\\/istfa-event\\\/learn\\\/\",\"name\":\"Learn - ISTFA | ASM International\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/istfa-event\\\/#website\"},\"datePublished\":\"2025-06-27T18:54:43+00:00\",\"dateModified\":\"2026-09-23T18:12:02+00:00\",\"breadcrumb\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/istfa-event\\\/learn\\\/#breadcrumb\"},\"inLanguage\":\"en-US\",\"potentialAction\":[{\"@type\":\"ReadAction\",\"target\":[\"https:\\\/\\\/www.asminternational.org\\\/istfa-event\\\/learn\\\/\"]}]},{\"@type\":\"BreadcrumbList\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/istfa-event\\\/learn\\\/#breadcrumb\",\"itemListElement\":[{\"@type\":\"ListItem\",\"position\":1,\"name\":\"Home\",\"item\":\"https:\\\/\\\/www.asminternational.org\\\/istfa-event\\\/\"},{\"@type\":\"ListItem\",\"position\":2,\"name\":\"Learn\"}]},{\"@type\":\"WebSite\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/istfa-event\\\/#website\",\"url\":\"https:\\\/\\\/www.asminternational.org\\\/istfa-event\\\/\",\"name\":\"ISTFA | ASM International\",\"description\":\"International Materials, Applications &amp; 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