{"id":445,"date":"2025-06-27T18:54:43","date_gmt":"2025-06-27T18:54:43","guid":{"rendered":"https:\/\/staging.asminternational.org\/istfa\/panel-sessions\/"},"modified":"2026-10-28T14:10:11","modified_gmt":"2026-10-28T18:10:11","slug":"panel-discussion","status":"publish","type":"page","link":"https:\/\/www.asminternational.org\/istfa-event\/learn\/panel-discussion\/","title":{"rendered":"Panel Discussion"},"content":{"rendered":"<h1>Panel Discussion<\/h1>\n\n<p data-pm-slice=\"1 1 []\">The <strong>ISTFA 2027 Panel Discussion<\/strong> will provide an engaging platform for industry experts, researchers, and technology leaders to share insights, exchange perspectives, and explore the evolving challenges and opportunities in semiconductor testing and failure analysis. Through interactive discussions, attendees will have the opportunity to gain valuable knowledge about emerging technologies, industry trends, and innovative approaches shaping the future of the field. Additional information, including discussion topics, moderators, panelists, and scheduling details, is currently being developed and will be announced as details become available. Please check back for updates!<\/p>","protected":false},"excerpt":{"rendered":"","protected":false},"author":71671,"featured_media":0,"parent":443,"menu_order":4,"comment_status":"closed","ping_status":"closed","template":"","meta":{"_acf_changed":false,"footnotes":""},"class_list":["post-445","page","type-page","status-publish","hentry"],"bricks_content":"<h1>Panel Discussion<\/h1>\n\n<p data-pm-slice=\"1 1 []\">The <strong>ISTFA 2027 Panel Discussion<\/strong> will provide an engaging platform for industry experts, researchers, and technology leaders to share insights, exchange perspectives, and explore the evolving challenges and opportunities in semiconductor testing and failure analysis. Through interactive discussions, attendees will have the opportunity to gain valuable knowledge about emerging technologies, industry trends, and innovative approaches shaping the future of the field. Additional information, including discussion topics, moderators, panelists, and scheduling details, is currently being developed and will be announced as details become available. 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