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Microelectronics Failure Analysis Desk Reference, 6th Ed (Book & CD set)

Editor: EDFAS Desk Reference Committee   |   Hardcover   |   Product code: 09110Z   |   ISBN: 978-1-61503-725-4

Classified as: Microelectronic Failure Analysis

Price: $199.00 Member Price: $149.00

Comprehensive guide to the process and test methods used for electronic device failure analysis. Contains dozens of articles—contributed by industry expertscovering a wide range of topics involving the failure analysis of microelectronics. It places the most important and up-to-date information on this subject at your fingertips. 

Topic coverage includes: 

  • Failure Analysis Process Flow
  • Failure Verification 
  • Failure Modes and Failure Classification 
  • Special Devices (MEMS, Optoelectronics, Passives) 
  • Fault Localization Techniques: Package Level (NDT) 
  • Die Level (Depackaging, Photon Emission, Microthermography, Laser-Based Methods, Particle Beam Methods) 
  • Deprocessing & Imaging Techniques: Deprocessing 
  • General Imaging Techniques 
  • Local Deprocessing & Imaging 
  • Circuit Edit and Design Modification 
  • Material Analysis Techniques 
  • Reference Information: Important Topics for Semiconductor Devices 
  • Failure Analysis Techniques Roadmap 
  • Failure Analysis Operations and Management 
  • Appendices: Failure Analysis Terms, Definitions, and Acronyms 
  • Industry Standards



 

  • Publisher: ASM International
  • Published: 2011
  • Pages: 674
  • ISBN: 978-1-61503-725-4