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Microelectronics Failure Analysis Desk Reference, 6th Ed (Book & CD set)
Editor: EDFAS Desk Reference Committee | Hardcover | Product code: 09110Z | ISBN: 978-1-61503-725-4
Classified as: Microelectronic Failure Analysis
Price: $199.00 Member Price: $149.00
Comprehensive guide to the process and test methods used for electronic device failure analysis. Contains dozens of articles—contributed by industry experts—covering a wide range of topics involving the failure analysis of microelectronics. It places the most important and up-to-date information on this subject at your fingertips.
Topic coverage includes:
- Failure Analysis Process Flow
- Failure Verification
- Failure Modes and Failure Classification
- Special Devices (MEMS, Optoelectronics, Passives)
- Fault Localization Techniques: Package Level (NDT)
- Die Level (Depackaging, Photon Emission, Microthermography, Laser-Based Methods, Particle Beam Methods)
- Deprocessing & Imaging Techniques: Deprocessing
- General Imaging Techniques
- Local Deprocessing & Imaging
- Circuit Edit and Design Modification
- Material Analysis Techniques
- Reference Information: Important Topics for Semiconductor Devices
- Failure Analysis Techniques Roadmap
- Failure Analysis Operations and Management
- Appendices: Failure Analysis Terms, Definitions, and Acronyms
- Industry Standards
- Publisher: ASM International
- Published: 2011
- Pages: 674
- ISBN: 978-1-61503-725-4
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Materials Testing and Evaluation | Microelectronic Failure Analysis