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Planar Analysis of Copper-Aluminium Intermetallics

Author: G.M. O'Halloran, Arjan van Ijzerloo, Rene Rongen, Frank Zachariasse, NXP Semiconductors   |   Document Download   |   Product code: ZCP2013ISTFA2PA297

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Classified as: Aluminum Batteries and Energy Storage ...more

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This paper presents a quick, reliable, and fully quantitative method of measuring the intermetallic coverage of copper to aluminium bonding at time zero and post reliability stressing. This method is currently used in select manufacturing quality control processes, as well as during product release procedures. By applying this measurement method after various life-tests, it has been possible to collect information on degradation in the copper aluminium system which is currently being used to make a model of the corrosion mechanism in the copper aluminium system.
  • From: ISTFA 2013: Conference Proceedings from the 39th International Symposium for Testing and Failure Analysis (ASM International)
  • Publisher: ASM International
  • Published: November 01, 2013
  • Pages: 4
  • Review Type: Peer reviewed