EV Group (EVG), Austria; and Dynaloy LLC, Indianapolis, Ind., a wholly owned subsidiary of Eastman Chemical Co., introduces CoatsClean, a single-wafer photoresist and residue removal technology. It is designed to address thick films and difficult-to-remove material layers for the 3D-ICs/through-silicon vias advanced packaging, microelectromechanical systems, and compound semiconductor markets. CoatsClean provides a complete wafer cleaning solution that offers significant efficiency, performance, and cost-of-ownership advantages over traditional resist stripping and post-etch residue removal methods.
The CoatsClean process and chemical formulation are engineered to function at higher temperatures, resulting in faster stripping rates and cycle times. This enables CoatsClean to operate as a single-wafer process for thick resist films and difficult-to-remove resists-resulting in improved performance, consistency, reproducibility, and repeatability. The engineered formulation also enables selective stripping of the resist.
CoatsClean is also unique in its ability to dispense a small amount of material on the top of the wafer, and then activate the material with direct heat. This direct utilization of the material and heat dramatically reduces the strip material used. CoatsClean uses fresh solution for each processed wafer compared to competing techniques that use an immersion bath-resulting in greater process efficiency and eliminating cross contamination. The highly selective application of resist strip material eliminates damage to the wafer backside. The entire CoatsClean process is performed in a single bowl, which reduces tool
The EVG301RS system targets research and development, as well as low-volume production on substrates up to 300 mm in diameter, while the EVG320RS XT features up to eight process modules to address high-volume production requirements on substrates up to 300 mm in diameter. The systems are highly modular in design to allow for a wide range of configurations and combinations of chemicals.
