Aehr Test Systems, Fremont, Calif., has received the first order for its Fox-XP wafer level test and burn-in system, including multiple Fox-XP WaferPak contactors and application development services. The system is the company’s next-generation multi-wafer test solution that is capable of functional test and burn-in/cycling of flash memories, microcontrollers, sensors, and other leading-edge ICs in wafer form before they are assembled into single or multi-die stacked packages.
These singulated die or single-die or stacked-die packaged parts can then be used for high reliability and quality applications such as enterprise solid state drives, automotive devices, highly valuable mobile applications, and mission critical integrated circuits and sensors.
The Fox-XP system utilizes Aehr Test’s Fox WaferPak contactor, which provides a cost-effective solution for making electrical contact with a full wafer or substrate in a multi-wafer environment. These contactors contain up to tens of thousands of probes to contact all devices on wafers and substrates up to 300 mm diameter simultaneously. The Fox-XP system is being developed in configurations up to 25 wafers in parallel in a single system to operate within an efficient manufacturing space footprint.
“This first FOX-XP engineering system and several WaferPak contactors will be used for reliability and qualification test of devices intended for a very high volume application,” says Gayn Erickson, President and CEO. “We believe this initial order represents a significant new opportunity for our Fox-XP multi-wafer production system as this device moves into high volume manufacturing with wafer level burn-in. The system was purchased for this application due to the significant number of resources and power capability that this system and our Fox WaferPak contactors are capable of handling.”
