FEI Company, Hillsboro, Ore., introduced in July 2013, two new DualBeam systems that feature innovative detection suites that provide high-quality imaging and fast analysis over the broadest range of samples. The new Scios DualBeam is specifically positioned for fast two-dimensional (2D) and three-dimensional (3D) characterization. The Helios NanoLab 660 DualBeam adds capabilities for specialized applications, such as the fabrication of prototypes for nanometer-scale devices.
“These new systems make it easier to image challenging materials,” said Trisha Rice, vice president and general manager of FEI’s Materials Science Business Unit. “Their new detectors are able to reveal the subtle details in surface contrast. The electron optics innovations in Scios make it especially powerful for investigation of challenging materials, like insulating or magnetic materials. The Helios NanoLab 660, with its advanced combination of patterning engine, MultiChem gas delivery system, and Tomahawk™ ion optics, provides unprecedented capabilities for fabricating prototypes of complex nanodevices, enabling researchers to pioneer developments in devices like antennas and nanofluidic systems.”
Rice added, “The DualBeam focused ion beam/scanning electron microscope (FIB/SEM) has long been the standard for preparation of ultrathin samples for transmission electron microscopy (TEM). TEM usage is growing rapidly as researchers seek to understand structure-function relationships down to the atomic level. These new DualBeam instruments are designed to support efficient TEM workflows by producing samples that meet any TEM application requirement, from nanoscale analysis to atomic resolution imaging. This tight integration will become even more apparent in coming TEM product launches–stay tuned.”
For researchers working with materials that are difficult to image without coatings or preparation, the Scios offers technology innovations to mitigate these challenges. The new electron column is designed to handle characterization routines for both magnetic and non-magnetic samples. Its high-current capability provides fast X-ray analysis and can also be used to improve FIB milling accuracy on non-conductive samples by neutralizing accumulated charge.
Image caption – FEI’s new DualBeam systems: Scios (left) and Helios (right)
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Sandy Fewkes
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