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New software for eddy current array and bond testing instrument

Olympus Corp., Tokyo, added new software and solutions for the eddy current array and bond testing modules used with the field-proven OmniScan MX flaw detector. To meet the requirements of a broader range of applications, conventional eddy current testing (ECT), eddy current array (ECA), and the new bond testing (BT) C-scan technology are available with the two module versions. Both modules are compatible with the redesigned MXE (ECT/ECA) and MXB (BT C-scan) software, providing easy transition between technologies and a short learning curve.

 

The OmniScan MX in eddy current array (ECA) mode is able to perform inspections through thin coatings on conductive material, without the need to remove and reapply paint or coating. Additional benefits include cost-savings, instant inspection results, reduced turnaround time, and chemical-free inspections. The MXE 3.0 ECA software also features a range of color-palette representations that replicate the look of traditional NDT methods and facilitate the intuitive display of ECA signals.

 

OmniScan MX ECA with its newly redesigned, intuitive interface and data cursors features integrated data-storage, analysis, and reporting functionalities that enable the inspector to review individual defect indications and apply corrections as needed.

 

The new C-scan bond testing (BT) technology on instrument is ideal for honeycomb composite inspections. The MX BT software is dedicated exclusively to the bond testing C-scan solution and features the same user-friendly interface as the MXE software to help minimize the learning curve.

 

OmniScan MX is used throughout the world and is a field-proven, reliable instrument built to withstand harsh and demanding inspection conditions. Compact and lightweight, its two Li-ion batteries provide up to six hours of manual or semi-automated inspection time. The highly legible 8.4 in. (213 mm) real-time color display of the OmniScan MX enables viewing of defects and details under any light conditions.

 

The software comprising eddy current array, conventional eddy current, and bond testing technologies along with improved software features makes the OmniScan MX a unique nondestructive testing instrument for applications in the aerospace and oil and gas industries.

 

More information:

Olympus Corp.  

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