Applied Materials Inc., Santa Clara, Calif., announces the SEMVision G6, a suite of new defect review and classification technologies for its SEMVision family of products to accelerate time to yield for chip manufacturing at 1X-nm and beyond. The system combines 30% higher resolution and multi-dimensional imaging capabilities with the Purity Automatic Defect Classification system. Its advanced detection assembly and sophisticated processing make possible high-quality topographical images of tiny and shallow defects
The system’s resolution is a 30% improvement over the previous generation, making it the highest available in the industry. This capability and the system’s unique e-beam tilt angle make the G6 the industry’s superior, field-proven DR SEM for finding, identifying and analyzing defects in 3D FinFET and high aspect ratio structures at 1Xnm nodes.
High dynamic range detection, collection of back-scattered electrons, and energy filtering enable high aspect ratio imaging. High-energy imaging makes possible “see through” penetration that reveals defects in underlying layers. The Purity ADC’s dynamic machine learning algorithms analyze and classify defects, ensuring accuracy, quality and consistency to enable stable process control and rapid and reliable excursion detection.
