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Leica DM3 XL microscope system inspects wafers fast with 30% larger field of view

June 19, 2017
Source: ASM International

Leica Microsystems Inc., Buffalo Grove, Ill., has developed the DM3 XL microscope inspection system for defect and failure analysis in the microelectronics and semiconductor industry. The system offers a unique macro objective with a 35.7 mm field of view – 30% more than with conventional scanning objectives. Operators can easily scan large components up to six inches in diameter rapidly, and detect defects fast. Insufficient development at the edge or within the center of a wafer, as well as uneven radial film thicknesses, can be made visible.

For various sample sizes types, the DM3 XL system offers a choice of different stage inserts such as metal inserts, wafer holders, or mask holders. Operators can easily locate the samples and areas of interest on the stage. The 150 x 150 mm stage offers the possibility for quick coarse or fine stage positioning.

Because comfortable working conditions lead to higher efficiency and better quality, Leica has designed a highly user-friendly operation concept. With easily reachable controls, users can leave their eyes on the sample and hands on the microscope while switching contrast techniques or illumination. With integrated LED illumination, the DM3 XL system provides a constant color temperature and offers real color imaging at all intensity levels. 

It is easy to upgrade by choosing a dedicated software module and a microscope camera for efficient and high-quality analysis and documentation. Simplifying the basic setting of resolution, contrast, and depth of field, the Color Coded Diaphragm Assistant (CCDA) helps to speed up the work and minimize operational errors. Straightforward and intuitive functionality allows optimal results faster. 


Subject Classifications

Industries and Applications | Electronics

Materials Testing and Evaluation | Failure Analysis

Materials Testing and Evaluation | Materials Characterization

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