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EV Group to expand manufacturing facility for wafer bonding, lithography equipment
May 21, 2018
Source: ASM International
EV Group, Austria, has started construction work for its Manufacturing III facility, the next expansion phase of its corporate headquarters. The new building will more than double the floor space for the final assembly of its wafer bonding and lithography equipment systems.
“With our innovative manufacturing solutions for the high-tech industry, as well as new biomedical applications, we operate in very dynamic markets with great future prospects,” says Dr. Werner Thallner, executive operations and financial director at EV Group. “In light of the high capacity utilization in all areas of our existing facilities, as well as the positive market outlook, we decided to implement our plans for building our Manufacturing III facility this year. This will support our long-term growth targets at our corporate headquarters.”
The new Manufacturing III building, adjacent to the new test room site that was opened just a few months ago, will be built next to the river Inn. The ultramodern building will provide approximately 4800 square meters of additional space in total, which will benefit not only manufacturing, but also other departments as well. In addition to an expansion of warehouse space, a new delivery area with a dedicated packaging site designed for cleanroom equipment will be created, along with an airfreight security zone and new truck loading docks for the shipment of the completed systems to EVG’s worldwide customers. The construction of the new Manufacturing III building is set to be completed in early 2019.
Industries and Applications | Electronics