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DualBeam FIB-SEM microscope for semiconductors includes new feedback systems

March 22, 2019
Source: ASM International

Thermo Fisher Scientific, Waltham, Mass., introduces its latest and most advanced focused ion beam scanning electron microscope (FIB-SEM) for nanometer-scale materials characterization and analysis: the Thermo Scientific Helios 5 DualBeam microscope.


The instrument will be available in HX, FX, and UX configurations, which address a broad range of industrial and research challenges. The FX and HX configurations are particularly focused on the needs of semiconductor manufacturers, fabless chip designers, materials researchers, and analytical labs.


“The new feedback systems and neural network-based software in the Helios 5 microscope delivers productivity, repeatability, and ease-of-use that will help our semiconductor customers deliver the devices needed to advance new technologies,” says Mike Shafer, president, materials and structural analysis at Thermo Fisher Scientific.


The Helios 5 microscope addresses the increasing number of semiconductor technological challenges, including the need to develop products using smaller geometries, 3D structures, new materials, and higher volumes of analytical samples for yield enhancement and root cause analysis.


Compared to the previous generation, the Helios 5 microscope improvements provide greater stability and ease of use, which can help reduce the operator expertise needed. Operator training may be reduced from months to days and is designed to enable all operators to achieve consistent, repeatable results on a wide variety of advanced applications. These productivity improvements produce a higher volume of high-quality samples, allowing customers to accelerate both their yield ramp and excursion resolution.

Subject Classifications

Industries and Applications | Electronics

Industries and Applications | Nanotechnology

Materials Testing and Evaluation | Failure Analysis

Materials Testing and Evaluation | Material Selection

Materials Testing and Evaluation | Materials Characterization

Materials Testing and Evaluation | Microelectronic Failure Analysis

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