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SkyWater selects Veeco’s Waferstorm for 3D monolithic system-on-a-chip development
May 17, 2019
Source: ASM International
Veeco Instruments Inc., Plainview, N.Y., announces that SkyWater Technology Foundry has taken delivery of the WaferStorm single wafer wet process system to support advanced development work for the design and fabrication of next-generation 3D monolithic System-on-a-Chip (3DSoC) technology.
The most advanced U.S.-based and solely U.S.-owned Technology Foundry, SkyWater is leveraging the process performance and production capabilities of WaferStorm to create densely integrated logic and memory products. Using breakthrough 3DSoC technology, SkyWater is collaborating with researchers at the Massachusetts Institute of Technology to set a new threshold for device performance and energy efficiency.
“Our selection of the WaferStorm system was based on Veeco’s reputation of delivering best-in-class technology for wet processing that enables many leading-edge applications,” stated Gregg Damminga, Vice President of Technology Development, SkyWater. “The solvent-based platform offers a precise level of control during wafer processing which is essential to the innovations we are working on with MIT to develop technology that drives better performing devices at lower cost.”
WaferStorm’s unique ImmJET solvent technology provides customers with the best overall process performance, flexibility, and production capability in its class compared to conventional batch or spray-only approaches. It offers proven, reliable solutions for metal lift-off (MLO), photoresist strip, dry film resist strip, via cleans, flux removal, and other advanced packaging processes. It is also the production tool of record for MLO at several leading vertical-cavity surface-emitting laser (VCSEL) manufacturers today.
Industries and Applications | Electronics