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May 28, 2018Lindberg MPH, Riverside, Mich., announces the shipment of a gas-fired aluminum stack melting and holding furnace to a manufacturer of recreational vehicles.
May 24, 2018Carl Zeiss, Germany, introduces Zen Connect, new software modules with enhanced imaging technology that is especially useful for structural analysis.
May 24, 2018Thermo Scientific, Hillsboro, Oregon, has developed the Apreo scanning electron microscope, which features a revolutionary compound lens design that combines electrostatic and magnetic immersion technology to yield unprecedented resolution and signal selection.
May 22, 2018Oxford Instruments, U.K., offers LayerProbe, a software tool for thin film analysis in the SEM that is said to be faster and more cost-effective, with higher resolution than dedicated thin film measurement tools.
May 21, 2018Cohu Inc., Poway, Calif., and Xcerra Corp., Norwood, Mass., have entered into a definitive merger agreement pursuant to which Cohu will acquire Xcerra for a combination of cash and stock.
May 21, 2018The Semiconductor Industry Association, Washington, announces that worldwide sales of semiconductors reached $111.1 billion during the first quarter of 2018, an increase of 20 percent compared to the first quarter of 2017, but 2.5 percent less than the fourth quarter of 2017.
May 21, 2018Adesto Technologies, Santa Clara, Calif., a provider of innovative application-specific semiconductors for the IoT era, announces that it has acquired Dublin-based S3 Semiconductors, a global supplier of mixed-signal and RF application specific integrated circuits (ASIC) and an extensive library of design IP.
May 21, 2018EV Group, Austria, has started construction work for its Manufacturing III facility, the next expansion phase of its corporate headquarters.
May 21, 2018Semtech Corp., Camarillo, Calif., has acquired substantially all the assets of IC Interconnect Inc., Colorado Springs, Colo., which provides contract wafer bumping and related services to the electronics industry.