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February 24, 2018Edax Inc., Mahwah, N.J., introduces the latest revision of its Apex analysis software, which was developed to ensure high-quality results that accelerate and simplify compositional analysis.
February 23, 2018Global Foundries, Santa Clara, Calif., announces that its 45nm RF SOI (45RFSOI) technology platform has been qualified and is ready for volume production.
February 23, 2018Olympus, Japan, has developed the MX63 series, which provides MIX observation technology that produces unique observation images by combining darkfield with another observation method, such as brightfield, fluorescence, or polarization.
February 22, 2018Seco Warwick, Meadville, Pa., announces that it has implemented the cloud-based Microsoft Dynamics 365 for Finance and Operations system.
February 22, 2018Ipsen, Cherry Valley, Ill., recently designed and built a vertical high-pressure quenching furnace, complete with twin cooling systems and a work volume of 350 cubic feet.
February 22, 2018Wisconsin Oven Corp., East Troy, Wis., guarantees temperature uniformity of ±10°F at 775°F and 1075°F for its electrically heated standard horizontal aluminum quench systems.
February 22, 2018ASTM International, West Conshohocken, Pa., announces F3301 - 18 Standard Specification for Thermal Post-Processing Metal Parts Made Via Powder Bed Fusion.
February 22, 2018Solar Manufacturing Inc., Souderton, Pa., is relocating its headquarters to Sellersville, also in Pennsylvania, where it will build a facility that includes 40,000 square feet for manufacturing and 17,500 square feet for office space.
February 08, 2018This profile series introduces leading materials scientists from around the world who happen to be females. Here we speak with Jan Edwards, engineering faculty at College of Lake County, Grayslake, Ill., and winner of the 2017 Allan Ray Putnam Service Award.
February 06, 2018Thermo Scientific, Madison, Wis., introduces the Genesys family of automated, robust UV-Visible spectrophotometers, which are accessible, network-ready, and designed to meet expectations for advanced technology in a compact package.