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Superheat’s heat-treating software and advanced equipment cut labor costs by 40%

October 27, 2017

Superheat, Chicago, introduces Superheat Smartway, its heat treatment solution that is said to reduce costs, save time, minimize risk, and improve quality.

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Timken Endurance SBQ steels offer ultrahigh strength and toughness for longer gear life

October 27, 2017

Timken Steel, Canton, Ohio, introduces Endurance steels, a new family of special bar quality steels comprised of both Timken Steel's existing high-strength and/or high-toughness grades, and three new ultra-high-strength, high-toughness steels.

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ATM hardness tester with overview camera enables high-quality optical measurement

October 27, 2017

ATM Advanced Materialography, Germany, announces that the high-quality optical measuring system of its automatic hardness tester Carat 950 has been enhanced by overview optics integrated into the revolver.

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Ames Lab receives $392,000 from DOE to commercialize gas atomization nozzle design

October 25, 2017

The U.S. Department of Energy's Ames Laboratory, Iowa, has received $392,000 in funding to commercialize a gas atomization nozzle design for producing metal powders for manufacturing.

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Carbon nanotube fiber antennas work as well as copper at 20 times lower weight

October 24, 2017

Rice University, Houston, announces that its researchers have determined that fibers made of carbon nanotubes configured as wireless antennas can be as good as copper antennas but 20 times lighter.

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Picosun’s ALD nanolaminates improve lifetime and reliability of electronic circuit boards

October 24, 2017

Picosun Oy, Finland, reports that it has developed atomic layer deposition technology in which nanolaminates specifically tailored to form dense, conformal, and hermetic seals are deposited on printed circuit board assemblies (PCBA).

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Hamamatsu acquires Energetiq for its high-brightness light sources for wafer inspection

October 23, 2017

Hamamatsu Photonics KK, Japan, announces an agreement to acquire Energetiq Technology Inc., Woburn, Mass., for its laser-driven light sources and extreme-ultraviolet light sources.

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Samsung completes qualification of 8nm LPP process

October 23, 2017

Samsung Electronics Co. Ltd., South Korea, announces that 8nm FinFET process technology, 8LPP (Low Power Plus), has been qualified and is ready for production.

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